108,445 research outputs found

    Configurational and system requirements for control of large space systems

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    Control of large space systems, modeling, and control difficulties are discussed. Ground based analysis of spaceflight data are presented to determine structural dynamics characteristics for the purpose of revising control laws, and to trim the surface contour. Systems identification for adaptive control and automatic surface control are also considered

    Warpage eliminated in copper-clad microwave circuit laminates

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    Cryogenic treatment of laminated copper-clad microwave circuit boards eliminates stresses that cause warpage when a circuit is etched on one side of the board. After etching, the stresses may be eliminated to reduce warpage

    Solar cell and circuit array and process for nullifying magnetic fields Patent

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    Negation of magnetic fields produced by thin waferlike circuit elements in space vehicle

    Large-scale solar thermal collector concepts

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    Thermal collector could be used ultimately to power steamplant to produce electricity. Collector would consist of two major subsystems: (1) series of segmented tracking mirrors with two axes of rotation and (2) absorber mounted on centrally located tower

    Solar energy trap

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    An apparatus is described for trapping solar energy for heating a fluid that could be subsequently used in turbines and similar devices. The apparatus includes an elongated vertical light pipe having an open end through which the visible spectrum of electromagnetic radiation from the sun passes to strike a tubular absorber. The light pipe has a coated interior surface of a low absorptivity and a high reflectivity at the visible wavelengths and a high absorptivity/emissivity ratio at infrared wavelengths. The tubular absorber has a coating on the surface for absorbing visible wavelengths to heat the fluid passing through. Infrared wave lengths are radiated from the tubular absorber back into the light pipe for heating fluid passing through a tubular coil wound around it

    Glass encapsulation provides extra protection for IC semiconductor devices

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    Oxide-passivated semiconductor chip is given protective glass coating by means of vapor deposition over metallic substrate of integrated circuit (IC). Method provides more reliable oxide-passivation and hermetic sealing in current use. Chips and scratches incurred during dicing, testing, and assembly are markedly reduced

    Unfulfilled technology needs in space power systems

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    Major power system technology development needs related to the solution of currently existing problems are defined. The identified problems were initially listed and categorized by technical area. They were then translated into terms of technology development requirements and consolidated where commonality was found. From these requirements, a set of ten specific recommendations for technology development was formulated

    A study of multiple-shaker modal survey testing

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    The principal objective was to examine and to assess the practical value of a method of multiple-shaker sinusoidal modal vibration testing known as Asher's method. Numerical studies which simulate the application of Asher's method and a unique experimental implementation of the method were completed. Another objective of the research was to develop and to demonstrate with numerical simulation a quantitative method for determining from transfer function data the number of dominant modes of vibration in sinusoidal structural response

    Comparative values of advanced space solar cells

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    A methodology for deriving a first order dollar value estimate for advanced solar cells which consists of defining scenarios for solar array production and launch to orbit and the associated costs for typical spacecraft, determining that portion affected by cell design and performance and determining the attributable cost differences is presented. Break even values are calculated for a variety of cells; confirming that efficiency and related effects of radiation resistance and temperature coefficient are major factors; array tare mass, packaging and packing factor are important; but cell mass is of lesser significance. Associated dollar values provide a means of comparison

    Stress relief of copper clad microwave circuit laminates to reduce and prevent warpage

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    Stress relief of copper-clad microwave circuit laminates to reduce and prevent warpag
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