18 research outputs found
Imaging calpain protease activity by multiphoton FRET in living mice
International audienceConstant efforts are ongoing for the development of new imaging methods that allow the investigation of molecular processes in vivo. Protein-protein interactions, enzymatic activities and intracellular Ca2+ fluxes, have been resolved in cultured cells using a variety of fluorescence resonance energy transfer (FRET) detection methods. However, FRET has not been used so far in conjunction with 3D intravital imaging. We evaluated here a combination of multiphoton microscopy (MPM), method of choice for non-destructive living tissue investigation, and FRET imaging to monitor calpain proteolytic activity in living mice muscle. We show that kinetics of ubiquitous calpains activation can be efficiently and quantitatively monitored in living mouse tissues at cellular level with a FRET-based indicator upon calcium influx. The ability to visualize calpain activity in living tissue offers a unique opportunity to challenge remaining questions on the biological functions of calpains and to evaluate the therapeutic potential of calpain inhibitors in many degenerative conditions. (C) 2004 Elsevier Ltd. All rights reserved
RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking
International audienc
Integration and RF characterization of high density Through Silicon Vias for 3D chip stacking
International audienc
Caractérisation en hyperfréquences et modélisation de Vias Traversant le Silicium pour l'intégration de puces tridimensionnelles
National audienc
"RF characterization and modeling of high density Through Silicon Vias for 3D chip stacking"
International audienc
RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits
International audienc
Modelling of Through Silicon Via RF Performance and Impact on Signal Transmission in 3D Integrated Circuits
International audienc
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
International audienc
« Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs”
International audienc
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
International audienc