Measurements in 1149.4 environments - correcting the infrastructure switches influence

Measuring the values of discrete components frequently takes place during the test or debug phase of Printed Circuit Boards (PCB). This operation requires tools that are based on some access type. The shrinking geometries constrain the straightforward use of tools based on physical access. One of the aims of the IEEE1149.4 Std. is to facilitate those on-board measurements. This infrastructure relies on electronic access that includes high quality analog buses and a set of electronic switches, which enable to completely isolate a component under characterization, e.g. by injecting a known current and measuring the voltage across it. During this process, the infrastructure switches have a negative impact in the measurement accuracy. This paper analyses the measurement of one resistor in two situations: connected between a pin and ground and between two pins. The infrastructure switches that affect the measurement quality are identified and the upper limit of its systematic error is characterized. When the systematic error is completely defined then it is possible to remove its negative effect from the final result

Ultra Low Power IEEE 802.15.4/ZIGBEE Compliant Transceiver

Low power wireless communications is the most demanding request among all wireless users. A battery life that can survive for years without being replaced, makes it realistic to implement many applications where the battery is unreachable (e.g. concrete walls) or expensive to change (e.g underground applications). IEEE 802.15.4/ZIGBEE standard is published to cover low power low cost applications, where the battery life can last for years, because of the 1% duty cycle of operation. A fully integrated 2.4GHz IEEE802.15.4 Compliant transceiver suitable for low power, low cost ZIGBEE applications is implemented. Direct conversion architecture is used in both Receiver and Transmitter, to achieve the minimum possible power and area. The chip is fabricated in a standard 0.18um CMOS technology. In the transmit mode, the transmitter chain (Modulator to PA) consumes 25mW, while in the receive mode, the iv receiver chain (LNA to Demodulator) consumes 5mW. The Integer-N Frequency Synthesizer consumes 8.5mW. Other Low power circuits are reported; A 13.56 Passive RFID tag and a low power ADC suitable for Built-In-Testing applications

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Modelling methods for testability analysis of analog integrated circuits based on pole-zero analysis

Testability analysis for analog circuits provides valuable information for designers and test engineers. Such information includes a number of testable and nontestable elements of a circuit, ambiguity groups, and nodes to be tested. This information is useful for solving the fault diagnosis problem. In order to verify the functionality of analog circuits, a large number of specifications have to be checked. However, checking all circuit specifications can result in prohibitive testing times on expensive automated test equipment. Therefore, the test engineer has to select a finite subset of specifications to be measured. This subset of specifications must result in reducing the test time and guaranteeing that no faulty chips are shipped. This research develops a novel methodology for testability analysis of linear analog circuits based on pole-zero analysis and on pole-zero sensitivity analysis. Based on this methodology, a new interpretation of ambiguity groups is provided relying on the circuit theory. The testability analysis methodology can be employed as a guideline for constructing fault diagnosis equations and for selecting the test nodes. We have also proposed an algorithm for selecting specifications that need to be measured. The element testability concept will be introduced. This concept provides the degree of difficulty in testing circuit elements. The value of the element testability can easily be obtained using the pole sensitivities. Then, specifications which need to be measured can be selected based on this concept. Consequently, the selected measurements can be utilized for reducing the test time without sacrificing the fault coverage and maximizing the information for fault diagnosis

Development of Robust Analog and Mixed-Signal Circuits in the Presence of Process- Voltage-Temperature Variations

Continued improvements of transceiver systems-on-a-chip play a key role in the advancement of mobile telecommunication products as well as wireless systems in biomedical and remote sensing applications. This dissertation addresses the problems of escalating CMOS process variability and system complexity that diminish the reliability and testability of integrated systems, especially relating to the analog and mixed-signal blocks. The proposed design techniques and circuit-level attributes are aligned with current built-in testing and self-calibration trends for integrated transceivers. In this work, the main focus is on enhancing the performances of analog and mixed-signal blocks with digitally adjustable elements as well as with automatic analog tuning circuits, which are experimentally applied to conventional blocks in the receiver path in order to demonstrate the concepts. The use of digitally controllable elements to compensate for variations is exemplified with two circuits. First, a distortion cancellation method for baseband operational transconductance amplifiers is proposed that enables a third-order intermodulation (IM3) improvement of up to 22dB. Fabricated in a 0.13µm CMOS process with 1.2V supply, a transconductance-capacitor lowpass filter with the linearized amplifiers has a measured IM3 below -70dB (with 0.2V peak-to-peak input signal) and 54.5dB dynamic range over its 195MHz bandwidth. The second circuit is a 3-bit two-step quantizer with adjustable reference levels, which was designed and fabricated in 0.18µm CMOS technology as part of a continuous-time SigmaDelta analog-to-digital converter system. With 5mV resolution at a 400MHz sampling frequency, the quantizer's static power dissipation is 24mW and its die area is 0.4mm^2. An alternative to electrical power detectors is introduced by outlining a strategy for built-in testing of analog circuits with on-chip temperature sensors. Comparisons of an amplifier's measurement results at 1GHz with the measured DC voltage output of an on-chip temperature sensor show that the amplifier's power dissipation can be monitored and its 1-dB compression point can be estimated with less than 1dB error. The sensor has a tunable sensitivity up to 200mV/mW, a power detection range measured up to 16mW, and it occupies a die area of 0.012mm^2 in standard 0.18µm CMOS technology. Finally, an analog calibration technique is discussed to lessen the mismatch between transistors in the differential high-frequency signal path of analog CMOS circuits. The proposed methodology involves auxiliary transistors that sense the existing mismatch as part of a feedback loop for error minimization. It was assessed by performing statistical Monte Carlo simulations of a differential amplifier and a double-balanced mixer designed in CMOS technologies

NCPV FY 1998 Annual Report

This report summarizes the in-house and subcontracted research and development (R and D) activities under the National Center for Photovoltaics (NCPV) from October 1, 1997 through September 30, 1998 (FY 1998). The NCPV is part of the U.S. Department of Energy's (DOE's) National Photovoltaics Program, as described in the DOE National Photovoltaics Program Plan for 1996-2000. The mission of the DOE National Photovoltaics Program is to make PV a significant part of the domestic economy--as an industry and as an energy resource. The two primary goals of the national program are to (1) maintain the U.S. industry's world leadership in research and technology development and (2) help the U.S. industry remain a major, profitable force in the world market. The NCPV provides leadership and support to the national program toward achieving its mission and goals