A new system design methodology for wire pipelined SoC

Wire Pipelining (WP) has been proposed in order to limit the impact of increasing wire delays. In general, the added pipeline elements alters the system such that architectural changes are needed to preserve functionality. We illustrate a proposal that, while allowing the use of IP blocks without modification, takes advantage of a minimal knowledge of the IP's communication profile to dramatically increase the performances. We showed the formal equivalence between WP and original system and proved the higher performance achievable through a relevant case study

Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

Optimization of Discrete-parameter Multiprocessor Systems using a Novel Ergodic Interpolation Technique

Modern multi-core systems have a large number of design parameters, most of which are discrete-valued, and this number is likely to keep increasing as chip complexity rises. Further, the accurate evaluation of a potential design choice is computationally expensive because it requires detailed cycle-accurate system simulation. If the discrete parameter space can be embedded into a larger continuous parameter space, then continuous space techniques can, in principle, be applied to the system optimization problem. Such continuous space techniques often scale well with the number of parameters. We propose a novel technique for embedding the discrete parameter space into an extended continuous space so that continuous space techniques can be applied to the embedded problem using cycle accurate simulation for evaluating the objective function. This embedding is implemented using simulation-based ergodic interpolation, which, unlike spatial interpolation, produces the interpolated value within a single simulation run irrespective of the number of parameters. We have implemented this interpolation scheme in a cycle-based system simulator. In a characterization study, we observe that the interpolated performance curves are continuous, piece-wise smooth, and have low statistical error. We use the ergodic interpolation-based approach to solve a large multi-core design optimization problem with 31 design parameters. Our results indicate that continuous space optimization using ergodic interpolation-based embedding can be a viable approach for large multi-core design optimization problems.Comment: A short version of this paper will be published in the proceedings of IEEE MASCOTS 2015 conferenc

On-chip interconnect schemes for reconfigurable system-on-chip

On-chip communication architectures can have a great influence on the speed and area of System-on-Chip designs, and this influence is expected to be even more pronounced on reconfigurable System-on-Chip (rSoC) designs. To date, little research has been conducted on the performance implications of different on-chip communication architectures for rSoC designs. This paper motivates the need for such research and analyses current and proposed interconnect technologies for rSoC design. The paper also describes work in progress on implementation of a simple serial bus and a packet-switched network, as well as a methodology for quantitatively evaluating the performance of these interconnection structures in comparison to conventional buses

Asynchronous Circuit Stacking for Simplified Power Management

As digital integrated circuits (ICs) continue to increase in complexity, new challenges arise for designers. Complex ICs are often designed by incorporating multiple power domains therefore requiring multiple voltage converters to produce the corresponding supply voltages. These converters not only take substantial on-chip layout area and/or off-chip space, but also aggregate the power loss during the voltage conversions that must occur fast enough to maintain the necessary power supplies. This dissertation work presents an asynchronous Multi-Threshold NULL Convention Logic (MTNCL) “stacked” circuit architecture that alleviates this problem by reducing the number of voltage converters needed to supply the voltage the ICs operate at. By stacking multiple MTNCL circuits between power and ground, supplying a multiple of VDD to the entire stack and incorporating simple control mechanisms, the dynamic range fluctuation problem can be mitigated. A 130nm Bulk CMOS process and a 32nm Silicon-on-Insulator (SOI) CMOS process are used to evaluate the theoretical effect of stacking different circuitry while running different workloads. Post parasitic physical implementations are then carried out in the 32nm SOI process for demonstrating the feasibility and analyzing the advantages of the proposed MTNCL stacking architecture

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Bandwidth optimization in asynchronous NoCs by customizing link wire length

Journal ArticleThe bandwidth requirement for each link on a network-on-chip (NoC) may differ based on topology and traffic properties of the IP cores. Available bandwidth on an asynchronous NoC link will also vary depending on the wire length between sender and receiver. We explore the benefit to NoC performance when this property is used to increase bandwidth on specific links that carry the most traffic of an SoC design. Two methods are used to accomplish this: specifying router locations on the floorplan, and adding pipeline latches on long links. Energy and latency characteristics of an asynchronous NoC are compared to a similarly-designed synchronous NoC. The results indicate that the asynchronous network has lower energy, and link-specific bandwidth optimization has improved the average packet latency. Adding pipeline latches to congested links yields the most improvement. This link-specific optimization is applicable not only to the router and network we present here, but any asynchronous NoC used in a eterogeneous SoC

Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification