ラジカル重合の多元制御に基づく高度な高分子構造制御法の開発

京都大学新制・課程博士博士(工学)甲第24813号工博第5156号新制||工||1985(附属図書館)京都大学大学院工学研究科高分子化学専攻(主査)教授 山子 茂, 教授 辻井 敬亘, 教授 大内 誠学位規則第4条第1項該当Doctor of Philosophy (Engineering)Kyoto UniversityDGA

Weathering Effects on Several Properties of Chemically Modified Wood

この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました

<Note>Observation of Feeding Behavior of Termite Using CCD Camera and Its Relation to the Generation of Acoustic Emission (AE)

この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました。The feeding behavior of a worker of Coptotermes formosanus Shiraki was observed with CCD camera under AE monitering. Two types of feeding behavior, biting and nibbling using the mandible, were observed. AEs were detected only when the termites bited or nibbled at the wood surface

Evaluation of Mobility of Metal Elements in CCA-treated Wood for Efficient Recycling and Safe Disposal

この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました

Strength Tests on Acetylated Aspen Flakeboards Exposed to a Brown-Rot Fungus

Aspen flakeboards made from control flakes and acetylated flakes at 18% acetyl weight gain using phenol-formaldehyde or isocyanate adhesives were subjected to a bending creep test under progressive brown-rot fungal attack with Tyromyces palustris. Deflection of the boards was measured as a function of time until failure. Isocyanate-bonded control flakeboards failed in an average of 26 days, while isocyanate-bonded acetylated boards showed little deflection after 100 days in test. Average weight loss of isocyanate-bonded control boards at failure averaged 6.2%, while the acetylated boards showed about 1.0% weight loss at the end of 100 days. Phenol-formaldehyde-bonded control flakeboards failed in an average of 76 days, while acetylated boards showed little deflection after 100 days in test. Average weight loss of phenol-formaldehyde-bonded control boards at failure averaged 8.6%, while the acetylated boards showed no weight loss after 100 days

<Preliminary>Components and Anti-fungal Efficiency of Wood-vinegar-liquor Prepared under Different Carbonization Conditions

この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました

Dimensional Stability, Decay Resistance, and Mechanical Properties of Veneer-Faced Low-Density Particleboards Made From Acetylated Wood

Veneer-faced low-density particleboards were made using four combinations of control and acetylated veneers and particles. These boards were tested for dimensional stability in both liquid water and water vapor, for decay resistance in standard soil-block tests with Tyromyces palustris and Trametes versicolor, for strength losses during attack by T. palustris, and for mechanical strength in bending-creep and mechanical tests. Boards made from acetylated veneers and acetylated core particles showed excellent dimensional stability in both liquid water and humidity tests and were resistant to attack by both fungi in an 8-week soil-block test. During the 150-day bending-creep test, the totally acetylated boards showed no strength or weight loss during exposure to T. palustris. Modulus of elasticity and modulus of rupture were slightly reduced for totally acetylated boards compared to boards with control veneers and control particles, and internal bond strength was reduced by about 30%. Screw-holding capacity of the totally acetylated boards and boards with control veneers and particles was essentially the same

<Original>Production Technology for Acetylated Low-density Particleboard (II) : Decay and Termite Resistance

この論文は国立情報学研究所の学術雑誌公開支援事業により電子化されました。Low density particleboards made from control and acetylated chips at 17 percent acetyl weight gain using isocyanate adhesives, were subjected to standard decay tests, to bending-creep tests under fungal attack, and to termite tests. The rate of decay was slow in the boards containing 50 percent of acetylated chips causing smaller weight losses and reduced thickness swelling as compared to controls after exposure to fungal attack. The specimens containing 100 percent of acetylated chips showed no sign of decay. When exposed to fungal attack in bending-creep tests, the blended particle-boards of higher specific gravity maintained their strength longer than untreated controls, but all untreated specimens and blended boards of lighter specific gravity failed within a short time span. Acetylated boards containing 100 percent of treated chips showed little strength reduction after 100 days and very little additional deflection was seen after longer exposure. Though the weight losses by termite feeding were not so large as controls, acetylated boards were able to be attacked by the termite of Coptotermes formosanus. However, they were hardly attacked by Reticulitermes speratus

Biological, Mechanical, and Thermal Properties of Compressed-Wood Polymer Composite (CWPC) Pretreated with Boric Acid

Compressed-wood polymer composite (CWPC) was prepared by in situ polymerization of vinyl monomers, styrene (ST), methylmethacrylate (MMA), and their combination (50:50, v/v) under hot-compression of treated sapwood of Japanese cedar (Cryptomeria japonica D. Don.) to a dry set of 50 and 70% of original radial dimension. Boric acid (BA) was impregnated into wood at 1.00% aqueous solution concentration prior to monomer treatment. CWPC with and without BA-pretreatment was tested in terms of biological resistance and mechanical and thermal properties.Boric acid pretreatment imparted CWPC total resistance against decay test fungi Tyromycespalustris and Coriolus versicolor, representing brown- and white-rot fungi, respectively. CWPC showed remarkable resistance against Formosan subterranean termite Coptotermes formosanus, and BA-pretreatment contributed to a total inactivation of termite activity. Surface hardness of CWPC was superior to wood polymer composite (WPC) obtained at the same polymerization temperature and time by a conventional heat process in an oven without compression. Modulus of elasticity and rupture were also considerably improved with this newly introduced in situ polymerization process, suggesting the great potential of CWPC for exterior use. Thermal analysis revealed a reducing effect of boron on heat release of CWPC during combustion