Highly integrated power electronic converters using active devices embedded in printed-circuit board

International audienceIn this paper, we present a short overview of the power dies interconnects based on PCB technology, then we focus on embedding of power dies in the PCB material. In the second part of the article, we present in details the technology we developed to embed dies in PCB. Results show that the electrical performance of the die remains satisfying after embedding, but that dies with a copper topside metal layer are required for this process

Enhanced strong interaction between nanocavities and p-shell excitons beyond the dipole approximation

Large coupling strengths in exciton-photon interactions are important for the quantum photonic network, while strong cavity–quantum dot interactions have been focused on s-shell excitons with small coupling strengths. Here we demonstrate strong interactions between cavities and p-shell excitons with a great enhancement by the in situ wave-function control. The p-shell excitons are demonstrated with much larger wave-function extents and nonlocal interactions beyond the dipole approximation. Then the interaction is tuned from the nonlocal to the local regime by the wave function shrinking, during which the enhancement is obtained. A large coupling strength of 210     μ eV has been achieved, indicating the great potential of p-shell excitons for coherent information exchange. Furthermore, we propose a distributed delay model to quantitatively explain the coupling strength variation, revealing the intertwining of excitons and photons beyond the dipole approximation