The effect of topical anti blister products on the risk of friction blister formation on the foot

Introduction Foot blisters are a common injury, which can impact on activity and lead to infection. Increased skin surface hydration has been identified as a risk factor for blister formation, indicating that a reduction in hydration could reduce the risk of blister formation. Method Thirty healthy adults were randomised into 3 groups, each receiving a preventative foot blister treatment (2Toms® Blister Shield®; Flexitol® Blistop and Boots Anti–Perspirant Foot Spray). Cycles of compression and shear loads where applied to heel skin using a mechanism driven by compressed air. Temperature changes were measured during load application using a thermal imaging camera (FLIR Systems Inc. and Therm CAM™ Quick Report). Near surface hydration of the skin was measured using a Corneometer® (C & K, Germany). Results There was no significant difference in the rate of temperature change of the skin between the three groups compared to not using products (p = 0.767, p = 0.767, p = 0.515) or when comparing each product (p = 0.551). There was a significant decrease in near surface skin hydration, compared to baseline, after the application of powder (−8.53 AU, p = 0.01). There was no significant difference in hydration after the application of film former and antiperspirant (−1.47 AU, p = 0.26; −1.00 AU, p = 0.80, respectively). Conclusion With the application of external load we found no significant difference in the effect of the three products on temperature change. The powder product demonstrated an effect on reducing the risk of blister. It is postulated that powder may have a barrier effect

Study of impact of thermal refinishing process on reliability of COTS components

Aerospace, Defence and High Performance (ADHP) industry has little choice but to rely on the use of commercial-of-the-shelf (COTS) electronics components for their products and equipment. As these electronics components are now predominantly packaged as lead-free (Pb-free) to comply with RoHS and other similar legislations, their use in high reliability and long service life applications is highly problematic. Reliability of component assemblies with Pb-free finishes and Pb-free solder materials is highly uncertain due to the risk of short-circuit failures caused by tin whiskers growth. One strategy to mitigate this risk in the case of leaded components is to replace to Pb-free finishes with traditional tin-lead (SnPb) solder. This refinishing process, termed hot solder dipping, is available as fully automated robotic process. However, as it involves thermal loads, the impact of refinishing on components has to be understood. This paper details the advantages of using validated thermal models of HSD process to assess thermal responses and propensity to damage. Vulnerability of a component is strongly influenced by the package design and in particular by the nature of the heat path from the dipped terminations to the IC die

Exploring Doctoral Student Identity Development Using a Self-Study Approach

The doctoral journey is as much about identity transitions as it is about becoming an expert in a field of study. However, transitioning from past and professional lives and identities to scholarly identities is not an easy process. Three doctoral students at various stages of completion engaged in self-study research to explore their emerging identities as doctoral student practitioners. Drawing on self-study and doctoral student identity research, as well as findings from our individual analyses, we explore how self-study can be used as an authentic and positive experience to help doctoral students understand their scholarly identity development. After describing the benefits of self-study research for doctoral student success, we provide practical guidelines for how to implement self-study research into existing doctoral programs

Experimental and modelling study on the effects of refinishing lead-free microelectronic components

Hot Solder Dip (HSD) of electronic components originally manufactured with lead-free solder finishes is seen as a potential solution for making these components available and used in high reliability and critical safety equipment. In this process, also referred as “refinishing”, tin and tin-reach alloy coatings on package terminations are replaced with tin-lead solder thus reducing the risk of failures caused by tin whisker growth. Characterising the effect of HSD process on refinished components from thermo-mechanical point of view is critical. This paper details the findings of an integrated experimental and modelling study that aimed at assessing the impact of the thermal shock induced from HSD on several different Quad Flat Package (QFP) variants and in relation to their subsequent long-term reliability