A Flexible and Robust Large Scale Capacitive Tactile System for Robots

IEEE Sensor Journal, Vol. 13, Issue 10, 2013Capacitive technology allows building sensors that are small, compact and have high sensitivity. For this reason it has been widely adopted in robotics. In a previous work we presented a compliant skin system based on capacitive technology consisting of triangular modules interconnected to form a system of sensors that can be deployed on non-flat surfaces. This solution has been successfully adopted to cover various humanoid robots. The main limitation of this and all the approaches based on capacitive technology is that they require to embed a deformable dielectric layer (usually made using an elastomer) covered by a conductive layer. This complicates the production process considerably, introduces hysteresis and limits the durability of the sensors due to ageing and mechanical stress. In this paper we describe a novel solution in which the dielectric is made using a thin layer of 3D fabric which is glued to conductive and protective layers using techniques adopted in the clothing industry. As such, the sensor is easier to produce and has better mechanical properties. Furthermore, the sensor proposed in this paper embeds transducers for thermal compensation of the pressure measurements. We report experimental analysis that demonstrates that the sensor has good properties in terms of sensitivity and resolution. Remarkably we show that the sensor has very low hysteresis and effectively allows compensating drifts due to temperature variations

Future of smart cardiovascular implants

Cardiovascular disease remains the leading cause of death in Western society. Recent technological advances have opened the opportunity of developing new and innovative smart stent devices that have advanced electrical properties that can improve diagnosis and even treatment of previously intractable conditions, such as central line access failure, atherosclerosis and reporting on vascular grafts for renal dialysis. Here we review the latest advances in the field of cardiovascular medical implants, providing a broad overview of the application of their use in the context of cardiovascular disease rather than an in-depth analysis of the current state of the art. We cover their powering, communication and the challenges faced in their fabrication. We focus specifically on those devices required to maintain vascular access such as ones used to treat arterial disease, a major source of heart attacks and strokes. We look forward to advances in these technologies in the future and their implementation to improve the human condition

Polyvinylidene fluoride - based MEMS tactile sensor for minimally invasive surgery

Minimally invasive surgery (MIS) procedures have been growing rapidly for the past couple of decades. In MIS operations, endoscopic tools are inserted through a small incision on human's body. Although these procedures have many advantages such as fast recovery time, minimum damage to human body and reduced post operative complications, it does not provide any tactile feedback to the surgeon. This thesis reports on design, finite element analysis, fabrication and testing of a micromachined piezoelectric endoscopic tactile sensor. Similar to the commercial endoscopic graspers, the sensor is teeth like in order to grasp slippery tissues. It consists of three layers; the first layer is a silicon layer of teeth shapes on the top and two supports at the bottom forming a thin plate and a U-Channel. The second layer is a patterned Polyvinylidene Fluoride (PVDF) film, and the third layer is a supporting Plexiglas. The patterned PVDF film was placed on the middle between the other two layers. When a concentric load is applied to the sensor, the magnitude and the position of the applied load are obtained from the outputs of the sensing elements which are sandwiched between the silicon supports and the Plexiglas. In addition, when a soft object/tissue is place on the sensor and load is applied the degree of the softness/compliance of the object is obtained from the outputs from the middle PVDF sensing elements, which are glued to the back of the thin silicon plate. The outputs are related to the deformation of the silicon plate which related to the contacting object softness. The sensor has high sensitivity and high dynamic range as a result it can potentially detect a small dynamic load such as a pulse load as well as a high load such as a firm grasping of a tissue by an endoscopic grasper. The entire surface of the tactile sensor is also active, which is an advantage in detecting the precise position of the applied point load on the grasper. The finite element analysis and experimental results are in close agreement with each other. The sensor can potentially be integrated with the gasper of a commercially available endoscopic graspe

PERFORMANCE ANALYSIS OF A FLEXIBLE POLYIMIDE BASED DEVICE FOR DISPLACEMENT SENSING

The goal of this paper is to investigate the performance of a wireless passive displacement sensor. Displacement sensor based on the heterogeneous integration process combines traditional fabrication technologies PCB (Printed Circuit Board) and LTCC (Low Temperature Co-fired Technology) with a flexible polyimide foil. The proposed sensor uses the coil as an essential part, multiple spacers and a polyimide foil as a flexible membrane with a piece of ferrite attached to it. With the displacement of the polyimide foil, the ferrite gets closer to the coil causing an increase in its inductance and a decrease of the resonant frequency of the system (coil, ferrite and antenna). Simulation results showed that sensors with equal outer dimensions but different internal structures exhibit different performances. Two prototypes of the sensor with different ferrite dimensions are designed, fabricated and characterized. Finally, their performances are compared

Optimization and fabrication of MEMS based piezoelectric acoustic sensor for wide frequency range and high SPL acoustic application

This paper reports finite element model (FEM) simulation and fabrication of a square shaped diaphragm along with microtunnel for MEMS acoustic sensor which can be used for measurement of wide operational frequency range and high sound pressure level (SPL) 100 dB–180 dB measurement in launching vehicle and aircraft. The structure consists of a piezoelectric ZnO layer sandwiched between two aluminum electrodes on a thin silicon diaphragm. There is a microtunnel in the structure which relates the cavity to the atmosphere for pressure compensation. The microtunnel decides the lower cut-off frequency of device. Analytical and simulation approaches are used to optimize microtunnel dimension and simulation approach for diaphragm structure optimization. The change in displacement, stress, sensitivity and resonance frequency due to different diaphragm sizes with diaphragm thickness variation is also analyzed. The optimized diaphragm structure of 1750 × 1750 μm2 and microtunnel of 100 μm wide and 24 μm deep have been fabricated using bulk micromachining technique. The fabricated device response has been tested using LDV and sensitivity measurement system

Photonic Crystal Directional Coupler Based Optomechanical Sensor

An extremely small ($6.5\times6.5\mu$m) optomechanical sensor is proposed that utilizes a photonic crystal (PC) etched onto silicon-on-insulator (SOI) using adapted complimentary metal-oxide-semiconductor fabrication technology. The destructive interference of light with the periodic structure can forbid its propagation inside the crystal across a range of frequencies and can be used to confine light near edge of a PC slab. By placing two PC edges near each other, a directional coupler is formed where light is periodically exchanged between the two waveguides. Wet-etching away the buried oxide residing beneath the photonic crystal directional coupler (PCDC), a membrane is formed. Exerting force on the PCDC alters the separation between the two PC edges and modulates the observed transmission at the coupler outputs. Buckle-mitigating structures are also demonstrated here which relieve the unpredictable compressive stress built into the top silicon layer of SOI during wafer fabrication. The PCDC sensors attempt to overcome some of the shortcomings of existing micromechanical sensors such as area constraints, material restrictions, stiction, and EM interference. PCDC sensors are also highly parallelizable due to their small size and wide optical bandwidth. PCDC sensors are envisaged to be used in microfluidic integration and are capable of 149kPa full scale pressure measurement ranges

Millimeter-Wave Reconfigurable CMOS-MEMS Integrated Devices

The millimeter-wave spectrum has sparked interest recently as a promising alternative to meet bandwidth requirements for wireless local area networks, vehicular radars, short-range multi-Gb/s links, and next-generation cellular system communications (5G). The unlicensed 7 GHz ISM band around 60 GHz is of particular interest. Compared to semiconductor technologies, Micro-Electro-Mechanical Systems (MEMS) have the potential to realize reconfigurable millimeter-wave devices with superior performance in terms of linearity, insertion loss and DC power consumption. This thesis presents the development and fabrication of miniaturized, low insertion loss, high isolation RF-MEMS switches implemented in CMOS chips through the use of a post-processing technique. Several CMOS-MEMS switches operating at 60 GHz and 77 GHz are demonstrated. Prototype units for SPST, SP3T switches and a distributed MEMS transmission line (DMTL) network are integrated on CMOS 0.35 μm. The challenges involved in realizing CMOS-MEMS devices at mm-wave frequencies are also addressed in this work

A thin monocrystalline diaphragm pressure sensor using silicon-on-insulator technology.

The sensors market is huge and growing annually, of this a large sector is pressure sensors. With increasing demands on performance there remains a need for ultraminiature, high performance pressure sensors, particularly for medicai applications. To address this a novel capacitive pressure sensor consisting of an array of parallel connected diaphragms has been designed and fabricated from SIMOX substrates. The benefits of this include single crystal silicon diaphragms, small, well controlled dimensions, single sided processing and the opportunity for electronics integration. Theoretical modelling of this structure predicts a high sensitivity and low stress device with opportunities for scaling to suit alternative applications. A novel, process technology was developed to achieve the required structure with the inclusion of procedures to address the specific issues relating to the SIMOX material. The sensor was fully characterised and the results demonstrated high performance compared with similar reported devices. Alternative structures such as cantilevers, bridges and resonators were fabricated as a demonstrative tool to show the feasibility of this technology in a wider field of applications