Design of Touch Screen Controller IC for Transparent Fingerprint Sensor

Department of Electrical EngineeringA design of system architecture and analog-front-end (AFE) with high SNR and high frame rate for mutual capacitive touch screen with multiple electrodes is presented. Firstly, a differential continuous-mode parallel operation architecture (DCPA) is proposed for large-sized TSP. The proposed architecture achieves a high product of signal-to-noise ratio (SNR) and frame rate, which is a requirement of ROIC for large-sized TSP. DCPA is accomplished by using the proposed differential sensing method with a parallel architecture in a continuous-mode. A continuous-type differential charge amplifier removes the common-mode noise component, and reduces the self-noise by the band-pass filtering effect of the continuous-mode charge amplifier. In addition, the differential parallel architecture cancels the timing skew problem caused by the continuous-mode parallel operation and effectively enhances the power spectrum density of the signal. The proposed ROIC was fabricated using a 0.18-um CMOS process and occupied an active area of 1.25 mm2. The proposed system achieved a 72 dB SNR and 240 Hz frame rate with a 32 channel TX by 10 channel RX mutual capacitive TSP. Moreover, the proposed differential-parallel architecture demonstrated higher immunity to lamp noise and display noise. The proposed system consumed 42.5 mW with a 3.3-V supply. Secondly, readout IC (ROIC) with a differential coded multiple signaling method (DCMS) is proposed to detect an atto-farad capacitance difference for fingerprint recognition in fingerprint TSP. A readout IC with high SNR and fast frame rate are required in the fingerprint recognition. However, the capacitance difference by the ridge and valley of the fingerprint is very small, so that the signal-to-noise ratio is very low. In addition, it takes long time to scan whole fingerprint TSP with multiple electrodes. A fully differential architecture with differential signaling is proposed to detect the low capacitance difference in fingerprint TSP. The internal noise generated is minimized by 2nd fully differential operational amplifier and external noise is eliminated by a lock-in sensing structure. In addition, DCMS reduces an AC offset and enhances a higher product of SNR and frame rate in multiple channels. The proposed architectures can distinguish a 50-atto-farad which is a capacitance difference resulted from the ridges and valley of the finger under the 0.3T glass. The total scan time for 42 ?? 42 fingerprint TSP is less than 21 ms and the power consumption is below 20 mW at 3.3 V supply voltage. IC has been fabricated using a 0.18 ??m standard CMOS process.ope

Capacitive Touch Panel with Low Sensitivity to Water Drop employing Mutual-coupling Electrical Field Shaping Technique

This paper proposes a novel method to reduce the water interference on the touch panel based on mutual-capacitance sensing in human finger detection. As the height of a finger (height >10 mm) is far larger than that of a water-drop (height 10 mm) and low in the low-height space (height <1 mm), the sensing cell can be designed to distinguish the finger from the water-drop. To achieve this density distribution of the electrical field, the mutual-coupling electrical field shaping (MEFS) technique is employed to build the sensing cell. The drawback of the MEFS sensing cell is large parasitic capacitance, which can be overcome by a readout IC with low sensitivity to parasitic capacitance. Experiments show that the output of the IC with the MEFS sensing cell is 1.11 V when the sensing cell is touched by the water-drop and 1.23 V when the sensing cell is touched by the finger, respectively. In contrast, the output of the IC with the traditional sensing cell is 1.32 and 1.33 V when the sensing cell is touched by the water-drop and the finger, respectively. This demonstrates that the MEFS sensing cell can better distinguish the finger from the water-drop than the traditional sensing cell does.National Research Foundation (NRF)Accepted versionThis work was supported in part by the National Natural Science Foundation of China (NSFC) under Grant 61771363, in part by the China Scholarship Council (CSC) under Grant 201706960042, and in part by the National Research Foundation of Singapore under Grant NRF-CRP11-2012-01

MEMS Technology for Biomedical Imaging Applications

Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community

EUROSENSORS XVII : book of abstracts

Fundação Calouste Gulbenkien (FCG).Fundação para a Ciência e a Tecnologia (FCT)

Particle Physics Reference Library

This second open access volume of the handbook series deals with detectors, large experimental facilities and data handling, both for accelerator and non-accelerator based experiments. It also covers applications in medicine and life sciences. A joint CERN-Springer initiative, the “Particle Physics Reference Library” provides revised and updated contributions based on previously published material in the well-known Landolt-Boernstein series on particle physics, accelerators and detectors (volumes 21A,B1,B2,C), which took stock of the field approximately one decade ago. Central to this new initiative is publication under full open access

Imaging Sensors and Applications

In past decades, various sensor technologies have been used in all areas of our lives, thus improving our quality of life. In particular, imaging sensors have been widely applied in the development of various imaging approaches such as optical imaging, ultrasound imaging, X-ray imaging, and nuclear imaging, and contributed to achieve high sensitivity, miniaturization, and real-time imaging. These advanced image sensing technologies play an important role not only in the medical field but also in the industrial field. This Special Issue covers broad topics on imaging sensors and applications. The scope range of imaging sensors can be extended to novel imaging sensors and diverse imaging systems, including hardware and software advancements. Additionally, biomedical and nondestructive sensing applications are welcome

CEPC Technical Design Report -- Accelerator (v2)

The Circular Electron Positron Collider (CEPC) is a large scientific project initiated and hosted by China, fostered through extensive collaboration with international partners. The complex comprises four accelerators: a 30 GeV Linac, a 1.1 GeV Damping Ring, a Booster capable of achieving energies up to 180 GeV, and a Collider operating at varying energy modes (Z, W, H, and ttbar). The Linac and Damping Ring are situated on the surface, while the Booster and Collider are housed in a 100 km circumference underground tunnel, strategically accommodating future expansion with provisions for a Super Proton Proton Collider (SPPC). The CEPC primarily serves as a Higgs factory. In its baseline design with synchrotron radiation (SR) power of 30 MW per beam, it can achieve a luminosity of 5e34 /cm^2/s^1, resulting in an integrated luminosity of 13 /ab for two interaction points over a decade, producing 2.6 million Higgs bosons. Increasing the SR power to 50 MW per beam expands the CEPC's capability to generate 4.3 million Higgs bosons, facilitating precise measurements of Higgs coupling at sub-percent levels, exceeding the precision expected from the HL-LHC by an order of magnitude. This Technical Design Report (TDR) follows the Preliminary Conceptual Design Report (Pre-CDR, 2015) and the Conceptual Design Report (CDR, 2018), comprehensively detailing the machine's layout and performance, physical design and analysis, technical systems design, R&D and prototyping efforts, and associated civil engineering aspects. Additionally, it includes a cost estimate and a preliminary construction timeline, establishing a framework for forthcoming engineering design phase and site selection procedures. Construction is anticipated to begin around 2027-2028, pending government approval, with an estimated duration of 8 years. The commencement of experiments could potentially initiate in the mid-2030s.Comment: 1106 page