In Search of Middle Indonesia

The middle classes of Indonesi

High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

The paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer foed-through with a small parasitic capacitance to the substrate and a high placing density is presented

Fiber-top atomic force microscope

We present the implementation of an atomic force microscope (AFM) based on fiber-top design. Our results demonstrate that the performances of fiber-top AFMs in contact mode are comparable to those of similar commercially available instruments. Our device thus represents an interesting\ud alternative to existing AFMs, particularly for applications outside specialized research laboratories, where a compact, user-friendly, and versatile tool might often be preferred

Capillary origami of micro-machined micro-objects: Bi-layer conductive hinges

Recently, we demonstrated controllable 3D self-folding by means of capillary forces of silicon-nitride micro-objects made of rigid plates connected to each other by flexible hinges [1]. In this paper, we introduce platinum electrodes running from the substrate to the plates over these bendable hinges. The fabrication yield is as high as (77 +/- 2) % for hinges with a length less than 75 {\mu}m. The yield reduces to (18 +/- 2) % when the length increases above 100 {\mu}m. Most of the failures in conductivity are due to degradation of the platinum/chromium layer stack during the final plasma cleaning step. The bi-layer hinges survive the capillary folding process, even for extremely small bending radii of 5 {\mu}m, nor does the bending have any impact on the conductivity. Stress in the different layers deforms the hinges, which does not affect the conductivity. Once assembled, the conductive hinges can withstand a current density of (1.6 +/- 0.4) $10^6$ A/cm$^2$ . This introduction of conductive electrodes to elastocapillary self-folded silicon-based micro-objects extends the range of their possible applications by allowing an electronic functionality of the folded parts.Comment: Currently on a peer review process. 13 page

Elastocapillary folding using stop-programmable hinges fabricated by 3D micro-machining

We show elasto-capillary folding of silicon nitride objects with accurate folding angles between flaps of 70.6$\pm$0.1{\deg} and demonstrate the feasibility of such accurate micro-assembly with a final folding angle of 90{\deg}. The folding angle is defined by stop-programmable hinges that are fabricated starting from silicon molds employing accurate three-dimensional corner lithography. This nano-patterning method exploits the conformal deposition and the subsequent timed isotropic etching of a thin film in a 3D shaped silicon template. The technique leaves a residue of the thin film in sharp concave corners which can be used as an inversion mask in subsequent steps. Hinges designed to stop the folding at 70.6{\deg} were fabricated batchwise by machining the V-grooves obtained by KOH etching in (110) silicon wafers; 90{\deg} stop-programmable hinges were obtained starting from silicon molds obtained by dry etching on (100) wafers. The presented technique is applicable to any folding angle and opens a new route towards creating structures with increased complexity, which will ultimately lead to a novel method for device fabrication.Comment: Submitted to a peer reviewed journa

Report of the workshop ‘New Law, New Villages? Changing rural Indonesia’

Effective Protection of Fundamental Rights in a pluralist worl