Structural Software-Based Self-Test of Network-on-Chip

Abstract—Software-Based Self-Test (SBST) is extended to the switches of complex Network-on-Chips (NoC). Test patterns for structural faults are turned into valid packets by using satisfiability (SAT) solvers. The test technique provides a high fault coverage for both manufacturing test and online test

Multi-Cycle at Speed Test

In this research, we focus on the development of an algorithm that is used to generate a minimal number of patterns for path delay test of integrated circuits using the multi-cycle at-speed test. We test the circuits in functional mode, where multiple functional cycles follow after the test pattern scan-in operation. This approach increases the delay correlation between the scan and functional test, due to more functionally realistic power supply noise. We use multiple at-speed cycles to compact K-longest paths per gate tests, which reduces the number of scan patterns. After a path is generated, we try to place each path in the first pattern in the pattern pool. If the path does not fit due to conflicts, we attempt to place it in later functional cycles. This compaction approach retains the greedy nature of the original dynamic compaction algorithm where it will stop if the path fits into a pattern. If the path is not able to compact in any of the functional cycles of patterns in the pool, we generate a new pattern. In this method, each path delay test is compared to at-speed patterns in the pool. The challenge is that the at-speed delay test in a given at-speed cycle must have its necessary value assignments set up in previous (preamble) cycles, and have the captured results propagated to a scan cell in the later (coda) cycles. For instance, if we consider three at-speed (capture) cycles after the scan-in operation, and if we need to place a fault in the first capture cycle, then we must generate it with two propagation cycles. In this case, we consider these propagation cycles as coda cycles, so the algorithm attempts to select the most observable path through them. Likewise, if we are placing the path test in the second capture cycle, then we need one preamble cycle and one coda cycle, and if we are placing the path test in the third capture cycle, we require two preamble cycles with no coda cycles

Scalable algorithms for software based self test using formal methods

textTransistor scaling has kept up with Moore's law with a doubling of the number of transistors on a chip. More logic on a chip means more opportunities for manufacturing defects to slip in. This, in turn, has made processor testing after manufacturing a significant challenge. At-speed functional testing, being completely non-intrusive, has been seen as the ideal way of testing chips. However for processor testing, generating instruction level tests for covering all faults is a challenge given the issue of scalability. Data-path faults are relatively easier to control and observe compared to control-path faults. In this research we present a novel method to generate instruction level tests for hard to detect control-path faults in a processor. We initially map the gate level stuck-at fault to the Register Transfer Level (RTL) and build an equivalent faulty RTL model. The fault activation and propagation constraints are captured using Control and Data Flow Graphs of the RTL as a Liner Temporal Logic (LTL) property. This LTL property is then negated and given to a Bounded Model Checker based on a Bit-Vector Satisfiability Module Theories (SMT) solver. From the counter-example to the property we can extract a sequence of instructions that activates the gate level fault and propagates the fault effect to one of the observable points in the design. Other than the user supplying instruction constraints, this approach is completely automatic and does not require any manual intervention. Not all the design behaviors are required to generate a test for a fault. We use this insight to scale our previous methodology further. Underapproximations are design abstractions that only capture a subset of the original design behaviors. The use of RTL for test generation affords us two types of under-approximations: bit-width reduction and operator approximation. These are abstractions that perform reductions based on semantics of the RTL design. We also explore structural reductions of the RTL, called path based search, where we search through error propagation paths incrementally. This approach increases the size of the test generation problem step by step. In this way the SMT solver searches through the state space piecewise rather than doing the entire search at once. Experimental results show that our methods are robust and scalable for generating functional tests for hard to detect faults.Electrical and Computer Engineerin

New techniques for functional testing of microprocessor based systems

Electronic devices may be affected by failures, for example due to physical defects. These defects may be introduced during the manufacturing process, as well as during the normal operating life of the device due to aging. How to detect all these defects is not a trivial task, especially in complex systems such as processor cores. Nevertheless, safety-critical applications do not tolerate failures, this is the reason why testing such devices is needed so to guarantee a correct behavior at any time. Moreover, testing is a key parameter for assessing the quality of a manufactured product. Consolidated testing techniques are based on special Design for Testability (DfT) features added in the original design to facilitate test effectiveness. Design, integration, and usage of the available DfT for testing purposes are fully supported by commercial EDA tools, hence approaches based on DfT are the standard solutions adopted by silicon vendors for testing their devices. Tests exploiting the available DfT such as scan-chains manipulate the internal state of the system, differently to the normal functional mode, passing through unreachable configurations. Alternative solutions that do not violate such functional mode are defined as functional tests. In microprocessor based systems, functional testing techniques include software-based self-test (SBST), i.e., a piece of software (referred to as test program) which is uploaded in the system available memory and executed, with the purpose of exciting a specific part of the system and observing the effects of possible defects affecting it. SBST has been widely-studies by the research community for years, but its adoption by the industry is quite recent. My research activities have been mainly focused on the industrial perspective of SBST. The problem of providing an effective development flow and guidelines for integrating SBST in the available operating systems have been tackled and results have been provided on microprocessor based systems for the automotive domain. Remarkably, new algorithms have been also introduced with respect to state-of-the-art approaches, which can be systematically implemented to enrich SBST suites of test programs for modern microprocessor based systems. The proposed development flow and algorithms are being currently employed in real electronic control units for automotive products. Moreover, a special hardware infrastructure purposely embedded in modern devices for interconnecting the numerous on-board instruments has been interest of my research as well. This solution is known as reconfigurable scan networks (RSNs) and its practical adoption is growing fast as new standards have been created. Test and diagnosis methodologies have been proposed targeting specific RSN features, aimed at checking whether the reconfigurability of such networks has not been corrupted by defects and, in this case, at identifying the defective elements of the network. The contribution of my work in this field has also been included in the first suite of public-domain benchmark networks

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Observability Driven Path Generation for Delay Test

This research describes an approach for path generation using an observability metric for delay test. K Longest Path Per Gate (KLPG) tests are generated for sequential circuits. A transition launched from a scan flip-flop (SFF) is captured into another SFF during at-speed clock cycles, that is, clock cycles at the rated design speed. The generated path is a ‘longest path’ suitable for delay test. The path generation algorithm then utilizes observability of the fan-out gates in the consecutive, lower-speed clock cycles, known as coda cycles, to generate paths ending at a SFF, to capture the transition from the at-speed cycles. For a given clocking scheme defined by the number of coda cycles, if the final flip-flop is not scan-enabled, the path generation algorithm attempts to generate a different path that ends at a SFF, located in a different branch of the circuit fan-out, indicated by lower observability. The paths generated over multiple cycles are sequentially justified using Boolean satisfiability. The observability metric optimizes the path generation in the coda cycles by always attempting to grow the path through the branch with the best observability and never generating a path that ends at a non-scan flip-flop. The algorithm has been developed in C++. The experiments have been performed on an Intel Core i7 machine with 64GB RAM. Various ISCAS benchmark circuits have been used with various KLPG configurations for code evaluation. Multiple configurations have been used for the experiments. The combinations of the values of K [1, 2, 3, 4, 5] and number of coda cycles [1, 2, 3] have been used to characterize the implementation. A sublinear rise is run time has been observed with increasing K values. The total number of tested paths rise with K and falls with number of coda cycles, due to the increasing number of constraints on the path, particularly due to the fixed inputs

Quantifiable Assurance: From IPs to Platforms

Hardware vulnerabilities are generally considered more difficult to fix than software ones because they are persistent after fabrication. Thus, it is crucial to assess the security and fix the vulnerabilities at earlier design phases, such as Register Transfer Level (RTL) and gate level. The focus of the existing security assessment techniques is mainly twofold. First, they check the security of Intellectual Property (IP) blocks separately. Second, they aim to assess the security against individual threats considering the threats are orthogonal. We argue that IP-level security assessment is not sufficient. Eventually, the IPs are placed in a platform, such as a system-on-chip (SoC), where each IP is surrounded by other IPs connected through glue logic and shared/private buses. Hence, we must develop a methodology to assess the platform-level security by considering both the IP-level security and the impact of the additional parameters introduced during platform integration. Another important factor to consider is that the threats are not always orthogonal. Improving security against one threat may affect the security against other threats. Hence, to build a secure platform, we must first answer the following questions: What additional parameters are introduced during the platform integration? How do we define and characterize the impact of these parameters on security? How do the mitigation techniques of one threat impact others? This paper aims to answer these important questions and proposes techniques for quantifiable assurance by quantitatively estimating and measuring the security of a platform at the pre-silicon stages. We also touch upon the term security optimization and present the challenges for future research directions

High Quality Test Generation Targeting Power Supply Noise

Delay test is an essential structural manufacturing test used to determine the maximal frequency at which a chip can run without incurring any functional failures. The central unsolved challenge is achieving high delay correlation with the functional test, which is dominated by power supply noise (PSN). Differences in PSN between functional and structural tests can lead to differences in chip operating frequencies of 30% or more. Pseudo functional test (PFT), based on a multiple-cycle clocking scheme, has better PSN correlation with functional test compared with traditional two-cycle at-speed test. However, PFT is vulnerable to under-testing when applied to delay test. This work aims to generate high quality PFT patterns, achieving high PSN correlation with functional test. First, a simulation-based don’t-care filling algorithm, Bit-Flip, is proposed to improve the PSN for PFT. It relies on randomly flipping a group of bits in the test pattern to explore the search space and find patterns that stress the circuits with the worst-case, but close to functional PSN. Experimental results on un-compacted patterns show Bit-Flip is able to improve PSN as much as 38.7% compared with the best random fill. Second, techniques are developed to improve the efficiency of Bit-Flip. A set of partial patterns, which sensitize transitions on critical cells, are pre-computed and later used to guide the selection of bits to flip. Combining random and deterministic flipping, we achieve similar PSN control as Bit-Flip but with much less simulation time. Third, we address the problem of automatic test pattern generation for extracting circuit timing sensitivity to power supply noise during post-silicon validation. A layout-aware path selection algorithm selects long paths to fully span the power delivery network. The selected patterns are intelligently filled to bring the PSN to a desired level. These patterns can be used to understand timing sensitivity in post-silicon validation by repeatedly applying the path delay test while sweeping the PSN experienced by the path from low to high. Finally, the impacts of compression on power supply noise control are studied. Illinois Scan and embedded deterministic test (EDT) patterns are generated. Then Bit-Flip is extended to incorporate the compression constraints and applied to compressible patterns. The experimental results show that EDT lowers the maximal PSN by 24.15% and Illinois Scan lowers it by 2.77% on un-compacted patterns