Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications

Large scale data centers (DC) and high performance computing (HPC) systems require more and more computing power at higher energy efficiency. They are already consuming megawatts of power, and a linear extrapolation of trends reveals that they may eventually lead to unrealistic power consumption scenarios in order to satisfy future requirements (e.g., Exascale computing). Conventional complementary metal oxide semiconductor (CMOS)-based electronic interconnects are not expected to keep up with the envisioned future board-to-board and chip-to-chip (within multi-chip-modules) interconnect requirements because of bandwidth-density and power-consumption limitations. However, low-power and high-speed optics-based interconnects are emerging as alternatives for DC and HPC communications; they offer unique opportunities for continued energy-efficiency and bandwidth-density improvements, although cost is a challenge at the shortest length scales. Plasmonics-based interconnects on the other hand, due to their extremely small size, offer another interesting solution for further scaling operational speed and energy efficiency. At the device-level, CMOS compatibility is also an important issue, since ultimately photonics or plasmonics will have to be co-integrated with electronics. In this paper, we survey the available literature and compare the aforementioned interconnect technologies, with respect to their suitability for high-speed and energy-efficient on-chip and offchip communications. This paper refers to relatively short links with potential applications in the following interconnect distance hierarchy: local group of racks, board to board, module to module, chip to chip, and on chip connections. We compare different interconnect device modules, including low-energy output devices (such as lasers, modulators, and LEDs), photodetectors, passive devices (i.e., waveguides and couplers) and electrical circuitry (such as laserdiode drivers, modulator drivers, transimpedance, and limiting amplifiers). We show that photonic technologies have the potential to meet the requirements for selected HPC and DC applications in a shorter term. We also present that plasmonic interconnect modules could offer ultra-compact active areas, leading to high integration bandwidth densities, and low device capacitances allowing for ultra-high bandwidth operation that would satisfy the application requirements further into the future

Large-Scale Photonics Integration: Data Communications to Optical Beamforming

Integrated photonics is an emerging technology that has begun to transform our way of life with the same amount of impact that integrated CMOS electronics has. Currently, photonics integration is orders of magnitude less complicated than its electronics counterparts. Nonetheless, it serves as one of the main driving forces to meet the exponentially increasing demand for high-speed and low-cost data transfer in the Information Age. It also promises to provide solutions for next-generation high-sensitivity image sensors and precision metrology and spectroscopy instruments. In this thesis, integrated photonics architectures for solid-state photonic beamforming and processing are investigated for high-resolution and high sensitivity lens-free transceiver applications. Furthermore, high-efficiency integrated electro-optical modulators aiming to meet the demand of high-density photonic integration with improved modulation efficiency, small footprint, and lower insertion loss are investigated. Two integrated photonic solid-state beamforming architectures incorporating two-dimensional apertures are explored. First, a novel transceiver architecture for remote sensing, coherent imaging, and ranging applications is demonstrated. It reduces system implementation complexity and offers a methodology for very-large-scale coherent transceiver beamforming applications. Next, a transmitter beamforming architecture inspired by the diffraction pattern of the slit annular ring is analyzed and demonstrated. This transceiver architecture can be used for coherent beamforming applications such as imaging and point-to-point optical communication. Finally, a coherent imager architecture for high-sensitivity three-dimensional imaging and remote-sensing applications is present. This novel architecture can suppress undesired phase fluctuations of the optical carrier signal in the illumination and reference paths, providing higher resolution and higher acquisition speed than previous implementations. Moreover, several compact, high-speed CMOS compatible modulators that enable high-density photonic integration are explored. Ultra-compact and low insertion loss silicon-organic-hybrid modulators are designed and implemented for high-speed beamforming and high-efficiency complex signal modulation applications. Finally, a novel integrated nested-ring assisted modulator topology is analyzed and implemented for high-density and high modulation efficiency applications.</p