OLED on silicon for sensor applications

We present two different approaches of OLED devices that are suitable for lab-on-a-chip applications. These include near UV electroluminescence (EL) and optically filtered green light to spectrally separate excitation from sample emission peaks. Both device architectures can be used for large-area deposition as wel as integration onto Silicon-CMOS backplanes

Thin film organic photodiodes on complementary metal-oxide-semiconductor (CMOS) materials Structured via orthogonal photolithography for sensor applications

In this work we present an easy and cheap method to structure organic photodetectors integrated on an 200 mm silicon wafer in combination with a thin film encapsulation. A new top absorbing organic photodetector device is discussed, structured with the orthogonal photo-lithography, for light sensors and organic photodetector applications

Zerstoerungsfreie Pruefung von beschichteten Komponenten fuer Fluggasturbinen Abschlussbericht

Within the framework of the joint project COST 501-II, this research project deals with the adaptation and application of advanced nondestructive test techniques in the field of testing of coated components in turbine construction. The aim of these tests is to detect the contour and coating thickness of coated turbine blades, coating flaws due to the production process and to operational use such as bonding flaws and cracks, to determine oxidation and sulfidation damage of temperature-stressed coated components, and to measure residual stresses very close to the surface of turbine blades provided with thermal barrier coatings. For this purpose, optical, ultrasound, eddy current, thermal and x-ray methods are used. (orig.)SIGLEAvailable from TIB Hannover: F95B1649+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Forschung und Technologie (BMFT), Bonn (Germany)DEGerman