Design of a Time-of-Flight Sensor with Standard Pinned-Photodiode Devices Towards 100 MHz Modulation Frequency

We present an indirect Time-of-Flight (ToF) sensor based on standard pinned-photodiode (PPD) devices and design guides to pave the way for the development of a ToF pixel operating at 100 MHz modulation frequency. The standard PPDs are established well as predominant devices for 2-D color imagers in these days because of their low noise characteristic, but slow transfer speed of photo-generated electrons still prevents them from being employed to 3-D depth imagers. Optimized PPD structure with no process modifications is introduced to create a lateral electric field for enhancing charge transfer speed inside the PPD, and essential design parameters for achieving high operating frequency such as the epitaxial layer thickness, the pinning voltage, and the threshold voltage of the transfer gates are discussed with TCAD simulation results in this paper. Prototype indirect ToF sensors with various structures and parameters were fabricated using a 0.11-??m standard CIS process and characterized fully. We successfully evaluated the demodulation contrast of each pixel at 10 to 75 MHz frequencies, figuring out the suitable conditions of the PPD-based pixel. The best pixel operating at 50 MHz frequency demonstrated a depth resolution of less than 13 mm and a linearity error of about 3.7% between 1 and 3 m distance with a zeroorder calibration. We believe further optimization of the ToF pixel incorporated with the PPD devices is possible to improve the performance, operating it towards 100 MHz modulation frequency

CMOS Sensors for Time-Resolved Active Imaging

In the past decades, time-resolved imaging such as fluorescence lifetime or time-of-flight depth imaging has been extensively explored in biomedical and industrial fields because of its non-invasive characterization of material properties and remote sensing capability. Many studies have shown its potential and effectiveness in applications such as cancer detection and tissue diagnoses from fluorescence lifetime imaging, and gesture/motion sensing and geometry sensing from time-of-flight imaging. Nonetheless, time-resolved imaging has not been widely adopted due to the high cost of the system and performance limits. The research presented in this thesis focuses on the implementation of low-cost real-time time-resolved imaging systems. Two image sensing schemes are proposed and implemented to address the major limitations. First, we propose a single-shot fluorescence lifetime image sensors for high speed and high accuracy imaging. To achieve high accuracy, previous approaches repeat the measurement for multiple sampling, resulting in long measurement time. On the other hand, the proposed method achieves both high speed and accuracy at the same time by employing a pixel-level processor that takes and compresses the multiple samples within a single measurement time. The pixels in the sensor take multiple samples from the fluorescent optical signal in sub-nanosecond resolution and compute the average photon arrival time of the optical signal. Thanks to the multiple sampling of the signal, the measurement is insensitive to the shape or the pulse-width of excitation, providing better accuracy and pixel uniformity than conventional rapid lifetime determination (RLD) methods. The proposed single-shot image sensor also improves the imaging speed by orders of magnitude compared to other conventional center-of-mass methods (CMM). Second, we propose a 3-D camera with a background light suppression scheme which is adaptable to various lighting conditions. Previous 3-D cameras are not operable in outdoor conditions because they suffer from measurement errors and saturation problems under high background light illumination. We propose a reconfigurable architecture with column-parallel discrete-time background light cancellation circuit. Implementing the processor at the column level allows an order of magnitude reduction in pixel size as compared to existing pixel-level processors. The column-level approach also provides reconfigurable operation modes for optimal performance in all lighting conditions. For example, the sensor can operate at the best frame-rate and resolution without the presence of background light. If the background light saturates the sensor or increases the shot noise, the sensor can adjust the resolution and frame-rate by pixel binning and superresolution techniques. This effectively enhances the well capacity of the pixel to compensate for the increase shot noise, and speeds up the frame processing to handle the excessive background light. A fabricated prototype sensor can suppress the background light more than 100-klx while achieving a very small pixel size of 5.9μm.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/136950/1/eecho_1.pd

CMOS SPAD-based image sensor for single photon counting and time of flight imaging

The facility to capture the arrival of a single photon, is the fundamental limit to the detection of quantised electromagnetic radiation. An image sensor capable of capturing a picture with this ultimate optical and temporal precision is the pinnacle of photo-sensing. The creation of high spatial resolution, single photon sensitive, and time-resolved image sensors in complementary metal oxide semiconductor (CMOS) technology offers numerous benefits in a wide field of applications. These CMOS devices will be suitable to replace high sensitivity charge-coupled device (CCD) technology (electron-multiplied or electron bombarded) with significantly lower cost and comparable performance in low light or high speed scenarios. For example, with temporal resolution in the order of nano and picoseconds, detailed three-dimensional (3D) pictures can be formed by measuring the time of flight (TOF) of a light pulse. High frame rate imaging of single photons can yield new capabilities in super-resolution microscopy. Also, the imaging of quantum effects such as the entanglement of photons may be realised. The goal of this research project is the development of such an image sensor by exploiting single photon avalanche diodes (SPAD) in advanced imaging-specific 130nm front side illuminated (FSI) CMOS technology. SPADs have three key combined advantages over other imaging technologies: single photon sensitivity, picosecond temporal resolution and the facility to be integrated in standard CMOS technology. Analogue techniques are employed to create an efficient and compact imager that is scalable to mega-pixel arrays. A SPAD-based image sensor is described with 320 by 240 pixels at a pitch of 8μm and an optical efficiency or fill-factor of 26.8%. Each pixel comprises a SPAD with a hybrid analogue counting and memory circuit that makes novel use of a low-power charge transfer amplifier. Global shutter single photon counting images are captured. These exhibit photon shot noise limited statistics with unprecedented low input-referred noise at an equivalent of 0.06 electrons. The CMOS image sensor (CIS) trends of shrinking pixels, increasing array sizes, decreasing read noise, fast readout and oversampled image formation are projected towards the formation of binary single photon imagers or quanta image sensors (QIS). In a binary digital image capture mode, the image sensor offers a look-ahead to the properties and performance of future QISs with 20,000 binary frames per second readout with a bit error rate of 1.7 x 10-3. The bit density, or cumulative binary intensity, against exposure performance of this image sensor is in the shape of the famous Hurter and Driffield densitometry curves of photographic film. Oversampled time-gated binary image capture is demonstrated, capturing 3D TOF images with 3.8cm precision in a 60cm range

Miniature high dynamic range time-resolved CMOS SPAD image sensors

Since their integration in complementary metal oxide (CMOS) semiconductor technology in 2003, single photon avalanche diodes (SPADs) have inspired a new era of low cost high integration quantum-level image sensors. Their unique feature of discerning single photon detections, their ability to retain temporal information on every collected photon and their amenability to high speed image sensor architectures makes them prime candidates for low light and time-resolved applications. From the biomedical field of fluorescence lifetime imaging microscopy (FLIM) to extreme physical phenomena such as quantum entanglement, all the way to time of flight (ToF) consumer applications such as gesture recognition and more recently automotive light detection and ranging (LIDAR), huge steps in detector and sensor architectures have been made to address the design challenges of pixel sensitivity and functionality trade-off, scalability and handling of large data rates. The goal of this research is to explore the hypothesis that given the state of the art CMOS nodes and fabrication technologies, it is possible to design miniature SPAD image sensors for time-resolved applications with a small pixel pitch while maintaining both sensitivity and built -in functionality. Three key approaches are pursued to that purpose: leveraging the innate area reduction of logic gates and finer design rules of advanced CMOS nodes to balance the pixel’s fill factor and processing capability, smarter pixel designs with configurable functionality and novel system architectures that lift the processing burden off the pixel array and mediate data flow. Two pathfinder SPAD image sensors were designed and fabricated: a 96 × 40 planar front side illuminated (FSI) sensor with 66% fill factor at 8.25μm pixel pitch in an industrialised 40nm process and a 128 × 120 3D-stacked backside illuminated (BSI) sensor with 45% fill factor at 7.83μm pixel pitch. Both designs rely on a digital, configurable, 12-bit ripple counter pixel allowing for time-gated shot noise limited photon counting. The FSI sensor was operated as a quanta image sensor (QIS) achieving an extended dynamic range in excess of 100dB, utilising triple exposure windows and in-pixel data compression which reduces data rates by a factor of 3.75×. The stacked sensor is the first demonstration of a wafer scale SPAD imaging array with a 1-to-1 hybrid bond connection. Characterisation results of the detector and sensor performance are presented. Two other time-resolved 3D-stacked BSI SPAD image sensor architectures are proposed. The first is a fully integrated 5-wire interface system on chip (SoC), with built-in power management and off-focal plane data processing and storage for high dynamic range as well as autonomous video rate operation. Preliminary images and bring-up results of the fabricated 2mm² sensor are shown. The second is a highly configurable design capable of simultaneous multi-bit oversampled imaging and programmable region of interest (ROI) time correlated single photon counting (TCSPC) with on-chip histogram generation. The 6.48μm pitch array has been submitted for fabrication. In-depth design details of both architectures are discussed

Resolving Measurement Errors Inherent with Time-of-Flight Range Imaging Cameras

Range imaging cameras measure the distance to objects in the field-of-view (FoV) of the camera, these cameras enable new machine vision applications in robotics, manufacturing, and human computer interaction. Time-of-flight (ToF) range cameras operate by illuminating the scene with amplitude modulated continuous wave (AMCW) light and measuring the phase difference between the emitted and reflected modulation envelope. Currently ToF range cameras suffer from measurement errors that are highly scene dependent, and these errors limit the accuracy of the depth measurement. The major cause of measurement errors is multiple propagation paths from the light source to pixel, known as multi path interference. Multi-path interference typically arises from: inter reflections, lens flare, subsurface scattering, volumetric scattering, and translucent objects. This thesis contributes three novel methods for resolving multi-path interference: coding in time, coding in frequency, and coding in space. Time coding is implemented by replacing the single frequency amplitude modulation with a binary sequence. Fundamental to ToF range cameras is the cross-correlation between the reflected light and a reference signal. The measured cross-correlation depends on the selection of the binary sequence. With selection of an appropriate binary sequence and using sparse deconvolution on the measured cross-correlation the multiple return path lengths and their amplitudes can be recovered. However, the minimal resolvable path length is dependent on the highest frequency in the binary sequence. Frequency coding is implemented by taking multiple measurements at different modulation frequencies. A subset of frequency coding is operating the camera in a mode analogous to stepped frequency continuous wave (SFCW). Frequency coding uses techniques from radar to resolve multiple propagation paths. The minimal resolvable path length is dependent on the camera's modulation bandwidth and the spectrum estimation technique used to recover distance, and it is shown that SFCW can be used to measure depth of objects behind a translucent sheet, while AMCW measurements can not. Path lengths below quarter a wavelength of the highest modulation frequency are difficult to resolve. The use of spatial coding is used to resolve diffuse multi-path interference. The original technique comes from direct and global separation in computer graphics, and it is modified to operate on the complex data produced by a ToF range camera. By illuminating the scene with a pattern the illuminated areas contain the direct return and the scattering (global return). The non-illuminated regions contain the scattering return, assuming the global component is spatially smooth. The direct and global separation with sinusoidal patterns is combining with the sinusoidal modulation signal of ToF range cameras for a closed form solution to multi-path interference in nine frames. With nine raw frames it is possible to implement direct and global separation at video frame rates. The RMSE of a corner is reduced from 0.0952 m to 0.0112 m. Direct and global separation correctly measures the depth of a diffuse corner, and resolves subsurface scattering however fails to resolve specular reflections. Finally the direct and global separation is combined with replacing the illumination and reference signals with a binary sequence. The combination allows for resolving diffuse multi-path interference present in a corner, with the sparse multi-path interference caused mixed pixels between the foreground and background. The corner is correctly measured and the number of mixed pixels is reduced by 90%. With the development of new methods to resolve multi-path interference ToF range cameras can measure scenes with more confidence. ToF range cameras can be built into small form factors as they require a small number of parts: a pixel array, a light source and a lens. The small form factor coupled with accurate range measurements allows ToF range cameras to be embedded in cellphones and consumer electronic devices, enabling wider adoption and advantages over competing range imaging technologies

Fluorescence Methods for Investigation of Living Cells and Microorganisms

Fluorescence methods play a leading role in the investigation of biological objects. They are the only non-destructive methods for investigating living cells and microorganisms in vivo. Using intrinsic and artificial fluorescence methods provides deep insight into mechanisms underlying physiological and biochemical processes. This book covers a wide range of modern methods involved in experimental biology. It illustrates the use of fluorescence microscopy and spectroscopy, confocal laser scanning microscopy, flow cytometry, delayed fluorescence, pulse-amplitude-modulation fluorometry, and fluorescent dye staining protocols. This book provides an overview of practical and theoretical aspects of fluorescence methods and their successful application in the investigation of static and dynamic processes in living cells and microorganisms

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering

Conference on Charge-Coupled Device Technology and Applications

Papers were presented from the conference on charge coupled device technology and applications. The following topics were investigated: data processing; infrared; devices and testing; electron-in, x-ray, radiation; and applications. The emphasis was on the advances of mutual relevance and potential significance both to industry and NASA's current and future requirements in all fields of imaging, signal processing and memory