Influence of orientation and radiative heat transfer on aluminum foams in Buoyancy-induced convection

Two differently-produced open-cell aluminum foams were compared to a commercially available finned heat sink. Further, an aluminum plate and block were tested as a reference. All heat sinks have the same base plate dimensions of four by six inches. The first foam was made by investment casting of a polyurethane preform and has a porosity of 0.946 and a pore density of 10 pores per linear inch. The second foam is manufactured by casting over a solvable core and has a porosity of 0.85 and a pore density of 2.5 pores per linear inch. The effects of orientation and radiative heat transfer are experimentally investigated. The heat sinks are tested in a vertical and horizontal orientation. The effect of radiative heat transfer is investigated by comparing a painted/anodized heat sink with an untreated one. The heat flux through the heat sink for a certain temperature difference between the environment and the heat sink’s base plate is used as the performance indicator. For temperature differences larger than 30 °C, the finned heat sink outperforms the in-house-made aluminum foam heat sink on average by 17%. Furthermore, the in-house-made aluminum foam dissipates on average 12% less heat than the other aluminum foam for a temperature difference larger than 40 °C. By painting/anodizing the heat sinks, the heat transfer rate increased on average by 10% to 50%. Finally, the thermal performance of the horizontal in-house-made aluminum foam heat sink is up to 18% larger than the one of the vertical aluminum foam heat sink

Heat pipe cooling system with sensible heat sink

A heat pipe cooling system which employs a sensible heat sink is discussed. With this type of system, incident aerodynamic heat is transported via a heat pipe from the stagnation region to the heat sink and absorbed by raising the temperature of the heat sink material. The use of a sensible heat sink can be advantageous for situations where the total mission heat load is limited, as it is during re-entry, and a suitable radiation sink is not available

Design and optimization of a micro heat sink for concentrating photovoltaic/thermal (CPVT) systems

This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the Makedonia Palace Hotel, Thessaloniki in Greece. The conference was organised by Brunel University and supported by the Italian Union of Thermofluiddynamics, Aristotle University of Thessaloniki, University of Thessaly, IPEM, the Process Intensification Network, the Institution of Mechanical Engineers, the Heat Transfer Society, HEXAG - the Heat Exchange Action Group, and the Energy Institute.An optimization methodology for a microchannel heat sink suitable for the cooling of a parabolic trough CPVT system is presented in this study. Two different microchannel configurations are considered, Fixed (FWμ) and stepwise Variable-Width (VWμ) microchannels respectively. The performance evaluation criteria comprise the thermal resistance of the heat sink and the cooling medium pressure drop through the heat sink. Initially, the effect of the geometric parameters on the heat sink thermal and hydrodynamic performance is investigated using a thermal resistance model in order to save computational time. The results of the 1-D model enable the construction of surrogate functions for the thermal resistance and the pressure drop of the heat sink, which are considered as the objective functions for the multiobjective optimization process that leads to the optimal geometric parameters. In a second step, a 3-D numerical model of fluid flow and conjugate heat transfer in the optimized FWμ heat sink is developed in order to investigate in detail the flow and thermal phenomena. The overall analysis demonstrates that microchannel heat sinks achieve very low values of thermal resistance and that the use of variable-width channels can significantly reduce the pressure drop of the cooling fluid. Furthermore, it is proven that the 1-D model is capable of providing a good estimate of the behavior of the heat sink

Sub-Kelvin resistance thermometer

A device capable of accurate temperature measurement down to 0.01 K of a particular object is discussed. The device is comprised of the following: a heat sink wafer; a first conducting pad bonded near one end of the heat sink wafer; a second conducting pad bonded near the other end of the heat sink wafer; and an oblong doped semiconductor crystal such as germanium. The oblong doped semiconductor crystal has a third conducting pad bonded on its bottom surface with the oblong doped semiconductor crystal bonded to the heat sink wafer by having the fourth conducting pad bonded to the first conducting pad. A wire is bonded between the second and third conducting pads. Current and voltage wires bonded to the first and second conducting pads measure the change in resistance of the oblong doped semiconductor crystal; this indicates the temperature of the object whose temperature is to be measured

Cooling Performance of a Novel Circulatory Flow Concentric Multi-Channel Heat Sink with Nanofluids

Heat rejection from electronic devices such as processors necessitates a high heat removal rate. The present study focuses on liquid-cooled novel heat sink geometry made from four channels (width 4 mm and depth 3.5 mm) configured in a concentric shape with alternate flow passages (slot of 3 mm gap). In this study, the cooling performance of the heat sink was tested under simulated controlled conditions.The lower bottom surface of the heat sink was heated at a constant heat flux condition based on dissipated power of 50 W and 70 W. The computations were carried out for different volume fractions of nanoparticles, namely 0.5% to 5%, and water as base fluid at a flow rate of 30 to 180 mL/min. The results showed a higher rate of heat rejection from the nanofluid cooled heat sink compared with water. The enhancement in performance was analyzed with the help of a temperature difference of nanofluid outlet temperature and water outlet temperature under similar operating conditions. The enhancement was ~2% for 0.5% volume fraction nanofluids and ~17% for a 5% volume fraction

Tubular sublimatory evaporator heat sink

An evaporative refrigerator or cooler comprising a bundle of spaced, porous walled tubes closed at one of their ends and vented to a vacuum at the other end is disclosed. The tube bundle is surrounded by a water jacket having a hot water inlet distribution manifold and a cooled water outlet through a plenum chamber. Hot water is pumped into the jacket to circulate around the tubes, and when this water meets the vacuum existing inside the tubes, it evaporates thereby cooling the water in the jacket. If cooling proceeds to the point where water penetrating or surrounding all or part of the tubes freezes, operation continues with local sublimation of the ice on the tubes while the circulating water attempts to melt the ice. Both sublimation and evaporation may take place simultaneously in different regions of the device

Heat sink effects on weld bead: VPPA process

An investigation into the heat sink effects due to weldment irregularities and fixtures used in the variable polarity plasma arc (VPPA) process was conducted. A basic two-dimensional model was created to represent the net heat sink effect of surplus material using Duhamel's theorem to superpose the effects of an infinite number of line heat sinks of variable strength. Parameters were identified that influence the importance of heat sink effects. A characteristic length, proportional to the thermal diffusivity of the weldment material divided by the weld torch travel rate, correlated with heat sinking observations. Four tests were performed on 2219-T87 aluminum plates to which blocks of excess material were mounted in order to demonstrate heat sink effects. Although the basic model overpredicted these effects, it correctly indicated the trends shown in the experimental study and is judged worth further refinement

Heat sink effects in VPPA welding

The development of a model for prediction of heat sink effects associated with the Variable Polarity Plasma Arc (VPPA) Welding Process is discussed. The long term goal of this modeling is to provide means for assessing potential heat sink effects and, eventually, to provide indications as to changes in the welding process that could be used to compensate for these effects and maintain the desired weld quality. In addition to the development of a theoretical model, a brief experimental investigation was conducted to demonstrate heat sink effects and to provide an indication of the accuracy of the model