Admittance of MIS structures based on graded-gap MBE HgCdTe with Al2O3 insulator

The paper presents the results of studies of the admittance of MIS structures based on heteroepitaxial MBE n (p)-Hg0.78Cd0.22Te with insulator coating SiO2/Si3N4 and Al2O3 in the test signal frequency range 10 kHz-1 MHz at temperatures ranging from 8 to 220 K. The main parameters of MIS structures with different insulators were determined. MIS structures with Al2O3 have a large enough insulator capacitance (compared to SiO2/Si3N4), a significant modulation capacitance on the CV characteristics, high dielectric strength and low values of the flat-band voltage. The effective charge density found from the value of the flat-band voltage and slow interface trap density for structures with Al2O3 comparable with the corresponding densities for structures with SiO2/Si3N4

Impact of the graded-gap layer on the admittance of MIS structures based on MBE-grown n-Hg1-xCdxTe (x = 0.22-0.23) with the Al2O3 insulator

The impact of the presence of the near-surface graded-gap layers with an increased content of CdTe on the admittance of MIS structures based on MBE-grown n-Hg1–xCdxTe (x = 0.22–0.23) with the Al2O3 insulating coating has been experimentally studied. It has been shown that the structures with a gradedgap layer are characterized by a deeper and wider capacitance dip in the low-frequency capacitance–voltage (CV) characteristic and by higher values of the differential resistance of the space-charge region than the structures without such a layer. It has been found that the main features of the hysteresis of capacitance dependences typical of the graded-gap structures with SiO2/Si3N4 are also characteristic of the MIS structures with the Al2O3 insulator. The factors that cause an increase in the CV characteristic hysteresis upon formation of the graded-gap layer in structures with SiO2/Si3N4 or Al2O3 are still debatable, although it may be assumed that oxygen plays a certain role in formation of this hysteresis

Properties of arsenic-implanted Hg1-xCdxTe MBE films

Defect structure of arsenic-implanted Hg1-xCdxTe films (x=0.23–0.30) grown with molecular-beam epitaxy on Si substrates was investigated with the use of optical methods and by studying the electrical properties of the films. The structural perfection of the films remained higher after implantation with more energetic arsenic ions (350 keV vs 190 keV). 100%-activation of implanted ions as a result of post-implantation annealing was achieved, as well as the effective removal of radiation-induced donor defects. In some samples, however, activation of acceptor-like defects not related to mercury vacancies as a result of annealing was observed, possibly related to the effect of the substrate

Accumulation and annealing of radiation donor defects in arsenic-implanted Hg0.7Cd0.3Te films

Processes of accumulation and annealing of radiation-induced donor defects in arsenic-implanted Hg0.7Cd0.3Te films were studied with the use of the Hall-effect measurements with processing the data with mobility spectrum analysis. A substantial difference in the effects of arsenic implantation and post-implantation activation annealing on the properties of implanted layers and photodiode ‘base’ layers in Hg0.7Cd0.3Te and Hg0.8Cd0.2Te films was established and tentatively explained

Influence of As+ Ion implantation on properties of MBE HgCdTe near-surface layer characterized by metal–insulator–semiconductor techniques

The effect of As+ ion implantation on the electrical properties of the near-surface layer of n-HgCdTe films grown by molecular beam epitaxy (MBE) on Si (310) substrates was experimentally studied. A specific feature of MBE n-Hg0.78Cd0.22Te films is the presence of near-surface graded-gap layers with a high CdTe content, formed during epitaxial growth. The properties of as-grown films and films after As+ ion implantation with ion energy of 200 keV and fluence of 1014 cm−2 were studied. Post-implantation activation annealing was not performed. Test metal–insulator–semiconductor (MIS) structures were created based on as-grown and as-implanted samples by plasma-enhanced atomic layer deposition of Al2O3 insulator films. The admittance of the fabricated MIS structures was measured over a wide range of frequencies and temperatures. When determining the parameters of MIS structures, we used techniques that take into account the presence of near-surface graded-gap layers and series resistance of the HgCdTe film bulk, as well as the high density of slow surface states. It was found that, in as-implanted samples, the donor center concentration in the near-surface layer exceeds 1017 cm−3 and increases with distance from the HgCdTe-Al2O3 interface (at least up to 90 nm). After implantation, the conductivity of MBE HgCdTe film bulk increases markedly. It was shown that, for as-implanted samples, the generation rate of minority charge carriers in the MBE HgCdTe surface layer is significantly reduced, which indicates the appearance of a low defect layer with a thickness of at least 90 nm

Localization and nature of radiation donor defects in the arsenic implanted CdHgTe films grown by MBE

By profiling the electrical parameters of the arsenic implanted CdHgTe films, grown by molecular bea

Fluence dependence of nanosize defect layers in arsenic implanted HgCdTe epitaxial films studied with TEM/HRTEM

We report on the results of comparative study of fluence dependence of defect layers in molecular-beam epitaxy-grown epitaxial film of p-Hg1-х CdхTe (х=0.22) implanted with arsenic ions with 190 keV energy and fluence 1012, 1013, and 1014 cm-2

Electrical characterization of insulator-semiconductor systems based on graded band gap MBE HgCdTe with atomic layer deposited Al2O3 films for infrared detector passivation

The electrical properties of MIS structures based on graded band gap Hg0.77Cd0.23Te grown by the molecular beam epitaxy method with the Al2O3 dielectric formed by the plasma enhanced atomic layer deposition method were investigated. It is established that for such structures the recharge of slow states takes place and significantly distorts the form of the capacitance-voltage (C-V) characteristics. A technique is proposed for constructing the C-V curves of HgCdTe MIS structures, which makes it possible to eliminate the effect of slow surface states. It is shown that Al2O3 films are suitable for passivation of infrared detectors due to small flat band voltages leading to the realization of the depletion or weak inversion modes. The hysteresis of electrical characteristics is eliminated when an intermediate CdTe layer with a thickness of about 0.2 μm is grown in situ during the epitaxial growth

Admittance studies of modification of HgCdTe surface properties with ion implantation and thermal annealing

Metal–insulator–semiconductor (MIS) structures based on HgCdTe were fabricated after various stages of p