Beyond solid-state lighting: Miniaturization, hybrid integration, and applications og GaN nano- and micro-LEDs

Gallium Nitride (GaN) light-emitting-diode (LED) technology has been the revolution in modern lighting. In the last decade, a huge global market of efficient, long-lasting and ubiquitous white light sources has developed around the inception of the Nobel-price-winning blue GaN LEDs. Today GaN optoelectronics is developing beyond lighting, leading to new and innovative devices, e.g. for micro-displays, being the core technology for future augmented reality and visualization, as well as point light sources for optical excitation in communications, imaging, and sensing. This explosion of applications is driven by two main directions: the ability to produce very small GaN LEDs (microLEDs and nanoLEDs) with high efficiency and across large areas, in combination with the possibility to merge optoelectronic-grade GaN microLEDs with silicon microelectronics in a fully hybrid approach. GaN LED technology today is even spreading into the realm of display technology, which has been occupied by organic LED (OLED) and liquid crystal display (LCD) for decades. In this review, the technological transition towards GaN micro- and nanodevices beyond lighting is discussed including an up-to-date overview on the state of the art

Single event effects in 0.18 μm CMOS image sensors

CMOS image sensors are widely used on Earth and are becoming increasingly favourable for use in space. Advantages, such as low power consumption, and ever-improving imaging peformance make CMOS an attractive option. The ability to integrate camera functions on-chip, such as biasing and sequencing, simplifies designing with CMOS sensors and can improve system reliablity. One potential disadvantage to the use of CMOS is the possibility of single event effects, such as single event latchup (SEL), which can cause malfunctions or even permanent destruction of the sensor. These single event effects occur in the space environment due to the high levels of radiation incident on the sensor. This work investigates the ocurrence of SEL in CMOS image sensors subjected to heavy-ion irradiation. Three devices are investigated, two of which have triple-well doping implants. The resulting latchup cross-sections are presented. It is shown that using a deep p well on 18 μm epitaxial silicon increases the radiation hardness of the sensor against latchup. The linear energy transfer (LET) threshold for latchup is increased when using this configuration. Our findings suggest deep p wells can be used to increase the radiation tollerance of CMOS image sensors for use in future space missions

Radiation Damage in CMOS Image Sensors for Space Applications

The space radiation environment is damaging to silicon devices, such as Complementary Metal Oxide Semiconductor (CMOS) image sensors, affecting their performance over time or causing total failure. The first part of this work investigates a Charge Coupled Device (CCD) style CMOS image sensor designed for TDI (Time Delay and Integration) mode imaging, a mode commonly used for Earth observation. Damage from high energy protons in the space environment decreases the Charge Transfer Efficiency (CTE) and increases the dark current of such devices. Experimental work on proton damaged devices is presented, showing the effects on CTE and dark current. The results are compared to a standard CCD by a simulation to take into account the different dimensions and operating conditions of the two devices. The second part of this work describes an experimental campaign to determine the effects of process variations (namely the introduction of deep doping wells and the variation of epitaxial silicon thickness) on the rate of Single Event Latchup (SEL) in CMOS Active Pixel Sensor (APS) devices. SEL is a potentially destructive phenomenon which occurs in CMOS technology but not in CCDs. Test devices were subjected to heavy ion bombardement and SEL rates recorded for a range of heavy ions causing varying amounts of ionisation. A simulation using Technology Computer Aided Design (TCAD) was developed to predict the SEL rates due to heavy ions and to understand the characteristic shape of the SEL cross section vs. Linear Energy Transfer (LET) curves produced by SEL experiments. The simuation was carried out for structures representative of each of the design variants

Design and Fabrication of Vertically-Integrated CMOS Image Sensors

Technologies to fabricate integrated circuits (IC) with 3D structures are an emerging trend in IC design. They are based on vertical stacking of active components to form heterogeneous microsystems. Electronic image sensors will benefit from these technologies because they allow increased pixel-level data processing and device optimization. This paper covers general principles in the design of vertically-integrated (VI) CMOS image sensors that are fabricated by flip-chip bonding. These sensors are composed of a CMOS die and a photodetector die. As a specific example, the paper presents a VI-CMOS image sensor that was designed at the University of Alberta, and fabricated with the help of CMC Microsystems and Micralyne Inc. To realize prototypes, CMOS dies with logarithmic active pixels were prepared in a commercial process, and photodetector dies with metal-semiconductor-metal devices were prepared in a custom process using hydrogenated amorphous silicon. The paper also describes a digital camera that was developed to test the prototype. In this camera, scenes captured by the image sensor are read using an FPGA board, and sent in real time to a PC over USB for data processing and display. Experimental results show that the VI-CMOS prototype has a higher dynamic range and a lower dark limit than conventional electronic image sensors

Image Sensor with General Spatial Processing in a 3D Integrated Circuit Technology

An architectural overview of an image sensor with general spatial processing capabilities on the focal plane is presented. The system has been fabricated on two separate tiers, implemented on silicon-on-insulator technology with vertical interconnect capabilities. One tier is dedicated to imaging, where photosensitivity and pixel fill have been optimized. The subsequent layers contain noise suppression and digitally controlled analog processing elements, where general spatial filtering is computed. The digitally controlled aspect of the processing unit allows generic receptive fields to be computed on read out. The image is convolved with four receptive fields in parallel. The chip provides parallel readout of the filtered results and the intensity image

Enabling Technologies for Next Generation Ultraviolet Astrophysics, Planetary, and Heliophysics Missions

Our study sought to create a new paradigm in UV instrument design, detector technology, and optics that will form the technological foundation for a new generation of ultraviolet missions. This study brought together scientists and technologists representing the broad community of astrophysicists, planetary and heliophysics physicists, and technologists working in the UV. Next generation UV missions require major advances in UV instrument design, optics and detector technology. UV offers one of the few remaining areas of the electromagnetic spectrum where this is possible, by combining improvements in detector quantum efficiency (5-10x), optical coatings and higher-performance wide-field spectrometers (5-10x), and increasing multiplex advantage (100-1000x). At the same time, budgets for future missions are tightly constrained. Attention has begun to turn to small and moderate class missions to provide new observational capabilities on timescales that maintain scientific vitality. Developments in UV technology offer a comparatively unique opportunity to conceive of small (Explorer) and moderate (Probe, Discovery, New Millennium) class missions that offer breakthrough science. Our study began with the science, reviewing the breakthrough science questions that compel the development of new observational capabilities in the next 10-20 years. We invented a framework for highlighting the objectives of UV measurement capabilities: following the history of baryons from the intergalactic medium to stars and planets. In astrophysics, next generation space UV missions will detect and map faint emission and tomographically map absorption from intergalactic medium baryons that delineate the structure of the Universe, map the circum-galactic medium that is the reservoir of galaxy-building gas, map the warm-hot ISM of our Galaxy, explore star-formation within the Local group and beyond, trace gas in proto-planetary disks and extended atmospheres of exoplanets, and record the transient UV universe. Solar system planetary atmospheric physics and chemistry, aurorae, surface composition and magnetospheric environments and interactions will be revealed using UV spectroscopy. UV spectroscopy may even detect life on an exoplanet. Our study concluded that with UV technology developments within reach over the next 5- 10 years, we can conceive moderate-class missions that will answer many of the compelling science questions driving the field. We reviewed the science measurement requirements for these pioneering new areas and corresponding technology requirements. We reviewed and evaluated the emerging technologies, and developed a figure of merit based on potential science impact, state of readiness, required investment, and potential for highly leveraged progress in a 5-10 year horizon. From this we were able to develop a strategy for technology development. Some of this technology development will be subject to funding calls from federal agencies. A subset form a portfolio of highly promising technologies that are ideal for funding from a KISS Development Program. One of our study’s principal conclusions was that UV detector performance drives every aspect of the scientific capability of future missions, and that two highly flexible detector technologies were at the tipping point for major breakthroughs. These are Gen-2 borosilicate Atomic Layer Deposition (ALD) coated microchannel plate detectors with GaN photocathodes, and ALDantireflection (AR) coated, delta-doped photon-counting CCD detectors. Both offer the potential for QE>50% combined with large formats and pixel counts, low background, and sky-limited photon-counting performance over the 100-300 nm band. Ramped AR coatings for spectroscopic detectors could achieve QE’s as high as 80%! A second conclusion was that UV coatings are on the threshold of a major breakthrough. UV coatings permeate every aspect of telescope and instrument design. Efficient, robust, ultra-thin and highly uniform reflective coatings applied with Atomic Layer Deposition (ALD) offer the possibility of high-performance, wide-field, highly-multiplexed UV spectrometers and a broadband reach covering the scientifically critical 100-120 nm range (home of 50% of all atomic and molecular resonance lines). Our study concluded that UV coating advances made possible by ALD is the principle technology advance that will enable a joint UV-optical general astrophysics and exoEarth imaging flagship mission. A third conclusion was that the revolution in micro- and nano-fabrication technology offers a cornucopia of new possibilities for revolutionary UV technology developments in the near future. An immediate example is the application of new microlithography techniques to patterning UV diffraction gratings that are highly efficient and designed to enable wide-field, high-resolution spectroscopy. These techniques could support the development of new detectors that could discriminate optical and UV photons and potentially energy-resolving detection. Relatively modest investments in technology development over the next 5-10 years could provide advances in detectors, coatings, diffractive elements, and filters that would result in an effective increase in science capability of 100-1000! The study brought together a diverse community, led to many new ideas and collaborations, and brought cohesion and common purpose to UV practitioners. This will have a lasting and positive impact on the future of our field