Phase and amplitude pre-emphasis techniques for low-power serial links

A novel approach to equalization of high-speed serial links combines both amplitude pre-emphasis to correct for intersymbol interference and phase pre-emphasis to compensate for deterministic jitter, in particular, data-dependent jitter. Phase pre-emphasis augments the performance of low power transmitters in bandwidth-limited channels. The transmitter circuit is implemented in a 90-nm bulk CMOS process and reduces power consumption by pushing CMOS static logic to the output stage, a 4:1 output multiplexer. The received signal jitter over a cable is reduced from 16.15 ps to 10.29 ps with only phase pre-emphasis at the transmitter. The jitter is reduced by 3.6 ps over an FR-4 backplane interconnect. A transmitter without phase pre-emphasis consumes 18 mW of power at 6Gb/s and 600mVpp output swing, a power budget of 3mW/Gb/s, while a transmitter with phase pre-emphasis consumes 24mW, a budget of 4 mW/Gb/s

Utilizing the Digital Fingerprint Method for Secure Key Generation

This research examines a new way to generate an uncloneable secure key by taking advantage of the delay characteristics of individual transistors. The user profiles the circuit to deduce the glitch count of each output line for each number of selectable buffers added to the circuit. The user can then use this information to generate a specific glitch count on each output line, which is passed to an encryption algorithm as its key. The results detail tests of two configurations for adding a selectable amount of buffers into each glitch circuit in order to induce additional delay. One configuration adds up to seven buffers that is equivalent to the binary digits used on the three SELECT lines of a multiplexer. The second, referred to as the cascaded design, has eight different quantities of selectable buffers, but they all connect to one multiplexer. Each successive line connects to the previous line and adds a certain number of buffers. The linear selection implementation produces almost 15% more usable output lines over the cascaded design, where a usable line is defined as one that has at least one ‘1’ and one ‘0’ glitch count in response to every buffer count. Tests were also performed to determine the optimal number of buffers added to each output using the linear buffer selection configuration. Using three input bits to the buffer unit produced 30.94% usable outputs. Four bits generated nearly 25% more usable outputs, while the use of six bits gave less than a 5% improvement over four bits. The average repeatability of the glitch count is 94.85% using this method. The overall distinguishability of the generated glitch counts for each output line is 10.46%

Delay characterization in FPGA-based reconfigurable systems

Runtime reconfigurable architectures accelerate the operation of a standard processor core by hardware accelerators implemented in Field Programmable Gate Arrays (FPGAs). Partial runtime reconfiguration allows the hardware accelerators to efficiently adapt to different computational tasks dynamically. Nowadays, the FPGAs from major vendors, such as Xilinx and Altera, support this feature, including the Xilinx Virtex-5 FPGA family which is the implementation platform of this work. Manufactured at 28 nm scaled technological node or lower, concerns rise about the impact of aging-related failure mechanisms on the modern generations of FPGAs. To detect degradation in the reconfigurable gate arrays, dedicated on- and offline test methods must be employed in the field. Design for dependability requires that the degradation is detected and localized, so that the degraded logic elements will not be used as a first choice in the reconfiguration. This thesis presents the development and the evaluation of a delay characterization method for FPGA CLBs which comprise most of the FPGA logic elements. The purpose of FPGA delay characterization method in this work is to detect and localize the delay variance. This delay variance information may be used for achieving a speed optimized reconfiguration for a FPGA-based runtime system. Different delay characterization methods have been studied in this thesis for determining a suitable method to be implemented in the partial reconfigurable system. The delay characterization is performed in a part of area in the FPGA before a module is placed in this area to avoid the degraded portion. This thesis uses low level hardware description language to generate the fine-grained measurement units which can cover the target area. VHDL is used to generate the test wrapper, control circuit, and the circuit for communicating between the FPGA and the workstation. Several measurement techniques are used to evaluate the accuracy of the delay characterization method. Additionally, this thesis evaluates the temperature influence on the delay characterization. The results show that this delay characterization method can compare the speed of logic elements in the partial runtime reconfiguration area with high accuracy. The degradation can be detected and localized. The results also show that this method can be adapted to different size and location, fitting in the partial runtime reconfigurable design. Twelve configurations are required to have a full coverage of all the CLBs in the area under test

Hardware, Software and Data Analysis Techniques for SRAM-Based Field Programmable Gate Array Circuits

This work presents a built, tested, and demonstrated test structure that is low-cost, flexible, and re-usable for robust radiation experimentation, primarily to investigate memory, in this case SRAMs and SRAM-based FPGAs. The space environment can induce many kinds of failures due to radiation effects. These failures result in a loss of money, time, intelligence, and information. In order to evaluate technologies for potential failures, a detailed test methodology and associated structure are required. In this solution, an FPGA board was used as the controller platform, with multiple VHDL circuit controllers, data collection and reporting modules. The structure was demonstrated by programming an SRAM-based FPGA board as the device under test (DUT) with various types of adders, counters and RAM modules. The controllers, hardware, and data collection operations were tested and validated using gamma radiation from a Co-60 source at the Ohio State University Nuclear Reactor to irradiate the DUT. The test structure is easily modified to allow for a broad range of experiments on the same DUT. In addition, this structure is easily adaptable for other memory types, such as DRAM, FlashRam, and MRAM. These additions will be discussed further in this document. The system fits in a backpack and costs less than $1000

Implementation of arithmetic primitives using truly deep submicron technology (TDST)

The invention of the transistor in 1947 at Bell Laboratories revolutionised the electronics industry and created a powerful platform for emergence of new industries. The quest to increase the number of devices per chip over the last four decades has resulted in rapid transition from Small-Scale-Integration (SSI) and Large-Scale-lntegration (LSI), through to the Very-Large-Scale-Integration (VLSI) technologies, incorporating approximately 10 to 100 million devices per chip. The next phase in this evolution is the Ultra-Large-Scale-Integration (ULSI) aiming to realise new application domains currently not accessible to CMOS technology. Although technology is continuously evolving to produce smaller systems with minimised power dissipation, the IC industry is facing major challenges due to constraints on power density (W/cm2) and high dynamic (operating) and static (standby) power dissipation. Mobile multimedia communication and optical based technologies have rapidly become a significant area of research and development challenging a variety of technological fronts. The future emergence or 4G (4th Generation) wireless communications networks is further driving this development, requiring increasing levels of media rich content. The processing requirements for capture, conversion, compression, decompression, enhancement and display of higher quality multimedia, place heavy demands on current ULSI systems. This is also apparent for mobile applications and intelligent optical networks where silicon chip area and power dissipation become primary considerations. In addition to the requirements for very low power, compact size and real-time processing, the rapidly evolving nature of telecommunication networks means that flexible soft programmable systems capable of adaptation to support a number of different standards and/or roles become highly desirable. In order to fully realise the capabilities promised by the 4G and supporting intelligent networks, new enabling technologies arc needed to facilitate the next generation of personal communications devices. Most of the current solutions to meet these challenges are based on various implementations of conventional architectures. For decades, silicon has been the main platform of computing, however it is slow, bulky, runs too hot, and is too expensive. Thus, new approaches to architectures, driving multimedia and future telecommunications systems, are needed in order to extend the life cycle of silicon technology. The emergence of Truly Deep Submicron Technology (TDST) and related 3-D interconnection technologies have provided potential alternatives from conventional architectures to 3-D system solutions, through integration of IDST, Vertical Software Mapping and Intelligent Interconnect Technology (IIT). The concept of Soft-Chip Technology (SCT) entails integration of Soft• Processing Circuits with Soft-Configurable Circuits . This concept can effectively manipulate hardware primitives through vertical integration of control and data. Thus the notion of 3-D Soft-Chip emerges as a new design algorithm for content-rich multimedia, telecommunication and intelligent networking system applications. 3•D architectures (design algorithms used suitable for 3-D soft-chip technology), are driven by three factors. The first is development of new device technology (TDST) that can support new architectures with complexities of 100M to 1000M devices. The second is development of advanced wafer bonding techniques such as Indium bump and the more futuristic optical interconnects for 3-D soft-chip mapping. The third is related to improving the performance of silicon CMOS systems as devices continue to scale down in dimensions. One of the fundamental building blocks of any computer system is the arithmetic component. Optimum performance of the system is determined by the efficiency of each individual component, as well as the network as a whole entity. Development of configurable arithmetic primitives is the fundamental focus in 3-D architecture design where functionality can be implemented through soft configurable hardware elements. Therefore the ability to improve the performance capability of a system is of crucial importance for a successful design. Important factors that predict the efficiency of such arithmetic components are: • The propagation delay of the circuit, caused by the gate, diffusion and wire capacitances within !he circuit, minimised through transistor sizing. and • Power dissipation, which is generally based on node transition activity. [2] Although optimum performance of 3-D soft-chip systems is primarily established by the choice of basic primitives such as adders and multipliers, the interconnecting network also has significant degree of influence on !he efficiency of the system. 3-D superposition of devices can decrease interconnect delays by up to 60% compared to a similar planar architecture. This research is based on development and implementation of configurable arithmetic primitives, suitable to the 3-D architecture, and has these foci: • To develop a variety of arithmetic components such as adders and multipliers with particular emphasis on minimum area and compatible with 3-D soft-chip design paradigm. • To explore implementation of configurable distributed primitives for arithmetic processing. This entails optimisation of basic primitives, and using them as part of array processing. In this research the detailed designs of configurable arithmetic primitives are implemented using TDST O.l3µm (130nm) technology, utilising CAD software such as Mentor Graphics and Cadence in Custom design mode, carrying through design, simulation and verification steps

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Arithmetic logic UNIT (ALU) design using reconfigurable CMOS logic

Using the reconfigurable logic of multi-input floating gate MOSFETs, a 4-bit ALU has been designed for 3V operation. The ALU can perform four arithmetic and four logical operations. Multi- input floating gate (MIFG) transistors have been promising in realizing increased functionality on a chip. A multi- input floating gate MOS transistor accepts multiple inputs signals, calculates the weighted sum of all input signals and then controls the ON and OFF states of the transistor. This enhances the transistor function to more than just switching. This changes the way a logic function can be realized. Implementing a design using multi-input floating gate MOSFETs brings about reduction in transis tor count and number of interconnections. The advantage of bringing down the number of devices is that a design becomes area efficient and power consumption reduces. There are several applications that stress on smaller chip area and reduced power. Multi- input floating gate devices have their use in memories, analog and digital circuits. In the present work we have shown successful implementation of multi- input floating gate MOSFETs in ALU design. A comparison has been made between adders using different design methods w.r.t transistor count. It is seen that our design, implemented using multi-input floating gate MOSFETs, uses the least number of transistors when compared to other designs. The design was fabricated using double polysilicon standard CMOS process by MOSIS in 1.5mm technology. The experimental waveforms and delay measurements have also been presented