Printed electronics

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed

Printed Electronics

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed

Printed Electronics

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed

Printed Electronics

Printed electronic device comprising a substrate onto at least one surface of which has been applied a layer of an electrically conductive ink comprising functionalized graphene sheets and at least one binder. A method of preparing printed electronic devices is further disclosed

3D Printed Electronics

Additive manufacturing is revolutionizing the way we build and produce a plethora of products spanning many industries. 3D printing, a subset of additive manufacturing, has shown strong potential in reduced energy use, sustainability and cost effectiveness. Exploring avenues that this technology can be utilized is key to improve productivity and efficiency in various applications; for example electronic systems and devices manufacturing.Electronic systems and sub-systems are built using a variety of materials and processes, which require a large carbon footprint, significant waste products and high production time. We have seen experiments of printed electronics using inkjet printing technology to provide a flexible and cheap production alternative to the traditional methods. Inkjet printing has been problematic and still faces numerous challenges such as quality and speed, in its use in electronic system manufacturing. In addition, inkjet printing does not integrate the other aspects of manufacturing like enclosure and final product assembly.We propose the application of 3D printing technology to support an integrative process for combining circuit board fabrication, solder mask process, electronic component pick and place and enclosure manufacturing. Though we have seen 3D printed circuits, they are crude and lack complexity. The extent of most of these 3D printed circuits have functionality of a button or switch. They do not have the ability to support analog functions with components like an op- amp or a digital circuits to the level of a complex computing system. The integration of these separate processes, circuit board fabrication, solder mask process, electronic component pick and place, and enclosure manufacturing, into a single high efficiency 3D printing additive manufacturing process will yield significant savings in energy use, carbon footprint, waste product, and production time and cost

An Investigation of Fundamental Competencies for Printed Electronics

A survey was taken of professionals in the printed electronics industry to determine the basic educational requirements the industry had of a student graduating with a degree in graphic communications or printing sciences. A test was conducted of graphic communication seniors graduating in May 2010 to determine their fundamental knowledge of printed electronics. Data obtained from the industry survey was used to determine the relevant components of a basic printed electronics education. The data obtained from the graduating senior examination determined their areas of knowledge of printed electronics. The needs identified from the industry survey were compared to the areas of knowledge of graphic communications graduating seniors. The knowledge deficiencies of graduating students were identified, and analyzed. It was determined that present graphic communications education is insufficient to meet the needs of the printed electronics industry. Further research was proposed to update graphic communication education to meet the needs of the printed electronics industry

BOK-Printed Electronics

The use of printed electronics technologies (PETs), 2D or 3D printing approaches either by conventional electronic fabrication or by rapid graphic printing of organic or nonorganic electronic devices on various small or large rigid or flexible substrates, is projected to grow exponentially in commercial industry. This has provided an opportunity to determine whether or not PETs could be applicable for low volume and high-reliability applications. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps- on this subject-OE-A, ITRS, and iNEMI-each with a different name identification for this emerging technology. This followed by a brief review of the status of the industry on standard development for this technology, including IEEE and IPC specifications. The report concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging. Understanding key technology roadmaps, parameters, and applications is important when judicially selecting and narrowing the follow-up of new and emerging applicable technologies for evaluation, as well as the low risk insertion of organic, large area, and printed electronics

Printed Electronics Applications for Publications

The purpose of this research was to demonstrate that the printing industry can potentially benefit from the incorporation of printed electronics into the publications and packaging fields. Taking advantage of this technology would attract more consumers, especially younger generations who are immersed in the digital world and feel more engaged with products that offer user interactivity. Experts in the field were interviewed to get information and feedback about the project. Also, a survey was conducted. Cal Poly students, from different areas and departments were included to see if they would be interested in subscribing or buying a magazine that incorporates printed electronics and then, determine if this project is possible considering the budget, plan, resources, information available, and the level of acceptance based on the survey results. The analysis of the results indicated that the printing industry can potentially benefit by the incorporation of printed electronics in the publications and packaging fields. This project would involve more people who specialize in different majors rather than Graphic Communication like Physics, Business, Editorial, etc. Also, many students expressed that they would be willing to purchase or subscribe to a magazine that incorporates printed electronics if the content is relevant to them and the cost is not expensive

Technological Integration in Printed Electronics

Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and—potentially—cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems