A Reuse-based framework for the design of analog and mixed-signal ICs

Despite the spectacular breakthroughs of the semiconductor industry, the ability to design integrated circuits (ICs) under stringent time-to-market (TTM) requirements is lagging behind integration capacity, so far keeping pace with still valid Moore's Law. The resulting gap is threatening with slowing down such a phenomenal growth. The design community believes that it is only by means of powerful CAD tools and design methodologies -and, possibly, a design paradigm shift-that this design gap can be bridged. In this sense, reuse-based design is seen as a promising solution, and concepts such as IP Block, Virtual Component, and Design Reuse have become commonplace thanks to the significant advances in the digital arena. Unfortunately, the very nature of analog and mixed-signal (AMS) design has hindered a similar level of consensus and development. This paper presents a framework for the reuse-based design of AMS circuits. The framework is founded on three key elements: (1) a CAD-supported hierarchical design flow that facilitates the incorporation of AMS reusable blocks, reduces the overall design time, and expedites the management of increasing AMS design complexity; (2) a complete, clear definition of the AMS reusable block, structured into three separate facets or views: the behavioral, structural, and layout facets, the two first for top-down electrical synthesis and bottom-up verification, the latter used during bottom-up physical synthesis; (3) the design for reusability set of tools, methods, and guidelines that, relying on intensive parameterization as well as on design knowledge capture and encapsulation, allows to produce fully reusable AMS blocks. A case study and a functional silicon prototype demonstrate the validity of the paper's proposals.Ministerio de Educación y Ciencia TEC2004-0175

Yield-driven power-delay-optimal CMOS full-adder design complying with automotive product specifications of PVT variations and NBTI degradations

We present the detailed results of the application of mathematical optimization algorithms to transistor sizing in a full-adder cell design, to obtain the maximum expected fabrication yield. The approach takes into account all the fabrication process parameter variations specified in an industrial PDK, in addition to operating condition range and NBTI aging. The final design solutions present transistor sizing, which depart from intuitive transistor sizing criteria and show dramatic yield improvements, which have been verified by Monte Carlo SPICE analysis

Optimization techniques for high-performance digital circuits

The relentless push for high performance in custom dig-ital circuits has led to renewed emphasis on circuit opti-mization or tuning. The parameters of the optimization are typically transistor and interconnect sizes. The de-sign metrics are not just delay, transition times, power and area, but also signal integrity and manufacturability. This tutorial paper discusses some of the recently pro-posed methods of circuit optimization, with an emphasis on practical application and methodology impact. Circuit optimization techniques fall into three broad categories. The rst is dynamic tuning, based on time-domain simulation of the underlying circuit, typically combined with adjoint sensitivity computation. These methods are accurate but require the specication of in-put signals, and are best applied to small data- ow cir-cuits and \cross-sections " of larger circuits. Ecient sensitivity computation renders feasible the tuning of cir-cuits with a few thousand transistors. Second, static tuners employ static timing analysis to evaluate the per-formance of the circuit. All paths through the logic are simultaneously tuned, and no input vectors are required. Large control macros are best tuned by these methods. However, in the context of deep submicron custom de-sign, the inaccuracy of the delay models employed by these methods often limits their utility. Aggressive dy-namic or static tuning can push a circuit into a precip-itous corner of the manufacturing process space, which is a problem addressed by the third class of circuit op-timization tools, statistical tuners. Statistical techniques are used to enhance manufacturability or maximize yield. In addition to surveying the above techniques, topics such as the use of state-of-the-art nonlinear optimization methods and special considerations for interconnect siz-ing, clock tree optimization and noise-aware tuning will be brie y considered.

An approach to design knowledge capture for the space station

The design of NASA's space station has begun. During the design cycle, and after activation of the space station, the reoccurring need will exist to access not only designs, but also deeper knowledge about the designs, which is only hinted in the design definition. Areas benefiting from this knowledge include training, fault management, and onboard automation. NASA's Artificial Intelligence Office at Johnson Space Center and The MITRE Corporation have conceptualized an approach for capture and storage of design knowledge

Recent Trends and Perspectives on Defect-Oriented Testing

Electronics employed in modern safety-critical systems require severe qualification during the manufacturing process and in the field, to prevent fault effects from manifesting themselves as critical failures during mission operations. Traditional fault models are not sufficient anymore to guarantee the required quality levels for chips utilized in mission-critical applications. The research community and industry have been investigating new test approaches such as device-aware test, cell-aware test, path-delay test, and even test methodologies based on the analysis of manufacturing data to move the scope from OPPM to OPPB. This special session presents four contributions, from academic researchers and industry professionals, to enable better chip quality. We present results on various activities towards this objective, including device-aware test, software-based self-test, and memory test

Asynchronous techniques for system-on-chip design

SoC design will require asynchronous techniques as the large parameter variations across the chip will make it impossible to control delays in clock networks and other global signals efficiently. Initially, SoCs will be globally asynchronous and locally synchronous (GALS). But the complexity of the numerous asynchronous/synchronous interfaces required in a GALS will eventually lead to entirely asynchronous solutions. This paper introduces the main design principles, methods, and building blocks for asynchronous VLSI systems, with an emphasis on communication and synchronization. Asynchronous circuits with the only delay assumption of isochronic forks are called quasi-delay-insensitive (QDI). QDI is used in the paper as the basis for asynchronous logic. The paper discusses asynchronous handshake protocols for communication and the notion of validity/neutrality tests, and completion tree. Basic building blocks for sequencing, storage, function evaluation, and buses are described, and two alternative methods for the implementation of an arbitrary computation are explained. Issues of arbitration, and synchronization play an important role in complex distributed systems and especially in GALS. The two main asynchronous/synchronous interfaces needed in GALS-one based on synchronizer, the other on stoppable clock-are described and analyzed

NASA SERC 1990 Symposium on VLSI Design

This document contains papers presented at the first annual NASA Symposium on VLSI Design. NASA's involvement in this event demonstrates a need for research and development in high performance computing. High performance computing addresses problems faced by the scientific and industrial communities. High performance computing is needed in: (1) real-time manipulation of large data sets; (2) advanced systems control of spacecraft; (3) digital data transmission, error correction, and image compression; and (4) expert system control of spacecraft. Clearly, a valuable technology in meeting these needs is Very Large Scale Integration (VLSI). This conference addresses the following issues in VLSI design: (1) system architectures; (2) electronics; (3) algorithms; and (4) CAD tools

Improving the structural reliability of steel frames using posttensioned connections

In this paper, various moment-resisting steel frames (MRSFs) are subjected to 30 narrow-band motions scaled at different ground motion intensity levels in terms of spectral acceleration at first mode of vibration in order to perform incremental dynamic analysis for peak and residual interstory drift demands. The results are used to compute the structural reliability of the steel frames by means of hazard curves for peak and residual drifts. It is observed that the structures exceed the threshold residual drift of 0.5%, which is perceptible to human occupants, and it could lead to human discomfort according to recent investigations. For this reason, posttensioned connections (PTCs) are incorporated into the steel frames in order to improve the structural reliability. The results suggest that the annual rate of exceedance of peak and residual interstory drift demands are reduced with the use of PTC. Thus, the structural reliability of the steel frames with PTC is superior to that of the MRSFs. In particular, the residual drift demands tend to be smaller when PTCs are incorporated in the steel structures.Peer ReviewedPostprint (published version