Design, evaluation, and control of nexus: a multiscale additive manufacturing platform with integrated 3D printing and robotic assembly.

Additive manufacturing (AM) technology is an emerging approach to creating three-dimensional (3D) objects and has seen numerous applications in medical implants, transportation, aerospace, energy, consumer products, etc. Compared with manufacturing by forming and machining, additive manufacturing techniques provide more rapid, economical, efficient, reliable, and complex manufacturing processes. However, additive manufacturing also has limitations on print strength and dimensional tolerance, while traditional additive manufacturing hardware platforms for 3D printing have limited flexibility. In particular, part geometry and materials are limited to most 3D printing hardware. In addition, for multiscale and complex products, samples must be printed, fabricated, and transferred among different additive manufacturing platforms in different locations, which leads to high cost, long process time, and low yield of products. This thesis investigates methods to design, evaluate, and control the NeXus, which is a novel custom robotic platform for multiscale additive manufacturing with integrated 3D printing and robotic assembly. NeXus can be used to prototype miniature devices and systems, such as wearable MEMS sensor fabrics, microrobots for wafer-scale microfactories, tactile robot skins, next generation energy storage (solar cells), nanostructure plasmonic devices, and biosensors. The NeXus has the flexibility to fixture, position, transport, and assemble components across a wide spectrum of length scales (Macro-Meso-Micro-Nano, 1m to 100nm) and provides unparalleled additive process capabilities such as 3D printing through both aerosol jetting and ultrasonic bonding and forming, thin-film photonic sintering, fiber loom weaving, and in-situ Micro-Electro-Mechanical System (MEMS) packaging and interconnect formation. The NeXus system has a footprint of around 4m x 3.5m x 2.4m (X-Y-Z) and includes two industrial robotic arms, precision positioners, multiple manipulation tools, and additive manufacturing processes and packaging capabilities. The design of the NeXus platform adopted the Lean Robotic Micromanufacturing (LRM) design principles and simulation tools to mitigate development risks. The NeXus has more than 50 degrees of freedom (DOF) from different instruments, precise evaluation of the custom robots and positioners is indispensable before employing them in complex and multiscale applications. The integration and control of multi-functional instruments is also a challenge in the NeXus system due to different communication protocols and compatibility. Thus, the NeXus system is controlled by National Instruments (NI) LabVIEW real-time operating system (RTOS) with NI PXI controller and a LabVIEW State Machine User Interface (SMUI) and was programmed considering the synchronization of various instruments and sequencing of additive manufacturing processes for different tasks. The operation sequences of each robot along with relevant tools must be organized in safe mode to avoid crashes and damage to tools during robots’ motions. This thesis also describes two demonstrators that are realized by the NeXus system in detail: skin tactile sensor arrays and electronic textiles. The fabrication process of the skin tactile sensor uses the automated manufacturing line in the NeXus with pattern design, precise calibration, synchronization of an Aerosol Jet printer, and a custom positioner. The fabrication process for electronic textiles is a combination of MEMS fabrication techniques in the cleanroom and the collaboration of multiple NeXus robots including two industrial robotic arms and a custom high-precision positioner for the deterministic alignment process

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Towards micro-assembly of hybrid MOEMS components on reconfigurable silicon free-space micro-optical bench.

International audienceThe 3D integration of hybrid chips is a viable approach for the micro-optical technologies to reduce the costs of assembly and packaging. In this paper a technology platform for the hybrid integration of MOEMS components on a reconfigurable free-space silicon micro-optical bench is presented. In this approach a desired optical component (e.g. micromirror, microlens) is integrated with removable and adjustable silicon holder which can be manipulated, aligned and fixed in the precisely etched rail of the silicon baseplate by use of robotic micro-assembly station. An active-based gripping system allows modification of the holder position on the baseplate with nanometre precision. The fabrication processes of the micromachined parts of the micro-optical bench, based on bulk micromachining of standard silicon wafer and SOI wafer, are described. The successful assembly of the holders, equipped with micromirror and refractive glass ball microlens, on the baseplate rail is demonstrated

Microassembly for complex and solid 3D MEMS by 3D Vision-based control.

International audienceThis paper describes the vision-based methods developed for assembly of complex and solid 3D MEMS (micro electromechanical systems) structures. The microassembly process is based on sequential robotic operations such as planar positioning, gripping, orientation in space and insertion tasks. Each of these microassembly tasks is performed using a posebased visual control. To be able to control the microassembly process, a 3D model-based tracker is used. This tracker able to directly provides the 3D micro-object pose at real-time and from only a single view of the scene. The methods proposed in this paper are validated by an automatic assembly of fives silicon microparts of 400 µm 400 µm 100 µm on 3- levels. The insertion tolerance (mechanical play) is estimated to 3 µm. The weakness of this insertion tolerance allows to obtain solid and complex micro electromechanical structures without any external joining (glue, wending). Promising positioning and orientation accuracies are obtained who can reach 0.3 µm in position and 0.2° in orientation

Explicit force control V.S. impedance control for micromanipulation.

International audienceThis paper presents a study of different force control schemes for controlling contact during manipulation tasks at the microscale. Explicit force control and impedance control are compared in a contact transition scenario consisting of a compliant microforce sensor mounted on a microrobotic positioner, and a compliant microstructure fabricated using Silicon MEMS. A traditional double mass-spring-damper model of the overall robot is employed to develop the closed-loop force controllers. Specific differences between the two control schemes due to the microscale nature of contact are highlighted in this paper from the experimental results obtained. The limitations and tradeoffs of the two control laws at the microscale due to the presence of backlash are discussed. A simple method to deal with the pull-off force effects specific to the microscale is proposed. Future improvements of the impedance control schemes to include adaptation are discussed in order to handle objects with unknown stiffness

Affordable flexible hybrid manipulator for miniaturised product assembly

Miniaturised assembly systems are capable of assembling parts of a few millimetres in size with an accuracy of a few micrometres. Reducing the size and the cost of such a system while increasing its flexibility and accuracy is a challenging issue. The introduction of hybrid manipulation, also called coarse/fine manipulation, within an assembly system is the solution investigated in this thesis. A micro-motion stage (MMS) is designed to be used as the fine positioning mechanism of the hybrid assembly system. MMSs often integrate compliant micro-motion stages (CMMSs) to achieve higher performances than the conventional MMSs. CMMSs are mechanisms that transmit an output force and displacement through the deformation of their structure. Although widely studied, the design and modelling techniques of these mechanisms still need to be improved and simplified. Firstly, the linear modelling of CMMSs is evaluated and two polymer prototypes are fabricated and characterised. It is found that polymer based designs have a low fabrication cost but not suitable for construction of a micro-assembly system. A simplified nonlinear model is then derived and integrated within an analytical model, allowing for the full characterisation of the CMMS in terms of stiffness and range of motion. An aluminium CMMS is fabricated based on the optimisation results from the analytical model and is integrated within an MMS. The MMS is controlled using dual-range positioning to achieve a low-cost positioning accuracy better than 2µm within a workspace of 4.4×4.4mm2. Finally, a hybrid manipulator is designed to assemble mobile-phone cameras and sensors automatically. A conventional robot manipulator is used to pick and place the parts in coarse mode while the aluminium CMMS based MMS is used for fine alignment of the parts. A high-resolution vision system is used to locate the parts on the substrate and to measure the relative position of the manipulator above MMS using a calibration grid with square patterns. The overall placement accuracy of the assembly system is ±24µm at 3σ and can reach 2µm, for a total cost of less than £50k, thus demonstrating the suitability of hybrid manipulation for desktop-size miniaturised assembly systems. The precision of the existing system could be significantly improved by making the manipulator stiffer (i.e. preloaded bearings…) and adjustable to compensate for misalignment. Further improvement could also be made on the calibration of the vision system. The system could be either scaled up or down using the same architecture while adapting the controllers to the scale.Engineering and Physical Sciences Research Council (EPSRC