Folk Art and Art Worlds

Respected voices combine in this volume to address the fundamental issues pertaining to American folk art. The eleven original essays explore the changing face of folk art in its different contexts or folk art worlds --the worlds of the creator, the academic, the art dealer, the gallery or museum, and the community. A new Introduction considers supplemental works on American Folk Art that have appeared since the volume was first published.https://digitalcommons.usu.edu/usupress_pubs/1178/thumbnail.jp

Diversity of O Antigens within the Genus Cronobacter: from Disorder to Order

Cronobacter species are Gram-negative opportunistic pathogens that can cause serious infections in neonates. The lipopolysaccharides (LPSs) that form part of the outer membrane of such bacteria are possibly related to the virulence of particular bacterial strains. However, currently there is no clear overview of O-antigen diversity within the various Cronobacter strains and links with virulence. In this study, we tested a total of 82 strains, covering each of the Cronobacter species. The nucleotide variability of the O-antigen gene cluster was determined by restriction fragment length polymorphism (RFLP) analysis. As a result, the 82 strains were distributed into 11 previously published serotypes and 6 new serotypes, each defined by its characteristic restriction profile. These new serotypes were confirmed using genomic analysis of strains available in public databases: GenBank and PubMLST Cronobacter. Laboratory strains were then tested using the current serotype-specific PCR probes. The results show that the current PCR probes did not always correspond to genomic O-antigen gene cluster variation. In addition, we analyzed the LPS phenotype of the reference strains of all distinguishable serotypes. The identified serotypes were compared with data from the literature and the MLST database (www.pubmlst.org/cronobacter/). Based on the findings, we systematically classified a total of 24 serotypes for the Cronobacter genus. Moreover, we evaluated the clinical history of these strains and show that Cronobacter sakazakii O2, O1, and O4, C. turicensis O1, and C. malonaticus O2 serotypes are particularly predominant in clinical cases

Computer-Aided Design of Broad-Band Amplifiers with Complex Loads

Coordinated Science Laboratory was formerly known as Control Systems LaboratoryJoint Services Electronics Program / DAAB 07-67-C-019

Bud13 Promotes a Type I Interferon Response By Countering Intron Retention in Irf7

Intron retention (IR) has emerged as an important mechanism of gene expression control, but the factors controlling IR events remain poorly understood. We observed consistent IR in one intron of the Irf7 gene and identified BUD13 as an RNA-binding protein that acts at this intron to increase the amount of successful splicing. Deficiency in BUD13 was associated with increased IR, decreased mature Irf7 transcript and protein levels, and consequently a dampened type I interferon response, which compromised the ability of BUD13-deficient macrophages to withstand vesicular stomatitis virus (VSV) infection. Global analysis of BUD13 knockdown and BUD13 cross-linking to RNA revealed a subset of introns that share many characteristics with the one found in Irf7 and are spliced in a BUD13-dependent manner. Deficiency of BUD13 led to decreased mature transcript from genes containing such introns. Thus, by acting as an antagonist to IR, BUD13 facilitates the expression of genes at which IR occurs

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important ther- mal issues due to the presence of processing units with a high power density, which are not homogeneously distributed in the stack. Also, the presence of hot-spots creates thermal gradients that impact negatively on the system reliability and relate with the leakage power consumption. Thus, new approaches for thermal control of 3D chips are in great need. This paper discusses the use of a grid and non-uniform placement of TSVs as an effective mechanism for thermal balancing and control in 3D chips. We have modelled the material layers and TSVs mathematically using a detailed calibration phase based on a real 5-tier 3D chip stack, where several heaters and sensors are manufactured to study the heat diffusion. The obtained results show interesting conclusions about thermal dissipation for 3D chips with TSVs and outline new insights in the area of thermal modeling and optimization for 3D chips by exploiting the inclusion of minimal percentages of TSVs in strategic positions of the layout

Use of cement suspension as an alternative matrix material for textile-reinforced concrete

Textile-reinforced concrete (TRC) is a material consisting of high-performance concrete (HPC) and tensile reinforcement comprised of carbon roving with epoxy resin matrix. However, the problem of low epoxy resin resistance at higher temperatures persists. In this work, an alternative to the epoxy resin matrix, a non-combustible cement suspension (cement milk) which has proven stability at elevated temperatures, was evaluated. In the first part of the work, microscopic research was carried out to determine the distribution of particle sizes in the cement suspension. Subsequently, five series of plate samples differing in the type of cement and the method of textile reinforcement saturation were designed and prepared. Mechanical experiments (four-point bending tests) were carried out to verify the properties of each sample type. It was found that the highest efficiency of carbon roving saturation was achieved by using finer ground cement (CEM 52.5) and the pressure saturation method. Moreover, this solution also exhibited the best results in the four-point bending test. Finally, the use of CEM 52.5 in the cement matrix appears to be a feasible variant for TRC constructions that could overcome problems with its low temperature resistance

Bud13 Promotes a Type I Interferon Response By Countering Intron Retention in Irf7

Intron retention (IR) has emerged as an important mechanism of gene expression control, but the factors controlling IR events remain poorly understood. We observed consistent IR in one intron of the Irf7 gene and identified BUD13 as an RNA-binding protein that acts at this intron to increase the amount of successful splicing. Deficiency in BUD13 was associated with increased IR, decreased mature Irf7 transcript and protein levels, and consequently a dampened type I interferon response, which compromised the ability of BUD13-deficient macrophages to withstand vesicular stomatitis virus (VSV) infection. Global analysis of BUD13 knockdown and BUD13 cross-linking to RNA revealed a subset of introns that share many characteristics with the one found in Irf7 and are spliced in a BUD13-dependent manner. Deficiency of BUD13 led to decreased mature transcript from genes containing such introns. Thus, by acting as an antagonist to IR, BUD13 facilitates the expression of genes at which IR occurs

Integrating Abstraction Techniques for Formal Verification of Analog Designs

The verification of analog designs is a challenging and exhaustive task that requires deep understanding of physical behaviours. In this paper, we propose a qualitative based predicate abstraction method for the verification of a class of non-linear analog circuits. In the proposed method, system equations are automatically extracted from a circuit diagram by means of a bond graph. Verification is applied based on combining techniques from constraint solving and computer algebra along with symbolic model checking. Our methodology has the advantage of avoiding exhaustive simulation normally encountered in the verification of analog designs. To this end, we have used Dymola, Hsolver, SMV and Mathematica to implement the verification flow. We illustrate the methodology on several analog examples including Colpitts and tunnel diode oscillators