Integrated temperature sensors in deep sub-micron CMOS technologies

textIntegrated temperature sensors play an important role in enhancing the performance of on-chip power and thermal management systems in today's highly-integrated system-on-chip (SoC) platforms, such as microprocessors. Accurate on-chip temperature measurement is essential to maximize the performance and reliability of these SoCs. However, due to non-uniform power consumption by different functional blocks, microprocessors have fairly large thermal gradient (and variation) across their chips. In the case of multi-core microprocessors for example, there are task-specific thermal gradients across different cores on the same die. As a result, multiple temperature sensors are needed to measure the temperature profile at all relevant coordinates of the chip. Subsequently, the results of the temperature measurements are used to take corrective measures to enhance the performance, or save the SoC from catastrophic over-heating situations which can cause permanent damage. Furthermore, in a large multi-core microprocessor, it is also imperative to continuously monitor potential hot-spots that are prone to thermal runaway. The locations of such hot spots depend on the operations and instruction the processor carries out at a given time. Due to practical limitations, it is an overkill to place a big size temperature sensor nearest to all possible hot spots. Thus, an ideal on-chip temperature sensor should have minimal area so that it can be placed non-invasively across the chip without drastically changing the chip floor plan. In addition, the power consumption of the sensors should be very low to reduce the power budget overhead of thermal monitoring system, and to minimize measurement inaccuracies due to self-heating. The objective of this research is to design an ultra-small size and ultra-low power temperature sensor such that it can be placed in the intimate proximity of all possible hot spots across the chip. The general idea is to use the leakage current of a reverse-bias p-n junction diode as an operand for temperature sensing. The tasks within this project are to examine the theoretical aspect of such sensors in both Silicon-On-Insulator (SOI), and bulk Complementary Metal-Oxide Semiconductor (CMOS) technologies, implement them in deep sub-micron technologies, and ultimately evaluate their performances, and compare them to existing solutions.Electrical and Computer Engineerin

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

A multi-site perfusion monitoring sub-system

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.Includes bibliographical references (p. 123-125).by Myev A. Bodenhofer.Ph.D

Bolometers

Infrared Detectors and technologies are very important for a wide range of applications, not only for Military but also for various civilian applications. Comparatively fast bolometers can provide large quantities of low cost devices opening up a new era in infrared technologies. This book deals with various aspects of bolometer developments. It covers bolometer material aspects, different types of bolometers, performance limitations, applications and future trends. The chapters in this book will be useful for senior researchers as well as beginning graduate students

Advanced sensors technology survey

This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

Millimeter and sub-millimeter wave radiometers for atmospheric remote sensing from CubeSat platforms

2018 Fall.Includes bibliographical references.To view the abstract, please see the full text of the document

A Physical Unclonable Function derived from the power distribution system of an integrated circuit

Hardware support for security mechanisms such as authentication, cryptographic protocols, digital rights management and hardware metering depend heavily on the security of embedded secret keys. The current practice of embedding these keys as digital data in the Integrated Circuit (IC) weakens security because the keys can be learned through attacks. Physical Unclonable Functions (PUFs) are a recently- proposed alternative to storing digital keys on the IC. A PUF leverages the inherent manufacturing variations of an IC to define a random function. However, poor performance under PUF quality criteria such as the level of randomness and reproducibility in the responses have detracted from their adoption and widespread use. In this dissertation, I propose several ways to define a novel PUF using the Power Distribution System (PDS) of an IC. First, I describe the hardware primitive and test setup that is required to obtain the PUF responses. Then, I evaluate the analog PUF responses from silicon against standard PUF quality metrics in order to qualify the strengths and weaknesses of the proposed PUF. I show that the analog PUFs ex- hibit very high levels of randomness and reproducibility, but are sensitive to changes in temperature. Next, I propose extensions to our PUF that enable an exponential number of Challenge/Response Pairs (CRPs) with respect to the number of hardware resources, as well as yielding a marginal increase in the level of randomness. I also use these same analog measurements from silicon to simulate an integrated implementation of the PUF that takes a digital challenge and returns a digital response. I show that the integrated architecture also exhibits high levels of randomness and reproducibility, and is also resistant to changes in temperature. Future work includes designing and building a new IC that implements a more powerful hardware primitive that will improve both the number and accuracy of the measurements, as well as additional hardware that will allow the challenge and response generation to be performed on-chip