109 research outputs found
Layer thickness and period as design parameters to tailor pyroelectric properties in ferroelectric superlattices
We theoretically examine the pyroelectric properties of ferroelectric-paraelectric superlattices as a function of layer thickness and configuration using non-linear thermodynamics coupled with electrostatic and electromechanical interactions between layers. We specifically study PbZr0.3Ti0.7O3/SrTiO3 superlattices. The pyroelectric properties of such constructs consisting of relatively thin repeating units are shown to exceed the pyroelectric response of monolithic PbZr0.3Ti0.7O3 films. This is related to periodic internal electric fields generated due to the polarization mismatch between layers that allows tailoring of the shift in the transition temperature. Our results indicate that higher and electric field sensitive pyroresponse can be achieved from layer-by-layer engineered ferroelectric heterostructures
Strong dependence of dielectric properties on electrical boundary conditions and interfaces in ferroelectric superlattices
A computational study based on Landau-Ginzburg-Devonshire theory is carried out to understand the role of interfaces on the dielectric response of ferroelectric superlattices. Using heteroepitaxial (001) PbZr0.3Ti0.7O3/(001)SrTiO3 heterostructures on (001)SrTiO3 as an example, we show that electrostatic boundary conditions have a pronounced effect on the dielectric response far below the ferroelectric phase transition temperature. For a fixed total multilayer thickness, the average dielectric response can be improved significantly for superlattices with a small layer periodicity. This is due to the large total internal electric fields at the interlayer interfaces which originate from the polarization mismatch between layers
An all-ZnO microbolometer for infrared imaging
Cataloged from PDF version of article.Microbolometers are extensively used for uncooled infrared imaging applications. These imaging units generally employ vanadium oxide or amorphous silicon as the active layer and silicon nitride as the absorber layer. However, using different materials for active and absorber layers increases the fabrication and integration complexity of the pixel structure. In order to reduce fabrication steps and therefore increase the yield and reduce the cost of the imaging arrays, a single layer can be employed both as the absorber and the active material. In this paper, we propose an all-ZnO microbolometer, where atomic layer deposition grown zinc oxide is employed both as the absorber and the active material. Optical constants of ZnO are measured and fed into finite-difference-time-domain simulations where absorption performances of microbolometers with different gap size and ZnO film thicknesses are extracted. Using the results of these optical simulations, thermal simulations are conducted using finite-element-method in order to extract the noise equivalent temperature difference (NETD) and thermal time constant values of several bolometer structures with different gap sizes, arm and film thicknesses. It is shown that the maximum performance of 171 mK can be achieved with a body thickness of 1.1 μm and arm thickness of 50 nm, while the fastest response with a time constant of 0.32 ms can be achieved with a ZnO thickness of 150 nm both in arms and body. © 2014 Elsevier B.V. All rights reserved
Tailoring dielectric properties of ferroelectric-dielectric multilayers
We develop a nonlinear thermodynamic model for multilayer ferroelectric heterostructures that takes into account electrostatic and electromechanical interactions between layers. We concentrate on the effect of relative layer fractions and in-plane thermal stresses on dielectric properties of Ba0.6Sr0.4TiO3-, BaTiO3-, and PbZr0.2Ti0.8O3 (PZT)-SrTiO3 (STO) multilayers on Si and c-sapphire. We show that dielectric properties of such multilayers can be significantly enhanced by tailoring the growth/processing temperature and the STO layer fraction. Our computations show that large tunabilities (similar to 90% at 400 kV/cm) are possible in carefully designed barium strontium titanate-STO and PZT-STO even on Si for which there exist substantially large in-plane strains
Pyroelectric and dielectric properties of ferroelectric films with interposed dielectric buffer layers
Pyroelectric response of lead zirconate titanate thin films on silicon: Effect of thermal stresses
Ferroelectric lead zirconate titanate [Pb(ZrxTi1-xO)(3), (PZT x:1-x)] has received considerable interest for applications related to uncooled infrared devices due to its large pyroelectric figures of merit near room temperature, and the fact that such devices are inherently ac coupled, allowing for simplified image post processing. For ferroelectric films made by industry-standard deposition techniques, stresses develop in the PZT layer upon cooling from the processing/growth temperature due to thermal mismatch between the film and the substrate. In this study, we use a non-linear thermodynamic model to investigate the pyroelectric properties of polycrystalline PZT thin films for five different compositions (PZT 40:60, PZT 30:70, PZT 20:80, PZT 10:90, PZT 0:100) on silicon as a function of processing temperature (25-800 degrees C). It is shown that the in-plane thermal stresses in PZT thin films alter the out-of-plane polarization and the ferroelectric phase transformation temperature, with profound effect on the pyroelectric properties. PZT 30:70 is found to have the largest pyroelectric coefficient (0.042 mu C cm(-2)degrees C-1, comparable to bulk values) at a growth temperature of 550 degrees C; typical to what is currently used for many deposition processes. Our results indicate that it is possible to optimize the pyroelectric response of PZT thin films by adjusting the Ti composition and the processing temperature, thereby, enabling the tailoring of material properties for optimization relative to a specific deposition process. (C) 2013 AIP Publishing LLC
Declarative Event-Based Workflow as Distributed Dynamic Condition Response Graphs
We present Dynamic Condition Response Graphs (DCR Graphs) as a declarative,
event-based process model inspired by the workflow language employed by our
industrial partner and conservatively generalizing prime event structures. A
dynamic condition response graph is a directed graph with nodes representing
the events that can happen and arrows representing four relations between
events: condition, response, include, and exclude. Distributed DCR Graphs is
then obtained by assigning roles to events and principals. We give a graphical
notation inspired by related work by van der Aalst et al. We exemplify the use
of distributed DCR Graphs on a simple workflow taken from a field study at a
Danish hospital, pointing out their flexibility compared to imperative workflow
models. Finally we provide a mapping from DCR Graphs to Buchi-automata.Comment: In Proceedings PLACES 2010, arXiv:1110.385
External decontamination of wild leeches with hypochloric acid
BACKGROUND: Medicinal leech, Hirudo medicinalis, has been used in plastic and reconstructive surgery, to relieve venous congestion and to improve the microrevascularization of flaps. In many countries, wild leeches are still provided from local markets and utilised with antibiotic prophylaxies. In this research, results of identification of bacteria in the transport fluid is reported, oral and intestinal floras and the antibiograms of the identified microorganisms are investigated. Also, to avoid possible infections, the ability of hypochloric acid, a disinfectant, to suppress the relevant microorganisms without changing the life style and behavior of leeches in terms of sucking function, is investigated. METHODS: Bacterial identifications and antibiograms of oral and intestinal flora and transport medium were performed for 10 leeches. The optimum concentration of hypochloric acid which eliminated microorganisms without affecting the viability and sucking function of the leeches were determined by dilution of hypochloric acid to 100, 50, 25, 12.5, 6.25 ppm concentrations in different groups of 25 leeches. Finally, 20 leeches were applied atraumatically to the bleeding areas of rats, the duration of suction was determined and compared statistically between the leeches treated and not treated with hypochloric acid solution. RESULTS: Aeromonas hydrophilia was the most commonly identified microorganism and found to be resistant to first generation cephalosporins, frequently used in prophylaxis at surgical wards. In the next stages of the study, the leeches were subjected to a series of diluted hypochloric acid solutions. Although disinfection of the transport material and suppression of the oral flora of hirudo medicinalis were successful in 100, 50, 25, 12.5, 6.25 ppm concentrations; 12.5 ppm solution was the greatest concentration in which hirudo medicinalis could survive and sucking function was not affected significantly. CONCLUSIONS: External decontamination of wild leeches with 12.5 ppm hypochloric acid enables bacterial suppression without causing negative effects on leech sucking function and life
In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon
Silicon is an excellent material for microelectronics and integrated photonics 1-3, with untapped potential for mid-infrared optics 4 . Despite broad recognition of the importance of the third dimension 5,6, current lithography methods do not allow the fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realized with techniques like reactive ion etching. Embedded optical elements 7, electronic devices and better electronic-photonic integration are lacking 8 . Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1-μm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has an optical index different to that in unmodified parts, enabling the creation of numerous photonic devices. Optionally, these parts can be chemically etched to produce desired 3D shapes. We exemplify a plethora of subsurface - that is, 'in-chip' - microstructures for microfluidic cooling of chips, vias, micro-electro-mechanical systems, photovoltaic applications and photonic devices that match or surpass corresponding state-of-the-art device performances. © 2017 The Author(s)
- …