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Silicon Photonic Subsystems for Inter-Chip Optical Networks
The continuous growth of electronic compute and memory nodes in terms of the number of I/O pins, bandwidth, and areal throughput poses major integration and packaging challenges associated with offloading multi-Tbit/s data rates within the few pJ/bit targets. While integrated photonics are already deployed in long and short distances such as inter and intra data centers communications, the promising characteristics of the silicon photonic platform set it as the future technology for optical interconnects in ultra short inter-chip distances. The high index contrast between the waveguide and the cladding together with strong thermo-optic and carrier effects in silicon allows developing a wide range of micro-scale and low power optical devices compatible with the CMOS fabrication processes. Furthermore, the availability of photonic foundries and new electrical and optical co-packaging techniques further pushes this platform for the next steps of commercial deployment.
The work in this dissertation presents the current trends in high-performance memory and processor nodes and gives motivation for disaggregated and reconfigurable inter-chip network enabled with the silicon photonic layer. A dense WDM transceiver and broadband switch architectures are discussed to support a bi-directional network of ten hybrid-memory cubes (HMC) interconnected to ten processor nodes with an overall aggregated bandwidth of 9.6Tbit/s. Latency and energy consumption are key performance parameters in a processor to primary memory nodes connectivity. The transceiver design is based on energy-efficient micro-ring resonators, and the broadband switch is constructed with 2x2 Mach-Zehnder elements for nano-second reconfiguration. Each transceiver is based on hundreds of micro-rings to convert the native HMC electrical protocol to the optical domain and the switch is based on tens of hundreds of 2x2 elements to achieve non-blocking all-to-all connectivity.
The next chapters focus on developing methods for controlling and monitoring such complex and highly integrated silicon photonic subsystems. The thermo-optic effect is characterized and we show experimentally that the phase of the optical carrier can be reliably controlled with pulse-width modulation (PWM) signal, ultimately relaxing the need for hundreds of digital to analog converters (DACs). We further show that doped waveguide heaters can be utilized as \textit{in-line} optical power monitors by measuring photo-conductance current, which is an alternative for the conventional tapping and integration of photo-diodes.
The next part concerned with a common cascaded micro-ring resonator in a WDM transceiver design. We develop on an FPGA control algorithm that abstracts the physical layer and takes user-defined inputs to set the resonances to the desired wavelength in a unicast and multicast transmission modes. The associated sensitivities of these silicon ring resonators are presented and addressed with three closed-loop solutions. We first show a closed-loop operation based on tapping the error signal from the drop port of the micro-ring. The second solution presents a resonance wavelength locking with a single digital I/O for control and feedback signals. Lastly, we leverage the photo-conductance effect and demonstrate the locking procedure using only the doped heater for both control and feedback purposes.
To achieve the inter-chip reconfigurability we discuss recent advances of high-port-count SiP broadband switches for reconfigurable inter-chip networks. To ensure optimal operation in terms of low insertion loss, low cross-talk and high signal integrity per routing path, hundreds of 2x2 Mach-Zehnder elements need to be biased precisely for the cross and bar states. We address this challenge with a tapless and a design agnostic calibration approach based on the photo-conductance effect. The automated algorithm returns a look-up table for all for each 2x2 element and the associated calibrated biases. Each routing scenario is then tested for insertion loss, crosstalk and bit-error rate of 25Gbit/s 4-level pulse amplitude modulation signals. The last part utilizes the Mach-Zehnder interferometers in WDM transceiver applications. We demonstrate a polarization insensitive four-channel WDM receiver with 40Gbit/s per channel and a transmitter design generating 8-level pulse amplitude modulation signals at 30Gbit/s
저전력, 저면적 유선 송수신기 설계를 위한 회로 기술
학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2016. 8. 정덕균.In this thesis, novel circuit techniques for low-power and area-efficient wireline transceiver, including a phase-locked loop (PLL) based on a two-stage ring oscillator, a scalable voltage-mode transmitter, and a forwarded-clock (FC) receiver based on a delay-locked-loop (DLL) based per-pin deskew, are proposed.
At first, a two-stage ring PLL that provides a four-phase, high-speed clock for a quarter-rate TX in order to minimize power consumption is presented. Several analyses and verification techniques, ranging from the clocking architectures for a high-speed TX to oscillation failures in a two-stage ring oscillator, are addressed in this thesis. A tri-state-inverter–based frequency-divider and an AC-coupled clock-buffer are used for high-speed operations with minimal power and area overheads. The proposed PLL fabricated in the 65-nm CMOS technology occupies an active area of 0.009 mm2 with an integrated-RMS-jitter of 414 fs from 10 kHz to 100 MHz while consuming 7.6 mW from a 1.2-V supply at 10 GHz. The resulting figure-of-merit is -238.8 dB, which surpasses that of the state-of-the-art ring-PLLs by 4 dB.
Secondly, a voltage-mode (VM) transmitter which offers a wide operation range of 6 to 32 Gb/s, controllable pre-emphasis equalization and output voltage swing without altering output impedance, and a power supply scalability is presented. A quarter-rate clocking architecture is employed in order to maximize the scalability and energy efficiency across the variety of operating conditions. A P-over-N VM driver is used for CMOS compatibility and wide voltage-swing range required for various I/O standards. Two supply regulators calibrate the output impedance of the VM driver across the wide swing and pre-emphasis range. A single phase-locked loop is used to provide a wide frequency range of 1.5-to-8 GHz. The prototype chip is fabricated in 65-nm CMOS technology and occupies active area of 0.48x0.36 mm2. The proposed transmitter achieves 250-to-600-mV single-ended swing and exhibits the energy efficiency of 2.10-to-2.93 pJ/bit across the data rate of 6-to-32 Gb/s.
And last, this thesis describes a power and area-efficient FC receiver and includes an analysis of the jitter tolerance of the FC receiver. In the proposed design, jitter tolerance is maximized according to the analysis by employing a DLL-based de-skewing. A sample-swapping bang-bang phase-detector (SS-BBPD) eliminates the stuck locking caused by the finite delay range of the voltage-controlled delay line (VCDL), and also reduces the required delay range of the VCDL by half. The proposed FC receiver is fabricated in 65-nm CMOS technology and occupies an active area of 0.025 mm2. At a data rate of 12.5 Gb/s, the proposed FC receiver exhibits an energy efficiency of 0.36 pJ/bit, and tolerates 1.4-UIpp sinusoidal jitter of 300 MHz.Chapter 1. Introduction 1
1.1. Motivation 1
1.2. Thesis organization 5
Chapter 2. Phase-Locked Loop Based on Two-Stage Ring Oscillator 7
2.1. Overivew 7
2.2. Background and Analysis of a Two-stage Ring Oscillator 11
2.3. Circuit Implementation of The Proposed PLL 25
2.4. Measurement Results 33
Chapter 3. A Scalable Voltage-Mode Transmitter 37
3.1. Overview 37
3.2. Design Considerations on a Scalable Serial Link Transmitter 40
3.3. Circuit Implementation 46
3.4. Measurement Results 56
Chapter 4. Delay-Locked Loop Based Forwarded-Clock Receiver 62
4.1. Overview 62
4.2. Timing and Data Recovery in a Serial Link 65
4.3. DLL-Based Forwarded-Clock Receiver Characteristics 70
4.4. Circuit Implementation 79
4.5. Measurement Results 89
Chapter 5. Conclusion 94
Appendix 96
Appendix A. Design flow to optimize a high-speed ring oscillator 96
Appendix B. Reflection Issues in N-over-N Voltage-Mode Driver 99
Appendix C. Analysis on output swing and power consumption of the P-over-N voltage-mode driver 107
Appendix D. Loop Dynamics of DLL 112
Bibliography 121
Abstract 128Docto
Electronic Photonic Integrated Circuits and Control Systems
Photonic systems can operate at frequencies several orders of magnitude higher than electronics, whereas electronics offers extremely high density and easily built memories. Integrated photonic-electronic systems promise to combine advantage of both, leading to advantages in accuracy, reconfigurability and energy efficiency. This work concerns of hybrid and monolithic electronic-photonic system design. First, a high resolution voltage supply to control the thermooptic photonic chip for time-bin entanglement is described, in which the electronics system controller can be scaled with more number of power channels and the ability to daisy-chain the devices. Second, a system identification technique embedded with feedback control for wavelength stabilization and control model in silicon nitride photonic integrated circuits is proposed. Using the system, the wavelength in thermooptic device can be stabilized in dynamic environment. Third, the generation of more deterministic photon sources with temporal multiplexing established using field programmable gate arrays (FPGAs) as controller photonic device is demonstrated for the first time. The result shows an enhancement to the single photon output probability without introducing additional multi-photon noise. Fourth, multiple-input and multiple-output (MIMO) control of a silicon nitride thermooptic photonic circuits incorporating Mach Zehnder interferometers (MZIs) is demonstrated for the first time using a dual proportional integral reference tracking technique. The system exhibits improved performance in term of control accuracy by reducing wavelength peak drift due to internal and external disturbances. Finally, a monolithically integrated complementary metal oxide semiconductor (CMOS) nanophotonic segmented transmitter is characterized. With segmented design, the monolithic Mach Zehnder modulator (MZM) shows a low link sensitivity and low insertion loss with driver flexibility
Solid State Circuits Technologies
The evolution of solid-state circuit technology has a long history within a relatively short period of time. This technology has lead to the modern information society that connects us and tools, a large market, and many types of products and applications. The solid-state circuit technology continuously evolves via breakthroughs and improvements every year. This book is devoted to review and present novel approaches for some of the main issues involved in this exciting and vigorous technology. The book is composed of 22 chapters, written by authors coming from 30 different institutions located in 12 different countries throughout the Americas, Asia and Europe. Thus, reflecting the wide international contribution to the book. The broad range of subjects presented in the book offers a general overview of the main issues in modern solid-state circuit technology. Furthermore, the book offers an in depth analysis on specific subjects for specialists. We believe the book is of great scientific and educational value for many readers. I am profoundly indebted to the support provided by all of those involved in the work. First and foremost I would like to acknowledge and thank the authors who worked hard and generously agreed to share their results and knowledge. Second I would like to express my gratitude to the Intech team that invited me to edit the book and give me their full support and a fruitful experience while working together to combine this book
Modeling and Design of High-Speed CMOS Receivers for Short-Reach Photonic Links
This dissertation presents several research outcomes towards designing high-speed CMOS optical receivers for energy-efficient short-reach optical links. First, it provides a wide survey of recently published equalizer-based receivers and presents a novel methodology to accurately calculate their noise. The proposed methodology is then used to find the receiver that achieves the best sensitivity.
Second, the trade-off between sensitivity and power dissipation of the receiver is optimized to reduce the energy consumption per bit of the overall link. Design trade-offs for the receiver, transmitter, and the overall link are presented, and comparisons are made to study how much receiver sensitivity can be sacrificed to save its power dissipation before this power reduction is outpaced by the transmitter’s increase in power. Unlike conventional wisdom, our results show that energy-efficient links require low-power receivers with input capacitance much smaller than that required for noise-optimum performance.
Third, the thesis presents a novel equalization technique for optical receivers. A linear equalizer (LE) is realized by adding a pole in the feedback paths of an active feedback-based wideband amplifier. By embedding the peaking in the main amplifier (MA), the front-end meets the sensitivity and gain of conventional LE-based receivers with better energy efficiency by eliminating the standalone equalizer stage(s). Electrical measurements are presented to demonstrate the capability of the proposed technique in restoring the bandwidth and improving the performance over the conventional design
Wireless Testing of Integrated Circuits.
Integrated circuits (ICs) are usually tested during manufacture by means of automatic testing equipment (ATE) employing probe cards and needles that make repeated physical contact with the ICs under test. Such direct-contact probing is very costly and imposes limitations on the use of ATE. For example, the probe needles must be frequently cleaned or replaced, and some emerging technologies such as three-dimensional ICs cannot be probed at all. As an alternative to conventional probe-card testing, wireless testing has been proposed. It mitigates many of the foregoing problems by replacing probe needles and contact points with wireless communication circuits. However, wireless testing also raises new problems which are poorly understood such as: What is the most suitable wireless communication technique to employ, and how well does it work in practice?
This dissertation addresses the design and implementation of circuits to support wireless testing of ICs. Various wireless testing methods are investigated and evaluated with respect to their practicality. The research focuses on near-field capacitive communication because of its efficiency over the very short ranges needed during IC manufacture. A new capacitive channel model including chip separation, cross-talk, and misalignment effects is proposed and validated using electro-magnetic simulation studies to provide the intuitions for efficient antenna and circuit design. We propose a compact clock and data recovery architecture to avoid a dedicated clock channel. An analytical model which predicts the DC-level fluctuation due to the capacitive channel is presented. Based on this model, feed-forward clock selection is designed to enhance performance. A method to select proper channel termination is discussed to maximize the channel efficiency for return-to-zero signaling.
Two prototype ICs incorporating wireless testing systems were fabricated and tested with the proposed methods of testing digital circuits. Both successfully demonstrated gigahertz communication speeds with a bit-error rate less than 10^−11. A third prototype IC containing analog voltage measurement circuits was implemented to determine the feasibility of wirelessly testing analog circuits. The fabricated prototype achieved satisfactory voltage measurement with 1 mV resolution. Our work demonstrates the validity of the proposed models and the feasibility of near-field capacitive communication for wireless testing of ICs.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/93993/1/duelee_1.pd
Circuit design and analysis for on-FPGA communication systems
On-chip communication system has emerged as a prominently important subject in Very-Large-
Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects.
Interconnects often dictates the system performance, and, therefore, research for new
methodologies and system architectures that deliver high-performance communication services
across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable
Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication.
Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable
fabrics, switches and the specific routing architecture also introduce additional latency
and bandwidth degradation further hindering intra-chip communication performance.
Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs.
Communication with programmable interconnect received little attention and is inadequately understood.
This thesis is among the first to research on-chip communication systems that are built on
top of programmable fabrics and proposes methodologies to maximize the interconnect throughput
performance. There are three major contributions in this thesis: (i) an analysis of on-chip
interconnect fringing, which degrades the bandwidth of communication channels due to routing
congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly
improves the interconnect throughput by exploiting the fundamental electrical characteristics
of the reconfigurable interconnect structures. This new scheme can potentially mitigate
the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide
adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime
optimization for route planning and dynamic routing which, effectively utilizes the in-silicon
bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new
methodologies and concepts are proposed to enhance the on-FPGA communication throughput
performance that is of vital importance in new technology processes
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