Investigation of the Fundamental Reliability Unit for Cu Dual-Damascene Metallization

An investigation has been carried out to determine the fundamental reliability unit of copper dual-damascene metallization. Electromigration experiments have been carried out on straight via-to-via interconnects in the lower metal (M1) and the upper metal (M2), and in a simple interconnect tree structure consisting of straight via-to-via line with an extra via in the middle of the line (a "dotted-I"). Multiple failure mechanisms have been observed during electromigration testing of via-to-via Cu interconnects. The failure times of the M2 test structures are significantly longer than that of identical M1 structures. It is proposed that this asymmetry is the result of a difference in the location of void formation and growth, which is believed to be related to the ease of electromigration-induced void nucleation and growth at the Cu/Si₃N₄ interface. However, voids were also detected in the vias instead of in the Cu lines for some cases of early failure of the test lines. These early failures are suspected to be related to the integrity and reliability of the Cu via. Different magnitudes and directions of electrical current were applied independently in two segments of the interconnect tree structure. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigration-resistant overlayer in Cu technology allows smaller voids to cause failure in Cu compared to Al. Moreover, the Si₃N₄ overlayer that serves as an interlevel diffusion barrier provides sites for easy nucleation of voids and also provides a high diffusivity path for electromigration. The results reported here suggest that while segments are not the fundamental reliability unit for circuit-level reliability assessments for Al or Cu, vias, rather than trees, might be the appropriate fundamental units for the assessment of Cu reliability.Singapore-MIT Alliance (SMA

La Grande-Bretagne, l'Europe et l'Entente franco-anglaise

Poliakoff Augur V. La Grande-Bretagne, l'Europe et l'Entente franco-anglaise. In: Politique étrangère, n°1 - 1936 - 1ᵉannée. pp. 43-51

Effects of nitrogen availability on microbial activities, densities and functional diversities involved in the degradation of a Mediterranean evergreen oak litter (Quercus ilex L.)

The effect of available nitrogen N ((NH4)(2)SO4) amendments on various microbial variables in three different layers (OhLn, OhLv, OhLf) of a Mediterranean litter profile under an evergreen oak forest (Quercus ilex L.) were studied. Since Mediterranean litters are generally N limiting, the goal of the study was to understand how low (0.1 and 1 %) and high (5 and 10%) N amendments impact specific biological variables such as hyphal length, community-level-catabolic-profiles (CLCPs) in ECO and FF Biolog (TM) plates, basal respiration, enzymatic activities (i.e. alkaline phosphatases (AIP), laccases, peroxidases and cellulases), and laccase and cellulase isoforms from three different litter layers. Results indicated that the effects of N amendments occurred over very short incubation time (3 d), and varied depending on N concentration and litter organic matter (OM) quality (i.e. depth). Thus, it appeared that the more active layer was the intermediate (OhLv) layer, which probably contained the most labile and available C pools. As a consequence, OhLv was also the layer showing globally the more intensive microbial responses following low N amendments. Indeed, in this layer, low N supplies caused several marked increases in enzymes activities (i.e. laccases, cellulases and alkaline phosphatases), hyphal length and isoenzyme patterns, suggesting a microbial reallocation of C to biomass and enzyme production. On the contrary, high N supplies resulted in adverse effects on almost all the variables, suggesting repression or cytotoxic phenomena

Initial proteome analysis of caffeine-induced proteins in Aspergillus tamarii using two-dimensional fluorescence difference gel electrophoresis

Caffeine is toxic to most microorganisms. However, some filamentous fungi, such as Aspergillus tamarii, are able to metabolize this alkaloid when fed caffeine as the sole nitrogen source. The aim of the present work was to identify intracellular A. tamarii proteins, regulated by caffeine, using fluorescence difference two-dimensional gel electrophoresis. Specific proteins from two culture media of A. tamarii grown either on ammonium sulfate or caffeine as the sole nitrogen source were analysed by mass spectrometry. Thirteen out of a total of 85 differentially expressed spots were identified after database search. Identified up-regulated proteins include phosphoglycerate kinase, malate dehydrogenase, dyp-type peroxidase family protein, heat shock protein, Cu, Zn superoxidase dismutase and xanthine dehydrogenase. Some of the proteins identified in this study are involved in the caffeine degradation pathway as well as in stress response, suggesting that stress proteins could be involved in caffeine metabolism in filamentous fungi