Experimental Evaluation and Comparison of Time-Multiplexed Multi-FPGA Routing Architectures

Emulating large complex designs require multi-FPGA systems (MFS). However, inter-FPGA communication is confronted by the challenge of lack of interconnect capacity due to limited number of FPGA input/output (I/O) pins. Serializing parallel signals onto a single trace effectively addresses the limited I/O pin obstacle. Besides the multiplexing scheme and multiplexing ratio (number of inter-FPGA signals per trace), the choice of the MFS routing architecture also affect the critical path latency. The routing architecture of an MFS is the interconnection pattern of FPGAs, fixed wires and/or programmable interconnect chips. Performance of existing MFS routing architectures is also limited by off-chip interface selection. In this dissertation we proposed novel 2D and 3D latency-optimized time-multiplexed MFS routing architectures. We used rigorous experimental approach and real sequential benchmark circuits to evaluate and compare the proposed and existing MFS routing architectures. This research provides a new insight into the encouraging effects of using off-chip optical interface and three dimensional MFS routing architectures. The vertical stacking results in shorter off-chip links improving the overall system frequency with the additional advantage of smaller footprint area. The proposed 3D architectures employed serialized interconnect between intra-plane and inter-plane FPGAs to address the pin limitation problem. Additionally, all off-chip links are replaced by optical fibers that exhibited latency improvement and resulted in faster MFS. Results indicated that exploiting third dimension provided latency and area improvements as compared to 2D MFS. We also proposed latency-optimized planar 2D MFS architectures in which electrical interconnections are replaced by optical interface in same spatial distribution. Performance evaluation and comparison showed that the proposed architectures have reduced critical path delay and system frequency improvement as compared to conventional MFS. We also experimentally evaluated and compared the system performance of three inter-FPGA communication schemes i.e. Logic Multiplexing, SERDES and MGT in conjunction with two routing architectures i.e. Completely Connected Graph (CCG) and TORUS. Experimental results showed that SERDES attained maximum frequency than the other two schemes. However, for very high multiplexing ratios, the performance of SERDES & MGT became comparable

Design techniques for low-power multi-GS/s analog-to-digital converters

Ultra-high-speed (>10GS/s), medium-resolution (5~6bit), low-power (<50mW) analog-to-digital converter can find it application in the areas of digital oscilloscopes and next-generation serial link receivers. There are several challenges to enable a successful design, however. First, the time-interleaved architecture is required in order to achieve over 10GS/s sampling rate, with the trade-off of the number of the channels and the sampling rate in each channel. Phase misalignment and channel mismatch must be considered too. Second, timing accuracy, especially dynamic jitter of sampling clock becomes a major concern at ultra-high frequency, and certain techniques must be taken to address it. Finally, to achieve low power consumption, Flash architecture is not suitable to serve as the sub-ADC, and a low-power sub-ADC that can work at relatively high speed need to be designed. A single channel, asynchronous successive approximation (SA) ADC with improved feedback delay has been fabricated in 40nm CMOS. Compared with a conventional SA structure that employs a single quantizer controlled by a digital feedback logic loop, the proposed SA-ADC employs multiple quantizers for each conversion bit, clocked by an asynchronous ripple clock that is generated after each quantization. Hence, the sampling rate of the 6-bit ADC is limited only by the six delays of the Capacitive-DAC settling and each comparator’s quantization delay, as the digital logic delay is eliminated. Measurement results of the 40nm-CMOS SA-ADC achieves peak SNDR of 32.9dB at 1GS/s and 30.5dB at 1.25GS/s, consuming 5.28mW and 6.08mW respectively, leading to FoM of 148fJ/conversion-step and 178fJ/conversion-step, in a core area less than 170µm by 85µm. Based on the previous work of sub-ADC, a 12-GS/s 5-b 50-mW ADC is designed in 40nm CMOS with 8 time-interleaved channels of Flash-SA hybrid structure each running at 1.5GS/s. A modified bootstrapped switch is used in the track-and-hold circuit, introducing a global clock signal to synchronize the sampling instants of each individual channel, therefore improve the phase alignment and reduce distortion. The global clock is provided by a CML buffer which is injected by off-chip low-noise sine-wave signal, so that the RMS dynamic jitter is low for better ENOB performance. Measurement results show that the 12GS/s ADC can achieve a SNDR of 25.8dB with the input signal frequency around DC and 22.8dB around 2GHz, consuming 32.1mW, leading to FoM of 237.3fJ/conversion-step, in a core area less than 800µm by 500µm

A Sub-Centimeter Ranging Precision LIDAR Sensor Prototype Based on ILO-TDC

This thesis introduces a high-resolution light detection and ranging (LIDAR) sensor system-on-a-chip (SoC) that performs sub-centimeter ranging precision and maximally 124-meter ranging distance. With off-chip connected avalanche photodiodes (APDs), the time-of-flight (ToF) are resolved through 31×1 time-correlated single photon counting (TCSPC) channels. Embedded time-to-digital converters (TDCs) support 52-ps time resolution and 14-bit dynamic range. A novel injection-locked oscillator (ILO) based TDC are proposed to minimize the power of fine TDC clock distribution, and improve time precision. The global PVT variation among ILO clock distribution is calibrated by an on-chip phase-looked-loop (PLL) that assures a reliable counting performance over wide operating range. The proposed LIDAR sensor is designed, fabricated, and tested in the 65nm CMOS technology. Whole SoC consumes 37mW and each TDC channel consumes 788μW at nominal operation. The proposed TDC design achieved single-shot precision of 38.5 ps, channel uniformity of 14 ps, and DNL/INL of 0.56/1.56 LSB, respectively. The performance of proposed ILO-TDC makes it an excellent candidate for global counting TCSPC in automotive LIDAR

A compact high-energy particle detector for low-cost deep space missions

Over the last few decades particle physics has led to many new discoveries, laying the foundation for modern science. However, there are still many unanswered questions which the next generation of particle detectors could address, potentially expanding our knowledge and understanding of the Universe. Owing to recent technological advancements, electronic sensors are now able to acquire measurements previously unobtainable, creating opportunities for new deep-space high-energy particle missions. Consequently, a new compact instrument was developed capable of detecting gamma rays, neutrons and charged particles. This instrument combines the latest in FPGA System-on-Chip technology as the central processor and a 3x3 array of silicon photomultipliers coupled with an organic plastic scintillator as the detector. Using modern digital pulse shape discrimination and signal processing techniques, the scintillator and photomultiplier combination has been shown to accurately discriminate between the di_erent particle types and provide information such as total energy and incident direction. The instrument demonstrated the ability to capture 30,000 particle events per second across 9 channels - around 15 times that of the U.S. based CLAS detector. Furthermore, the input signals are simultaneously sampled at a maximum rate of 5 GSPS across all channels with 14-bit resolution. Future developments will include FPGA-implemented digital signal processing as well as hardware design for small satellite based deep-space missions that can overcome radiation vulnerability

Topical Workshop on Electronics for Particle Physics

The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities