Delay Measurements and Self Characterisation on FPGAs

This thesis examines new timing measurement methods for self delay characterisation of Field-Programmable Gate Arrays (FPGAs) components and delay measurement of complex circuits on FPGAs. Two novel measurement techniques based on analysis of a circuit's output failure rate and transition probability is proposed for accurate, precise and efficient measurement of propagation delays. The transition probability based method is especially attractive, since it requires no modifications in the circuit-under-test and requires little hardware resources, making it an ideal method for physical delay analysis of FPGA circuits. The relentless advancements in process technology has led to smaller and denser transistors in integrated circuits. While FPGA users benefit from this in terms of increased hardware resources for more complex designs, the actual productivity with FPGA in terms of timing performance (operating frequency, latency and throughput) has lagged behind the potential improvements from the improved technology due to delay variability in FPGA components and the inaccuracy of timing models used in FPGA timing analysis. The ability to measure delay of any arbitrary circuit on FPGA offers many opportunities for on-chip characterisation and physical timing analysis, allowing delay variability to be accurately tracked and variation-aware optimisations to be developed, reducing the productivity gap observed in today's FPGA designs. The measurement techniques are developed into complete self measurement and characterisation platforms in this thesis, demonstrating their practical uses in actual FPGA hardware for cross-chip delay characterisation and accurate delay measurement of both complex combinatorial and sequential circuits, further reinforcing their positions in solving the delay variability problem in FPGAs

A built-in self-test technique for high speed analog-to-digital converters

Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Conception pour la testabilité des systèmes biomédicaux implantables

Architecture générale des systèmes implantables -- Principes de stimulation électrique -- Champs d'application des systèmes implantables -- Les particularités des circuits implantables -- Tendance future -- Conception pour la testabilité de la partie numérique des circuits implantables -- "Desigh and realization of an accurate built-in current sensor for Iddq testing and power dissipation measurement -- Conception pour la testabilité de la partie analogique des circuits implantables -- BIST for digital-to-analog and Analogo-to-digital converters -- Efficient and accurate testing of analog-to-digital converters using oscillation test method -- Design for testability of Embedded integrated operational amplifiers -- Vérification des interfaces bioélectroniques des systèmes implantables -- Monitorin the electrode and lead failures in implanted microstimulators and sensors -- Capteurs de température intégrés pour la vérification de l'état thermique des puces dédiées -- Built-in temperature sensors for on-line thermal monitoring of microelectronic structures -- Un protocole de communication fiable pour la programmation et la télémétrie des système implantables -- A reliable communication protoco for externally controlled biomedical implanted devices

A time-based approach for multi-GHz embedded mixed-signal characterization and measurement /

The increasingly more sophisticated systems that are nowadays implemented on a single chip are placing stringent requirements on the test industry. New test strategies, equipment, and methodologies need to be developed to sustain the constant increase in demand for consumer and communication electronics. Techniques for built-in-self-test (BIST) and design-for-test (DFT) strategies have been proven to offer more feasible and economical testing solutions.Previous works have been conducted to perform on-chip testing, characterization, and measurement of signals and components. The current thesis advances those techniques on many levels. In terms of performance, an increase of more than an order of magnitude in speed is achieved. 70-GHz (effective sampling) on-chip oscilloscope is reported, compared to 4-GHz and 10-GHz ones in previous state-of-the-art implementations. Power dissipation is another area where the proposed work offer a superior solution compared to previous alternatives. All the proposed circuits do not exceed a few milliWatts of power dissipation, while performing multi-GHz high-speed signal capture at a medium resolution. Finally, and possibly most importantly, all the proposed circuits for test rely on a different form of signal processing; the time-based approach. It is believed that this approach paves the path to a lot of new techniques and circuit design skills that can be investigated more deeply. As an integral part of the time-based processing approach for GHz signal capture, this thesis verifies the advantages of using time amplification. The use of such amplification in the time domain is materialized with experimental results from three specific integrated circuits achieving different tasks in GHz high-speed in-situ signal measurement and characterization. Advantages of using such time-based approach techniques, when combined with the use of a front-end time amplifier, include noise immunity, the use of synthesizable digital cells, and circuit building blocks that track the technology scaling in terms of area and speed

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Ultra Low Power IEEE 802.15.4/ZIGBEE Compliant Transceiver

Low power wireless communications is the most demanding request among all wireless users. A battery life that can survive for years without being replaced, makes it realistic to implement many applications where the battery is unreachable (e.g. concrete walls) or expensive to change (e.g underground applications). IEEE 802.15.4/ZIGBEE standard is published to cover low power low cost applications, where the battery life can last for years, because of the 1% duty cycle of operation. A fully integrated 2.4GHz IEEE802.15.4 Compliant transceiver suitable for low power, low cost ZIGBEE applications is implemented. Direct conversion architecture is used in both Receiver and Transmitter, to achieve the minimum possible power and area. The chip is fabricated in a standard 0.18um CMOS technology. In the transmit mode, the transmitter chain (Modulator to PA) consumes 25mW, while in the receive mode, the iv receiver chain (LNA to Demodulator) consumes 5mW. The Integer-N Frequency Synthesizer consumes 8.5mW. Other Low power circuits are reported; A 13.56 Passive RFID tag and a low power ADC suitable for Built-In-Testing applications

Design of electronic systems for automotive sensor conditioning

This thesis deals with the development of sensor systems for automotive, mainly targeting the exploitation of the new generation of Micro Electro-Mechanical Sensors (MEMS), which achieve a dramatic reduction of area and power consumption but at the same time require more complexity in the sensor conditioning interface. Several issues concerning the development of automotive ASICs are presented, together with an overview of automotive electronics market and its main sensor applications. The state of the art for sensor interfaces design (the generic sensor interface concept), consists in sharing the same electronics among similar sensor applications, thus saving cost and time-to-market but also implementing a sub-optimal system with area and power overheads. A Platform Based Design methodology is proposed to overcome the limitations of generic sensor interfaces, by keeping the platform generality at the highest design layers and pursuing the maximum optimization and performances in the platform customization for a specific sensor. A complete design flow is presented (up to the ASIC implementation for gyro sensor conditioning), together with examples regarding IP development for reuse and low power optimization of third party designs. A further evolution of Platform Based Design has been achieved by means of implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform. ISIF is a highly programmable mixed-signal chip which allows a substantial reduction of design space exploration time, as it can implement in a short time a wide class of sensor conditioning architectures. Thus it lets the designers evaluate directly on silicon the impact of different architectural choices, as well as perform feasibility studies, sensor evaluations and accurate estimation of the resulting dedicated ASIC performances. Several case studies regarding fast prototyping possibilities with ISIF are presented: a magneto-resistive position sensor, a biosensor (which produces pA currents in presence of surface chemical reactions) and two capacitive inertial sensors, a gyro and a low-g YZ accelerometer. The accelerometer interface has also been implemented in miniboards of about 3 cm2 (with ISIF and sensor dies bonded together) and a series of automatic trimming and characterization procedures have been developed in order to evaluate sensor and interface behaviour over the automotive temperature range, providing a valuable feedback for the implementation of a dedicated accelerometer interface

Design of frequency synthesizers for short range wireless transceivers

The rapid growth of the market for short-range wireless devices, with standards such as Bluetooth and Wireless LAN (IEEE 802.11) being the most important, has created a need for highly integrated transceivers that target drastic power and area reduction while providing a high level of integration. The radio section of the devices designed to establish communications using these standards is the limiting factor for the power reduction efforts. A key building block in a transceiver is the frequency synthesizer, since it operates at the highest frequency of the system and consumes a very large portion of the total power in the radio. This dissertation presents the basic theory and a design methodology of frequency synthesizers targeted for short-range wireless applications. Three different examples of synthesizers are presented. First a frequency synthesizer integrated in a Bluetooth receiver fabricated in 0.35μm CMOS technology. The receiver uses a low-IF architecture to downconvert the incoming Bluetooth signal to 2MHz. The second synthesizer is integrated within a dual-mode receiver capable of processing signals of the Bluetooth and Wireless LAN (IEEE 802.11b) standards. It is implemented in BiCMOS technology and operates the voltage controlled oscillator at twice the required frequency to generate quadrature signals through a divide-by-two circuit. A phase switching prescaler is featured in the synthesizer. A large capacitance is integrated on-chip using a capacitance multiplier circuit that provides a drastic area reduction while adding a negligible phase noise contribution. The third synthesizer is an extension of the second example. The operation range of the VCO is extended to cover a frequency band from 4.8GHz to 5.85GHz. By doing this, the synthesizer is capable of generating LO signals for Bluetooth and IEEE 802.11a, b and g standards. The quadrature output of the 5 - 6 GHz signal is generated through a first order RC - CR network with an automatic calibration loop. The loop uses a high frequency phase detector to measure the deviation from the 90° separation between the I and Q branches and implements an algorithm to minimize the phase errors between the I and Q branches and their differential counterparts

Methodology and Ecosystem for the Design of a Complex Network ASIC

Performance of HPC systems has risen steadily. While the 10 Petaflop/s barrier has been breached in the year 2011 the next large step into the exascale era is expected sometime between the years 2018 and 2020. The EXTOLL project will be an integral part in this venture. Originally designed as a research project on FPGA basis it will make the transition to an ASIC to improve its already excelling performance even further. This transition poses many challenges that will be presented in this thesis. Nowadays, it is not enough to look only at single components in a system. EXTOLL is part of complex ecosystem which must be optimized overall since everything is tightly interwoven and disregarding some aspects can cause the whole system either to work with limited performance or even to fail. This thesis examines four different aspects in the design hierarchy and proposes efficient solutions or improvements for each of them. At first it takes a look at the design implementation and the differences between FPGA and ASIC design. It introduces a methodology to equip all on-chip memory with ECC logic automatically without the user’s input and in a transparent way so that the underlying code that uses the memory does not have to be changed. In the next step the floorplanning process is analyzed and an iterative solution is worked out based on physical and logical constraints of the EXTOLL design. Besides, a work flow for collaborative design is presented that allows multiple users to work on the design concurrently. The third part concentrates on the high-speed signal path from the chip to the connector and how it is affected by technological limitations. All constraints are analyzed and a package layout for the EXTOLL chip is proposed that is seen as the optimal solution. The last part develops a cost model for wafer and package level test and raises technological concerns that will affect the testing methodology. In order to run testing internally it proposes the development of a stand-alone test platform that is able to test packaged EXTOLL chips in every aspect