Assessment of Low Cycle Fatigue Behavior of Powder Metallurgy Alloy U720

The fatigue lives of modem powder metallurgy disk alloys are influenced by variabilities in alloy microstructure and mechanical properties. These properties can vary as functions of variables the different steps of materials/component processing: powder atomization, consolidation, extrusion, forging, heat treating, and machining. It is important to understand the relationship between the statistical variations in life and these variables, as well as the change in life distribution due to changes in fatigue loading conditions. The objective of this study was to investigate these relationships in a nickel-base disk superalloy, U720, produced using powder metallurgy processing. Multiple strain-controlled fatigue tests were performed at 538 C (1000 F) at limited sets of test conditions. Analyses were performed to: (1) assess variations of microstructure, mechanical properties, and LCF failure initiation sites as functions of disk processing and loading conditions; and (2) compare mean and minimum fatigue life predictions using different approaches for modeling the data from assorted test conditions. Significant variations in life were observed as functions of the disk processing variables evaluated. However, the lives of all specimens could still be combined and modeled together. The failure initiation sites for tests performed at a strain ratio R(sub epsilon) = epsilon(sub min)/epsilon(sub max) of 0 were different from those in tests at a strain ratio of -1. An approach could still be applied to account for the differences in mean and maximum stresses and strains. This allowed the data in tests of various conditions to be combined for more robust statistical estimates of mean and minimum lives

Fluidic and mechanical thermal control devices

In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state-of-the-art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified