Interconnection structures in physical systems: a mathematical formulation

The power-conserving structure of a physical system is known as interconnection structure. This paper presents a mathematical formulation of the interconnection structure in Hilbert spaces. Some properties of interconnection structures are pointed out and their three natural representations are treated. The developed theory is illustrated on two examples: electrical circuit and one-dimensional transmission lin

Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging

This paper presents the electrical design, measurement and reliability ests of a shielded vertical interconnection dedicated to microwave solder-mount packages. Electromagnetic simulations show very good results up to 20 GHz. Test samples have been designed and manufactured. Electrical results are in accordance with the simulations with insertion loss lower than 0.1 dB up to 20 GHz for the proposed interconnection. Reliability tests of present no degradation of the after 500 thermal cycles in the [-55°C, +125°C] temperature range

Analysis and quantification of the benefits of interconnected distribution system operation

In the UK, the Capacity to Customers (C2C) project is underway to determine the potential benefits of increased interconnection in distribution systems, combined with demand side response technology. Managed contracts with customers, i.e., the agreement that certain loads are interruptible following system faults, allows distribution circuits to be loaded beyond the limits presently required for security of supply. This potentially permits load growth but avoids the cost and environmental impact of conventional network reinforcement. This paper provides the results of electrical system modelling to quantify the benefits of the C2C operation, using actual circuit data and typical load distributions. Based upon simulations of these circuits, it is shown that increased interconnection generally leads to minor improvements in electrical losses and system voltage. By connecting managed (i.e., interruptible) loads, circuits typically can be loaded significantly further than the present practice in the UK—an average increase of 66% for radial operation and 74% for interconnected systems

Physical Interpretations of Negative Imaginary Systems Theory

This paper presents some physical interpretations of recent stability results on the feedback interconnection of negative imaginary systems. These interpretations involve spring mass damper systems coupled together by springs or RLC electrical networks coupled together via inductors or capacitors.Comment: To appear in the Proceedings of the 10th ASIAN CONTROL CONFERENCE 201

Thin-film VCSEL and optical interconnection layer fabrications for fully embedded board level optical interconnects

textSemiconductor technology has been splendid evolved. As a consequence of, massive data traffic is required in system level. However copper based interconnection reached the upper limit of data transfer rate and can not provide enough bandwidth for high performance system. Copper based interconnection in long haul application was replaced to optical fiber. Optical interconnection in system level is generally considered as an alternative to provide high bandwidth. However, unlike long haul application, optical interconnection in system level encountered many problems such as compatibility, robustness and packaging difficulty. The compatibility to current electrical board system and packaging difficulty must be solved. This dissertation describes a fully embedded board level optical interconnection, which can solve many problems, components fabrication and hybrid integration with electrical layers. Thin-film VCSEL array and flexible optical waveguide are demonstrated. The optical interconnection layer integrated with thin-film VCSEL and photo-detector arrays is demonstrated.Electrical and Computer Engineerin

Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of $10^{16}$ $\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons).Comment: 16 pages, 22 figure

A Carrier Signal Approach for Intermittent Fault Detection and Health Monitoring for Electronics Interconnections System

Abstract: Intermittent faults are completely missed out by traditional monitoring and detection techniques due to non-stationary nature of signals. These are the incipient events of a precursor of permanent faults to come. Intermittent faults in electrical interconnection are short duration transients which could be detected by some specific techniques but these do not provide enough information to understand the root cause of it. Due to random and non-predictable nature, the intermittent faults are the most frustrating, elusive, and expensive faults to detect in interconnection system. The novel approach of the author injects a fixed frequency sinusoidal signal into electronics interconnection system that modulates intermittent fault if persist. Intermittent faults and other channel effects are computed from received signal by demodulation and spectrum analysis. This paper describes technology for intermittent fault detection, and classification of intermittent fault, and channel characterization. The paper also reports the functionally tests of computational system of the proposed methods. This algorithm has been tested using experimental setup. It generate an intermittent signal by external vibration stress on connector and intermittency is detected by acquiring and processing propagating signal. The results demonstrate to detect and classify intermittent interconnection and noise variations due to intermittency. Monitoring the channel in-situ with low amplitude, and narrow band signal over electronics interconnection between a transmitter and a receiver provides the most effective tool for continuously watching the wire system for the random, unpredictable intermittent faults, the precursor of failure. - See more at: http://thesai.org/Publications/ViewPaper?Volume=6&Issue=12&Code=ijacsa&SerialNo=20#sthash.8RXsdW0t.dpu

Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube [CNT] interconnection bump joining methodology has been successfully demonstrated using flip chip test structures with bump pitches smaller than 150 μm. In this study, plasma-enhanced chemical vapor deposition approach is used to grow the CNT bumps onto the Au metallization lines. The CNT bumps on the die substrate are then 'inserted' into the CNT bumps on the carrier substrate to form the electrical connections (interconnection bumps) between each other. The mechanical strength and the concept of reworkable capabilities of the CNT interconnection bumps are investigated. Preliminary electrical characteristics show a linear relationship between current and voltage, suggesting that ohmic contacts are attained