Sustainable 3D printed electronics with sheath conductors

Sustainable manufacturing practices have been an essential consideration in recent years. 3D printing will be a key technology in the transition towards sustainability because it minimizes material consumption and waste generation. One area that could benefit from 3D printing techniques would be the production of printed circuit boards and electronics in which most of the copper used is etched in subsequent steps. Comparatively, 3D printing minimizes waste by depositing conductive material only where desired. However, the conductive material used, commonly a silver-based printable material, is expensive and further reductions are required to ensure sustainability. In high frequency applications, owing to the skin effect, the core of a conductor carries little electrical current and thus could be replaced with a cheaper plastic. To accomplish this, custom nozzles capable of printing these sheath conductors were developed and tested by printing an embedded inductor for wireless power transfer

Printing of wirelessly rechargeable solid-state supercapacitors for soft, smart contact lenses with continuous operations

Recent advances in smart contact lenses are essential to the realization of medical applications and vision imaging for augmented reality through wireless communication systems. However, previous research on smart contact lenses has been driven by a wired system or wireless power transfer with temporal and spatial restrictions, which can limit their continuous use and require energy storage devices. Also, the rigidity, heat, and large sizes of conventional batteries are not suitable for the soft, smart contact lens. Here, we describe a human pilot trial of a soft, smart contact lens with a wirelessly rechargeable, solid-state supercapacitor for continuous operation. After printing the supercapacitor, all device components (antenna, rectifier, and light-emitting diode) are fully integrated with stretchable structures for this soft lens without obstructing vision. The good reliability against thermal and electromagnetic radiations and the results of the in vivo tests provide the substantial promise of future smart contact lenses

Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages