Low dielectric ceramic compositions for multilayer ceramic package

[[abstract]]A crystallizable ceramic composition for forming a ceramic dielectric body having a dielectric constant in the range of 4.8-5.3 at 1 MHz and a linear thermal expansion coefficient of 4.0-5.1.times.10.sup.-6 K.sup.-1 in the temperature range of 25.degree.-200.degree. C. The dielectric composition comprises a mixture of finely divided particles of 10-90 wt % Mg-Al-Si glass and 10-90 wt % Ca-Al-B-Si glass. The dielectric composition can be used with organic solvents, polymeric binder and plasticizer to produce an unfired green tape which is cofirable with high electrical conductivity metallurgies such as gold, silver, silver-palladium and copper.[[fileno]]2020313060001[[department]]材料科學工程學