22,442 research outputs found

    FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

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    The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm × 240 mm × 4.3 mm electro-optical midplane. Bit error rates of less than 10-12 and optical losses as low as 6 dB were demonstrated through nine multimode polymer wave guides with an aggregate data bandwidth of 92.8125 Gb/s

    FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

    Get PDF
    The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems. The resulting performance bottleneck can be substantially reduced by conveying high-speed data optically instead of electronically. A novel active pluggable 82.5 Gb/s aggregate bit rate optical connector technology, the design and fabrication of a compact electro-optical printed circuit board to meet exacting specifications, and a method for low cost, high precision, passive optical assembly are presented. A demonstration platform was constructed to assess the viability of embedded electro-optical midplane technology in such systems including the first ever demonstration of a pluggable active optical waveguide printed circuit board connector. High-speed optical data transfer at 10.3125 Gb/s was demonstrated through a complex polymer waveguide interconnect layer embedded into a 262 mm × 240 mm × 4.3 mm electro-optical midplane. Bit error rates of less than 10-12 and optical losses as low as 6 dB were demonstrated through nine multimode polymer wave guides with an aggregate data bandwidth of 92.8125 Gb/s

    High-bandwidth uni-traveling carrier waveguide photodetector on an InP-membrane-on-silicon platform

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    A uni-traveling carrier photodetector (UTC-PD), heterogeneously integrated on silicon, is demonstrated. It is fabricated in an InP-based photonic membrane bonded on a silicon wafer, using a novel double-sided processing scheme. A very high 3 dB bandwidth of beyond 67 GHz is obtained, together with a responsivity of 0.7 A/W at 1.55 ÎŒm wavelength. In addition, open eye diagrams at 54 Gb/s are observed. These results promise high speed applications using a novel full-functionality photonic platform on silicon

    Ono: an open platform for social robotics

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    In recent times, the focal point of research in robotics has shifted from industrial ro- bots toward robots that interact with humans in an intuitive and safe manner. This evolution has resulted in the subfield of social robotics, which pertains to robots that function in a human environment and that can communicate with humans in an int- uitive way, e.g. with facial expressions. Social robots have the potential to impact many different aspects of our lives, but one particularly promising application is the use of robots in therapy, such as the treatment of children with autism. Unfortunately, many of the existing social robots are neither suited for practical use in therapy nor for large scale studies, mainly because they are expensive, one-of-a-kind robots that are hard to modify to suit a specific need. We created Ono, a social robotics platform, to tackle these issues. Ono is composed entirely from off-the-shelf components and cheap materials, and can be built at a local FabLab at the fraction of the cost of other robots. Ono is also entirely open source and the modular design further encourages modification and reuse of parts of the platform

    All-Optical Modulation in a Silicon Waveguide Based on a Single-Photon Process

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    All-optical, low-power modulation is a major goal in photonics. Because of their high mode-field concentration and ease of manufacturing, nanoscale silicon waveguides offer an intriguing platform for photonics. So far, all-optical modulators built with silicon photonic circuits have relied on either two-photon absorption or the Kerr effect. Both effects are weak in silicon, and require extremely high (~5 W) peak optical power levels to achieve modulation. Here, we describe an all-optical Mach-Zehnder modulator based on a single-photon absorption (SPA) process, fabricated entirely in silicon. Our SPA modulator is based on a process by which a single photon at 1.55 mum is absorbed and an apparently free-carrier-mediated process causes an index shift in silicon, even though the photon energy does not exceed that of silicon's bandgap. We demonstrate all-optical modulation with a gate response of 1deg/mW at 0.5 Gb/s. This is over an order of magnitude more responsive than typical previously demonstrated devices. Even without resonant enhancement, further engineering may enable all optical modulation with less than 10 mW of gate power required for complete extinction, and speeds of 5 Gb/s or higher

    Low-power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator

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    We present a novel driver circuit enabling electro-optic modulation with high extinction ratio from a co-designed silicon ring modulator. The driver circuit provides an asymmetric differential output at 10Gbps with a voltage swing up to 1.5V(pp) from a single 1.0V supply, maximizing the resonance-wavelength shift of depletion-type ring modulators while avoiding carrier injection. A test chip containing 4 reconfigurable driver circuits was fabricated in 40nm CMOS technology. The measured energy consumption for driving a 100fF capacitive load at 10Gbps was as low as 125fJ/bit and 220fJ/bit at 1V(pp) and 1.5V(pp) respectively. After flip-chip integration with ring modulators on a silicon-photonics chip, the power consumption was measured to be 210fJ/bit and 350fJ/bit respectively

    Silicon-based opto-electronic integration for high bandwidth density optical interconnects

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