3,203 research outputs found

    Cache Equalizer: A Cache Pressure Aware Block Placement Scheme for Large-Scale Chip Multiprocessors

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    This paper describes Cache Equalizer (CE), a novel distributed cache management scheme for large scale chip multiprocessors (CMPs). Our work is motivated by large asymmetry in cache sets usages. CE decouples the physical locations of cache blocks from their addresses for the sake of reducing misses caused by destructive interferences. Temporal pressure at the on-chip last-level cache, is continuously collected at a group (comprised of cache sets) granularity, and periodically recorded at the memory controller to guide the placement process. An incoming block is consequently placed at a cache group that exhibits the minimum pressure. CE provides Quality of Service (QoS) by robustly offering better performance than the baseline shared NUCA cache. Simulation results using a full-system simulator demonstrate that CE outperforms shared NUCA caches by an average of 15.5% and by as much as 28.5% for the benchmark programs we examined. Furthermore, evaluations manifested the outperformance of CE versus related CMP cache designs

    Multidimensional model of successful aging and nursing terminologies: similarities for use in the clinical practice

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    Aim: To compare the domains of the Multidimensional Model of Successful Aging (MMSA)with the nursing terminologies, such as, NANDA International (NANDA-I), NursingInterventions Classification (NIC) and Nursing Outcomes Classification (NOC), in order tofind similarities among them.Method: Cross-mapping between MMSA and nursing terminologies in two stages: individualanalysis and comparison between the MMSA and the nursing terminologies, based on themapping process rules; consensus among researchers to validate the results.Results: All NOC and NIC domains were mapped with similarity in the MMSA domains, and12 of the 13 NANDA-I domains showed similarity to the MMSA domains. In addition,similarity was identified between MMSA and most classes of the three classifications.Conclusions: The similarity between MMSA, NANDA-I, NIC and NOC supported the ideathat the MMSA framework can be used in the nursing process to qualify the nursing practicein the elderly care.Keywords: Aging. Nursing process. Standardized nursing terminology

    Nature-Inspired Interconnects for Self-Assembled Large-Scale Network-on-Chip Designs

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    Future nano-scale electronics built up from an Avogadro number of components needs efficient, highly scalable, and robust means of communication in order to be competitive with traditional silicon approaches. In recent years, the Networks-on-Chip (NoC) paradigm emerged as a promising solution to interconnect challenges in silicon-based electronics. Current NoC architectures are either highly regular or fully customized, both of which represent implausible assumptions for emerging bottom-up self-assembled molecular electronics that are generally assumed to have a high degree of irregularity and imperfection. Here, we pragmatically and experimentally investigate important design trade-offs and properties of an irregular, abstract, yet physically plausible 3D small-world interconnect fabric that is inspired by modern network-on-chip paradigms. We vary the framework's key parameters, such as the connectivity, the number of switch nodes, the distribution of long- versus short-range connections, and measure the network's relevant communication characteristics. We further explore the robustness against link failures and the ability and efficiency to solve a simple toy problem, the synchronization task. The results confirm that (1) computation in irregular assemblies is a promising and disruptive computing paradigm for self-assembled nano-scale electronics and (2) that 3D small-world interconnect fabrics with a power-law decaying distribution of shortcut lengths are physically plausible and have major advantages over local 2D and 3D regular topologies

    A survey on scheduling and mapping techniques in 3D Network-on-chip

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    Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

    P-NOC: Adversarial CAM Generation for Weakly Supervised Semantic Segmentation

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    To mitigate the necessity for large amounts of supervised segmentation annotation sets, multiple Weakly Supervised Semantic Segmentation (WSSS) strategies have been devised. These will often rely on advanced data and model regularization strategies to instigate the development of useful properties (e.g., prediction completeness and fidelity to semantic boundaries) in segmentation priors, notwithstanding the lack of annotated information. In this work, we first create a strong baseline by analyzing complementary WSSS techniques and regularizing strategies, considering their strengths and limitations. We then propose a new Class-specific Adversarial Erasing strategy, comprising two adversarial CAM generating networks being gradually refined to produce robust semantic segmentation proposals. Empirical results suggest that our approach induces substantial improvement in the effectiveness of the baseline, resulting in a noticeable improvement over both Pascal VOC 2012 and MS COCO 2014 datasets.Comment: 19 pages, 10 figure

    Thermal-Aware Networked Many-Core Systems

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    Advancements in IC processing technology has led to the innovation and growth happening in the consumer electronics sector and the evolution of the IT infrastructure supporting this exponential growth. One of the most difficult obstacles to this growth is the removal of large amount of heatgenerated by the processing and communicating nodes on the system. The scaling down of technology and the increase in power density is posing a direct and consequential effect on the rise in temperature. This has resulted in the increase in cooling budgets, and affects both the life-time reliability and performance of the system. Hence, reducing on-chip temperatures has become a major design concern for modern microprocessors. This dissertation addresses the thermal challenges at different levels for both 2D planer and 3D stacked systems. It proposes a self-timed thermal monitoring strategy based on the liberal use of on-chip thermal sensors. This makes use of noise variation tolerant and leakage current based thermal sensing for monitoring purposes. In order to study thermal management issues from early design stages, accurate thermal modeling and analysis at design time is essential. In this regard, spatial temperature profile of the global Cu nanowire for on-chip interconnects has been analyzed. It presents a 3D thermal model of a multicore system in order to investigate the effects of hotspots and the placement of silicon die layers, on the thermal performance of a modern ip-chip package. For a 3D stacked system, the primary design goal is to maximise the performance within the given power and thermal envelopes. Hence, a thermally efficient routing strategy for 3D NoC-Bus hybrid architectures has been proposed to mitigate on-chip temperatures by herding most of the switching activity to the die which is closer to heat sink. Finally, an exploration of various thermal-aware placement approaches for both the 2D and 3D stacked systems has been presented. Various thermal models have been developed and thermal control metrics have been extracted. An efficient thermal-aware application mapping algorithm for a 2D NoC has been presented. It has been shown that the proposed mapping algorithm reduces the effective area reeling under high temperatures when compared to the state of the art.Siirretty Doriast
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