Jean, Jau-Ho

English

Lehigh University: Lehigh Preserve

Lehigh University
Lehigh Preserve
International Workshop on Scientific Challenges for
Glass Research Glass Conferences and Workshops
Spring 4-1-2007
Glass and glass-ceramics for wireless
communication
Jau-Ho Jean
National Tsinghua University, Taiwain
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scientificchallenges
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Recommended Citation
Jean, Jau-Ho, "Glass and glass-ceramics for wireless communication" (2007). International Workshop on Scientific Challenges for Glass
Research. 6.
https://preserve.lehigh.edu/imi-tll-conferences-scientificchallenges/6
Glass and Glass-Ceramics 
for Wireless Communication
J.H. Jean
Dept. Materials science and Engineering 
National Tsing Hua University
Hsinchu, Taiwan
Wireless Wonders
WPAN
WLAN
WMAN
WWAN
GPRS/EDGE
WiMAX
Bluetooth 802.15.3a
802.11x
802.16
802.20
UWB
WLAN
IEEE
Narrow Broad Band
ZigBee
LTCC devices for RF Front-end
BPF      Balun LNA
Coupler    PA     Balun
VCO/PLL
(Antenna-Switch Module)
A_Rx
A_Tx
B_Rx
B_Tx
LPF
LPF
Switch
Switch
Diplexer
ANT
Chip L, C LPF BPF Balance BPF
Antenna
Diplexer
ASM Coupler Balun
VCO
Why Ceramics ???????
Dielectric Constant
5-100
4.0
FR4/Cu LTCC/Ag
@4GHz
Dielectric Loss
FR4/Cu LTCC/Ag
2.5%
0.02-0.25%
@4GHz
Temp. Coefficient of 
Resonant Frequency (Tf)
FR4/Cu LTCC/Ag
80 ppm/k
10 ppm/K
Frequency
High Tf
Material
at 80 C 
Low Tf
Material
at 80 C
I
n
s
e
r
t
i
o
n
 
L
o
s
s
 
(
d
B
)
At 25 C
Tf ≅ -1/2Tk - TCE
Tk :Temp. coefficient of capacitance  
TCE: Thermal expansion coefficient
Thermal Conductivity
FR4
0.25
5 W/mK
LTCC
Thermal Expansion Coefficient
0
5
10
15
20
25 Plastics
Ceramics
Si
GaAs
pp
m
/k
Why LTCC ????????
Low Temperature Cofired Ceramics
<1000 oC
One fire
Ceramic base
LTCC
Electrical Resistivity of Conductors
0
1
2
3
4
5
6
7
8
W Ni Cu Ag Au
R
e
s
i
t
i
v
i
t
y
(
x
1
0
-
6
o
h
m
-
c
m
)
1/Qt = 1/Qm + 1/Qc
Melting Point of Conductors
0
500
1000
1500
2000
2500
3000
3500
W Ni Ag Cu Au
M
e
l
t
i
n
g
 
P
o
i
n
t
 
 
(
o
C
)
LTCC Materials and Processes
Dielectric: 
* Glass-Ceramics, Glass+ceramics
* Dielectric Constant: 5-100
* Dielectric Loss: 0.01-0.5%
Conductors: Ag, Cu and Au
Resistors: RuO2+Glass
Firing conditions: 
* Temp.:800-1000oC
* Time: 10-60 min
* Atmosphere: Air, H2+N2+H2O
Low Temperature Cofired Ceramics
<1000 oC One fire Ceramic base
Integrated RF Module
Resistor Wire-bonded bare chip Soldered flip-chip
Via
Buried
capacitor
(high-K
tape or paste)
Buried
resistor
Inductor or
interconnect
line
MIM
capacitor
Chip SMD device
Shielding
or GND pad
SMT I/O SMT I/OGND
Mixed-K
Substrates
Thin-film 
capacitor
Thermal via
Cofiring Defects
WLAN 802.11a+b+g
Diplexer
2.4 & 5GHz LNA
PA Balun
2.4GHz
2.4GHz
Rx : 2.4GHz
Tx : 2.4GHz
LNA
5GHz
PA Balun
Rx : 5GHz
Tx : 5GHz
2.4 & 5GHz 5GHz
LTCC Solutions to Bluetooth
Chip Antenna
Band Pass Filter
BPF
Balun
BPF SW
LPF
BPF
CPLR BPF
Mixer
MixerPA
LNA
PLL
Low Pass Filter Coupler Balun
Inductors
Module
LTCC Market in Wireless Communication
0
200
400
600
800
1000
1200
Bluetooth Handset WLAN
2001
2005
M
Design of LTCC Compositions
Green Sintered
Type1: Glass+Ceramics
e.g., DuPont 951
Type 2: Glass-Ceramics
e.g., Ferro A6
Type 3: Glass±Ceramics
e.g., Heraeus CT2000
Glass Crystalline phaseAl2O3
Filler
Type I: Glass+Ceramics
Al2O3
K = 10
Q = 10000
VAl2O3 =30-40%
Dielectric
Mixture
Glass
K=6-7
Q= 100-150
Vglass=60-70%
Qm= 200-3001/Qm = (V/Q)glass + (V/Q)alumina
1/Km = (V*K)glass + (V*K)alumina Km= 4-8
Ceramic Filler: Al2O3
VAl2O3 : 30-40%
Glass: PbO, K2O, B2O3, SiO2
Vglass : 60-70%
Sintering
850~ 900 °C
Densification of Glass+Ceramics
600 700 800 900
0.5
0.6
0.7
0.8
0.9
1.0
R
e
l
a
t
i
v
e
 
D
e
n
s
i
t
y
Exp. Calculated
Heating rate
Temperature (oC)
600 650 700 750 800 850 900
0
2
4
6
8
10
12
14
16
 
 
U
n
i
a
x
i
a
l
 
V
i
s
c
o
s
i
t
y
(
x
1
0
8
P
a
‧
s
)
Temperature(oC)
Heating rate
Uniaxial Viscosity (Ep)
Processing robustness
--“Fool-Proof” systems
Type II: Glass-Ceramics
Sintering
850~ 900 °C
Glass: CaO, K2O, B2O3, SiO2
Vglass : 100%
Wollastonite
K = 5-6
Q = 1000
VAl2O3 =60-80%
Residual glass: B-rich
K=5-6
Q= 100-150
Vglass=20-40%
Dielectric
Mixture Qm= 500-7001/Qm = (V/Q)glass + (V/Q)alumina
Km= 5-61/Km = (V*K)glass + (V*K)alumina
650 700 750 800 850 900 950
-0.25
-0.20
-0.15
-0.10
-0.05
0.00 Ramp Rate (
oC/min)
 1
 5
 10
 
 
F
r
e
e
 
U
n
i
a
x
i
a
l
 
S
t
r
a
i
n
 
a
t
 
Z
 
a
x
i
s
Temperature (oC)
High
Effect of heating rate 
on densification
650 700 750 800 850 900
-10
0
10
20
30
40
50
60
70
80
90
Ramp Rate (oC/min)
 1
 5
 10
 
C
r
y
s
t
a
l
l
i
n
i
t
y
 
(
%
)
Temperature (oC)
Effect of Crystallization 
on Viscosity 
& Densification
650 700 750 800 850 900
0.0
2.0x109
4.0x109
6.0x109
8.0x109
1.0x1010
1.2x1010
1.4x1010
Ramp Rate (oC/min)
 1
 5
 10
 
 
U
n
i
a
x
i
a
l
 
V
i
s
c
o
s
i
t
y
 
(
P
a
.
s
)
Temperature (oC)
Smart
System
Interfacial Reaction between Ag and LTCC
Ceramic Filler
Al2O3
Tf
Adjuster
TiO2
Sintering
850~ 900 °C
Glass: K2O, B2O3, SiO2
CaO, SrO, BaO
Residual
Glass
Q ~ 350
Vglass
CaAl2Si2O8, Q=1300
SrAl2Si2O8, Q=1300-10000
BaAl2Si2O8, Q=10000
Vcryst.
Al2O3
Q = 10000
VAl2O3
TiO2
Type III: Glass±Ceramics
Qm= 900-12001/Qm = (V/Q)glass + (V/Q)aluminaDielectric
Mixture Km= 8-101/Km = (V*K)glass + (V*K)alumina
Prevention of Bloating
Pure glass 40 vol% Al2O3
Effect of Al2O3 on Crystallization
Pseudo-
wollastonite
Cristobalite
pure TG 
Alumina
Anorthite
Alumina  + 
Anorthite
500nm
TG
10µm
Alumina
40 vol% Al2O3
Effects of Alumina Content and Size on Densification
0 10 20 30 40 50 60
50
60
70
80
90
100
 
 
R
S
D
 
(
%
)
Al
2
O
3
 content (vol%)
800oC
850oC
900oC
0.0 0.5 1.0 1.5 2.0 2.5 3.0
60
70
80
90
100
 
 
R
S
D
 
(
%
)
Al
2
O
3
 size (µm)
900oC
850oC
800oC
Effects of Alumina Content and Size on Densification
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
800oC 850oC 900oC
     poor 
densification
bloating
A
l
2
O
3
 
S
i
z
e
 
(
µ
m
)
0 10 20 30 40 50 60
 
 
 
Al
2
O
3
 Content (vol%)
Effect of Heating Rate on Densification
600 700 800 900 1000 1100
-25
-20
-15
-10
-5
0
(oC/min)
20
105
21
0.5
rate  
 
S
h
r
i
n
k
a
g
e
 
(
%
)
Temperature (oC)
Heating Rate
Effect of Crystallization on Dielectric Properties
0 200 400 600 800 1000
7.6
7.7
7.8
7.9
8.0
8.1
8.2
 K
 
 
D
i
e
l
e
c
t
r
i
c
 
c
o
n
s
t
a
n
t
Time (min)
0.0
0.3
0.6
0.9
1.2
1.5
1.8
 
 
 
L
o
s
s
 
(
%
)
 loss
 
0
5
10
15
20
 
 anorthite (%)
 
A
n
o
r
t
h
i
t
e
 
c
o
n
t
e
n
t
 
(
%
)
Glasses in LTCC
* K = 5-100
* Q > 1000
* Low-fire : 850-900C
* Non-crystallizable preferred
* Lead-free
* Insignificant reaction with Ag
* Excellent leaching resistance


Glass and glass-ceramics for wireless communication

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Glass and glass-ceramics for wireless communication

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