Multi-layer micro channels system: interpretation and developments

During the last three decades the concept of the traditional cooling systems was modified to include single, double, and multi-layer micro channels. The new studies, applications, fabrication, and research focus on four main areas: the geometrical shape of the micro channels, the number of stacked layers, the type of the coolants, and the heat performance optimization. The previous studies have shown a significant reduction in the power consumption as the optimization is accomplished. In this paper, a semi-review for the previous works is provided, an attempt to interpret the nature of the work done, and show another trial for optimization. In this study, water was used as a coolant agent, stacked multi-channel was adopted, and thermal resistance network was calculated.The heat sink under consideration is a rectangle of width ?? and length ??. The thickness ???????? of the base of the micro-channel is 100 [?m] while the depth ????of the micro-channel is 500[?m], both kept constant for all future optimization cases

Optimization of multilayer micro channels heat sinks cooling system using genetic algorithm

Cooling of electronic devices is problematic by its nature simply because of the space restriction. Recent advances in high powered miniaturized electronic systems have come at the expanse of very high heat fluxes that pose challenges to thermal management research. Uncontrolled excessive heat may cause thermal fatigue and stresses and the current micro electro-mechanical cooling systems (MEMS) which utilize the single layer micro channel heat sink, introduced a decade ago, may no longer be an adequate solution. Possible extension of the layer of parallel micro channels into a stacked system, by developing two, three, and multi-layer channel systems are being investigated. The design of all these systems depends on several parameters; coolant type, channel geometry, channel dimensions, and the number of the channels. This paper reports a new model for optimizing the thermal resistance, developed based on specific parameters of the dimensions of the channel, the wall width between the channels, and using water as a coolant at 27°C. The outcomes of the model were compared with other published studies. The results showed that the model is valid and reliable for further studies

Optimization of a single phase rectangular microchannel heat sink cooling system

A simple thermal resistance network model is developed to optimize the overall thermal performance of a single layer rectangular water-cooled micro-channel heat sink made from silicon which has a very high thermal conductivity. The object of this optimization is the minimization of the overall thermal resistance, firstly in series and secondly in series and parallel. The thermal resistance consists of the conduction resistance, convection resistance and bulk resistance due to the bulk temperature rise of the coolant. The conduction resistance is normally a small part of the overall resistance. The heat sink under consideration has a width and length of W ? L =1cm×1cm. The thickness of the base of the micro-channel is ???????? =100[????],and the depth of the micro channel ????=365[????] ,In the current study, minimization of the overall thermal resistance of a micro-channel heat sink is carried out using genetic algorithm,(GA). The fin thickness ww and the channel width wc are the optimized variables under a fixed coolant volume flow rate. Results obtained agreed well with previous experimental studies