Integrated optical transmitter with micro-transfer-printed widely tunable III-V-on-Si laser

We demonstrate a C-band optical transmitter with an integrated widely-tunable III-V-on-silicon laser on the imec iSiPP50G platform using micro-transfer printing. Back-to-back operation at 40 Gbit/s non-return-to-zero On-Off keying over the C-band is presented

Micro-transfer-printed III-V-on-Si semiconductor optical amplifier with 15 dBm output saturation power

We demonstrate a high-saturation power III-V-onSi semiconductor optical amplifier (SOA) with a tapered design realized using micro-transfer-printing integration technology. The SOA provides a 9 dB small-signal gain and an output saturation power of 15 dBm at the wavelength of 1573 nm

Micro-transfer-printed III-V-on-Si laser with 120nm tuning range

Many integrated photonics applications require miniaturized on-chip sources over a wide wavelength range, such as coherent optical communication and spectroscopy. In this work, we demonstrate for the first time a 120nm tuning range (1495nm-1615nm) widely-tunable III-V-on-Si laser realized using micro-transfer printing technology

Narrow-linewidth micro-transfer-printed III-V-on-Si laser with 110 nm tuning range

On-chip laser sources covering a wide wavelength range is one of the key enablers to coherent optical communication systems. In this work, we demonstrate for the first time a narrow-linewidth III-V-on-Si laser with 110 nm tuning range realized using micro-transfer printing technology

Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range

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Micro-transfer printing for heterogeneous Si photonic integrated circuits

Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

We present the current state of the art in micro-transfer printing for heterogeneously integrated silicon photonic integrated circuits. The versatility of the technology is highlighted, as is the way ahead to make this technology a key enabler for next-generation photonic systems-on-chip

Present and future of micro-transfer printing for heterogeneous photonic integrated circuits

We present the current state of the art in micro-transfer printing for heterogeneously integrated silicon photonic integrated circuits. The versatility of the technology is highlighted, as is the way ahead to make this technology a key enabler for next-generation photonic systems-on-chip.SCOPUS: sh.jinfo:eu-repo/semantics/publishe