Investigation of physical properties of tungsten-based single crystals using an ultrasonic method

Using an ultrasonic method, the measurement of longitudinal and transversal velocities v of ultrasonic waves in the major crystallographic directions of pure-tungsten single crystals and tungsten single crystals alloyed with Ta and Mo was performed. Single crystals with a [110] crystallographic orientation were prepared by plasma-arc melting. Crystal density was also measured. Crystal elastic constants Cij, anisotropy factors A, Young’s modulus E, shear modulus G and bulk modulus B for the given crystallographic directions, and the mean values of the longitudinal and transversal velocities of the ultrasound according to the Fochtu-Roisu-Chilly method, Young’s modulus, shear modulus, Poisson’s ratio and Debye temperature were calculated from the obtained data. The measurement of ultrasound rates was realized by means of a pulse apparatus with a frequency of 10 MHz to 30 MHz. It was found that the alloying of pure tungsten with the elements such as tantalum and molybdenum led to a decrease in the average magnitudes of v, Cij, and B over various crystallographic and polarization directions, as well as the magnitude of . The effects of the alloying elements on the elastic properties of tungsten crystals were identical. It may be concluded on the basis of the obtained results that the ultrasonic method can be used for the quality control of the purity of tungsten single crystals and tungsten low-alloyed alloys by measuring the attenuation effects of ultrasound waves in various parts of the tested samples.Web of Science48682682

Influence of selected rare earth metals on structural characteristics of 42CrMo4 steel

The influence of rare earth metals (REM) addition on solidification structure of the low-carbon 42CrMo4 steel was investigated. Alloys were prepared by means of a centrifugal casting. The addition of cerium, praseodymium or mischmetal in the steel produced greatly improved solidification structure with a suppressed columnar grain zone, finer grain size in the equiaxed grain zone. The additions occurred in the steel bath in the form of REM oxide and/or oxide-sulphide inclusions and as dissolved REM segregated along with other elements at prior grain boundaries and interdendritic spaces. Microstructure (light microscope), SEM/EDX chemical microanalysis, and TOF-SIMS analysis – mapping of elements in the structure of alloys were obtained.Web of Science55476075

Characterization of soldering alloy type Bi-Ag-Ti and the study of ultrasonic soldering of silicon and copper

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 degrees C and full melting is completed at 405 degrees C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.Web of Science114art. no. 62

Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder

The aim of this research was to study the interaction and solderability of Al2O3 ceramics and Ni-SiC composite by use of an active solder type Bi11Ag1.5Ti1Mg. The chemical composition of the solder is 86.5 wt% Bi, 11 wt% Ag, 1.5 wt% Ti, 1 wt% Mg. Soldering was performed by ultrasonic activation. This solder has a wide melting interval with the initial melting temperature of 263 ℃, what corresponds to the eutectic reaction. The liquidus temperature of this solder was determined at 437 ℃. The bond between the ceramic and the solder is formed by the interaction of the active metals Bi, Ag and Mg with the surface of the substrate Al2O3. The thickness of the Mg reaction layer at the interface was approximately 0.8 μm. The bond at the interface between Ni-SiC and solder was formed due to the interaction of the active metals Bi, Ag, Mg and Ti. Feasibility of Bi11Ag1.5Ti1Mg solder was assessed on the basis of analyses of joint boundaries and joint shear strength measurements. The average shear strength of Al2O3/Bi11Ag1.5Ti1Mg/Ni-SiC joint was 54 MPa.Web of Science10222621

Study of wettability and solderability of SiC ceramics with Ni by use of Sn-Sb-Ti solder by heating with electron beam in vacuum

The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquidus temperature of the solder is approximately 243 degrees C. The solder consists of a tin matrix where the Ti-6(Sb,Sn)(5) and TiSbSn phases are precipitated. The solder wettability on a SiC substrate decreases with decreasing soldering temperature. The best wetting angle of 33 degrees was obtained in a vacuum at the temperature of 950 degrees C. The bond between the SiC ceramics and the solder was formed due to the interaction of Ti and Ni with silicon contained in the SiC ceramics. The formation of new TiSi2 and Ti3Ni5Si6 phases, which form the reaction layer and thus ensure the bond formation, was observed. The bond with Ni is formed due to the solubility of Ni in the tin solder. Two phases, namely the Ni3Sn2 and Ni3Sn phases, were identified in the transition zone of the Ni/Sn5Sb3Ti joint. The highest shear strength, around 40 MPa, was attained at the soldering temperature of 850 degrees C.Web of Science1515art. no. 530

Processing of metal waste-sludge from the galvanizing plants

This paper deals with the possibility of obtaining zinc from waste galvanic sludge, which is formed during galvanic plating. The aim of the experimental and practical part was to obtain zinc after the leaching of galvanic sludge. Leaching was performed in sulfuric acid, nitric acid and hydrochloric acid at different temperatures and time intervals with the addition of oxidizing agents as hydrogen peroxide or ozone. A separation of the leach and filtrate using filtration followed. The leach was further processed by a precipitation of iron and other metals using various agents. After a further filtration, the electrolysis was performed in order to obtain pure zinc on the cathode at the electrical voltage of approximately 3.5 V. Leaching using a solution of sodium hydroxide or potassium hydroxide was also performed when the prior dissolving of a major part of zinc into the leach occurred, while iron and non-ferrous metals remained in the leaching residue. After the filtration of the leach, the electrolysis with a high zinc yield of a purity of more than 99% followed. This way seems to be an optimal one for building a semi-industrial line for galvanic sludge recycling. All the partial products, i.e., the leach, the leaching residue, the filtrate, the solid precipitate and the separated metal on the cathode were subjected to chemical analyses. The analyses results are presented in tables and graphs.Web of Science1211art. no. 194

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Elektronová metalurgie vysokotavitelných kovů, slitin a sloučenin

Import 20/04/2006Prezenční výpůjčkaVŠB - Technická univerzita Ostrava. Fakulta metalurgie a materiálového inženýrstv