Microelectromechanical Systems (MEMS) Resistive Heaters as Circuit Protection Devices

With increased opportunities for the exploitation (i.e., reverse engineering) of vulnerable electronic components and systems, circuit protection has become a critical issue. Circuit protection techniques are generally software-based and include cryptography (encryption/decryption), obfuscation of codes, and software guards. Examples of hardware-based circuit protection include protective coatings on integrated circuits, trusted foundries, and macro-sized components that self-destruct, thus destroying critical components. This paper is the first to investigate the use of microelectromechanical systems (MEMS) to provide hardware-based protection of critical electronic components to prevent reverse engineering or other exploitation attempts. Specifically, surface-micromachined polycrystalline silicon to be used as meandering resistive heaters were designed analytically and fabricated using a commercially available MEMS prototyping service (i.e., PolyMUMPs), and integrated with representative components potentially at risk for exploitation, in this case pseudomorphic high-electron mobility transistors (pHEMTs). The MEMS heaters were initiated to self-destruct, destroying a critical circuit component and thwart a reverse engineering attempt. Tests revealed reliable self-destruction of the MEMS heaters with approximately 25 V applied, resulting in either complete operational failure or severely altering the pHEMT device physics. The prevalent failure mechanism was metallurgical, in that the material on the surface of the device was changed, and the specific failure mode was the creation of a short-circuit. Another failure mode was degraded device operation due to permanently altered device physics related to either dopant diffusion or ohmic contact degradation. The results, in terms of the failure of a targeted electronic component, demonstrate the utility of using MEMS devices to protect critical components which are otherwise vulnerable to exploitation

Mechanical Computing in Microelectromechanical Systems (MEMS)

Mechanical computing devices in polysilicon-based microelectromechanical systems (MEMS) were designed with the goal of developing computing devices for harsh environments, such as those with high dose radiation and high temperatures, as well as devices that may be able to interface with molecular or biological computer systems. The devices that were designed include both analog and digital computing devices. The analog devices include integrators, differentials (summers), multipliers, and those that perform trigonometric functions. The digital devices that were designed are inverters, NAND, NOR, and XOR logic gates. Analog-to-digital (A-to-D) and digital-to-analog (D-to-A) converters were also designed. The designs were submitted to a commercial surface micromachining foundry to be fabricated. The completed MEMS devices were then released and tested to determine proper operation. Of the mechanical devices that have been fabricated and tested, a functioning inverter, sine function device, cosine function device, and digital-to-analog converter have been demonstrated

Finite time singularity in a free boundary problem modeling MEMS

The occurrence of a finite time singularity is shown for a free boundary problem modeling microelectromechanical systems (MEMS) when the applied voltage exceeds some value. The model involves a singular nonlocal reaction term and a nonlinear curvature term accounting for large deformations

Observation and Understanding of the Initial Unstable Electrical Contact Behaviors

Reliable and long-lifetime electrical contact is a very important issue in the field of radio frequency microelectromechanical systems (MEMS) and in energy transmission applications. In this paper, the initial unstable electrical contact phenomena under the conditions of micro-newton-scale contact force and nanometer-scale contact gap have been experimentally observed. The repetitive contact bounces at nanoscale are confirmed by the measured instantaneous waveforms of contact force and contact voltage. Moreover, the corresponding physical model for describing the competition between the electrostatic force and the restoring force of the mobile contact is present. Then, the dynamic process of contact closure is explicitly calculated with the numerical method. Finally, the effects of spring rigidness and open voltage on the unstable electrical contact behaviors are investigated experimentally and theoretically. This paper highlights that in MEMS systems switch, minimal actuation velocity is required to prevent mechanical bounce and excessive wear

Electrolysis-based diaphragm actuators

This work presents a new electrolysis-based microelectromechanical systems (MEMS) diaphragm actuator. Electrolysis is a technique for converting electrical energy to pneumatic energy. Theoretically electrolysis can achieve a strain of 136 000% and is capable of generating a pressure above 200 MPa. Electrolysis actuators require modest electrical power and produce minimal heat. Due to the large volume expansion obtained via electrolysis, small actuators can create a large force. Up to 100 µm of movement was achieved by a 3 mm diaphragm. The actuator operates at room temperature and has a latching and reversing capability

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm

Design, fabrication and characterization of monolithic embedded parylene microchannels in silicon substrate

This paper presents a novel channel fabrication technology of bulk-micromachined monolithic embedded polymer channels in silicon substrate. The fabrication process favorably obviates the need for sacrifical materials in surface-micromachined channels and wafer-bonding in conventional bulk-micromachined channels. Single-layer-deposited parylene C (poly-para-xylylene C) is selected as a structural material in the microfabricated channels/columns to conduct life science research. High pressure capacity can be obtained in these channels by the assistance of silicon substrate support to meet the needs of high-pressure loading conditions in microfluidic applications. The fabrication technology is completely compatible with further lithographic CMOS/MEMS processes, which enables the fabricated embedded structures to be totally integrated with on-chip micro/nano-sensors/actuators/structures for miniaturized lab-on-a-chip systems. An exemplary process was described to show the feasibility of combining bulk micromachining and surface micromachining techniques in process integration. Embedded channels in versatile cross-section profile designs have been fabricated and characterized to demonstrate their capabilities for various applications. A quasi-hemi-circular-shaped embedded parylene channel has been fabricated and verified to withstand inner pressure loadings higher than 1000 psi without failure for micro-high performance liquid chromatography (µHPLC) analysis. Fabrication of a high-aspect-ratio (internal channel height/internal channel width, greater than 20) quasi-rectangular-shaped embedded parylene channel has also been presented and characterized. Its implementation in a single-mask spiral parylene column longer than 1.1 m in a 3.3 mm × 3.3 mm square size on a chip has been demonstrated for prospective micro-gas chromatography (µGC) and high-density, high-efficiency separations. This proposed monolithic embedded channel technology can be extensively implemented to fabricate microchannels/columns in high-pressure microfludics and high-performance/high-throughput chip-based micro total analysis systems (µTAS)

Low-cost autonomous 3-D monitoring systems for hydraulic engineering environments and applications with limited accuracy requirements

The details of developing autonomous 3-D motion monitoring systems based on commercial off-the-shelf (COTS) motion sensors for hydraulic environments are discussed. Possible areas of application, are river bed sediment transport monitoring and monitoring the agitation and other physical parameters inside milk vats with a mechanized agitator. Simplified calculations of inertial navigation systems (INSs) such as Euler angle method, MATLAB programs for further processing, power management systems for autonomous operation including the possibility of inductive power transfer (IPT) and use of microelectromechanical systems (MEMS) technology are discussed. Experimental results for proof of concept systems are highlighted