Performance Implications of Single Thread Migration on a Chip Multi-Core

High performance multi-core processors are becoming an industry reality. Although multi-cores are suited for multithreaded and multi-programmed workloads, many applications are still mono-thread and multi-core performance with a single thread workload is an important issue. Furthermore, recent studies suggest that performance, power and temperature considerations of future multi-cores may necessitate activity-migration between cores. Motivated by the above, this paper investigates the performance implications of single thread migration on a multi-core. Specifically, the study considers the influence on the performance of a single thread of the following migration and multi-core parameters: frequency of migration, core warm-up modes, subset of resources that are warmed-up, number of cores, and cache hierarchy organization. The results of this study can provide insight to architects on how to design performance-efficient power and thermal strategies for a multi-core chip. The experimental results, for the benchmarks and microarchitectures used in this study, show that the performance loss due to activity migration on a multi-core with private L1s and a shared L2 can be minimized if: (a) a migrating thread continues its execution on a core that was previously visited by the thread, and (b) cores remember their predictor state since their previous activation (all other core resources can be cold). The data also show that the transfer of the register state between two cores can be slow, latency of several 100s of cycles, without limiting performance.

An analytical model of temperature in microprocessors

Temperature has become an important design constraint for high-performance microprocessors. Research on temperature-constrained microarchitecture requires an efficient modeling of temperature. We propose an analytical model of temperature, based on solving a boundary-value problem of heat conduction. The model gives steady-state and transient temperature at any point on the dissipating plane, assuming rectangle-shaped surface sources. The model can be used to reason about temperature. It can also be implemented in a performance/power microarchitecture simulator. We provide two examples illustrating these uses