Development of an RF IV waveform based stress test procedure for use on GaN HFETs

This paper reports on the development of an RF IV waveform based stress test procedure. DC and low-voltage RF characterisation was carried out before and after high power RF stress. RF waveform measurements showed that the exact change in the RF load line induced during RF degradation cannot be directly inferred from the DC or low power RF measurement. The RF degradation takes the form of a knee-walkout, a small pinch-off shift consistent with charge trapping and defect generation, and in addition gate leakage occurs once the RF voltage exceeds a critical voltage

Hot-Electron Electroluminescence under RF Operation in GaN-HEMTs::A Comparison Among Operational Classes

Electroluminescence microscopy and spectroscopy are used to compare the average hot-electron concentration and temperature under radio frequency (RF) operation class A, class B, and class F modes. From the results obtained, class A results, on average, in the highest hot-electron concentration, while class F is the mode with the lowest concentration due to its “L”-shaped load line. The electron temperature extracted from the electroluminescence spectra is reduced with increasing RF power, reflecting the dominance of electroluminescence from the portion of the load line in the semi-on region. The electroluminescence method is not able to give substantial information on the portion of the load line with high field and low current density which will be responsible for the potentially damaging hottest electrons present in the channel