Ion projection direct structuring for patterning of magnetic media

Ion projection facilitates a direct structuring, which is an attractive potential manufacturing process for patterned storage media. An advantage to this method is that the media roughness remains unchanged. The feasibility of ion projection direct structuring for processing full disk surfaces was investigated using a next generation lithography projector. Co-Pt multilayer films with strong perpendicular anisotropy were deposited on 1-in glass disks as used in the IBM microdrive and on Si substrates. Concentric tracks including data, as well as head positioning servo structures, were patterned in a single exposure step with 45 keV He+ at a 4 × demagnification. In a second experiment, sub-100-nm magnetic islands were produced using projection at 8.7 × demagnification and visualized by magnetic force microscopy

Le artroprotesi modulari nella chirurgia oncologica

Il ginocchio \ue8 la sede pi\uf9 frequentemente coinvolta nei tumori primitivi dello scheletro (60%), soprattutto a livello del femore distale. L\u2019osteosarcoma, il sarcoma di Ewing ed il condrosarcoma sono le neoplasie maligne primitive pi\uf9 comuni in questa sede. Tra le lesioni benigne ricordiamo il tumore a cellule giganti, la cisti aneurismatica ed il condroblastoma. L\u2019et\ue0 pi\uf9 colpita \ue8 quella degli adolescenti e dei giovani adulti

Large-Field Ion-Optics for Projection and Proximity Printing and for Mask-Less Lithography (ML2)

Recent studies carried out with Infineon Technologies have shown the utility of Ion Projection Lithography (IPL) for the manufacturing of integrated circuits. In cooperation with IBM Storage Technology Division the patterning of magnetic films by resist-less Ion Projection Direct Structuring (IPDS) has been demonstrated. With masked ion beam proximity techniques unique capabilities for lithography on non-planar (curved) surfaces are outlined. Designs are presented for a masked ion beam proximity lithography (MIBPL) exposure tool with sub - 20 nm resolution capability within 88 mmo exposure fields. The possibility of extremely high reduction ratios (200:1) for high-volume ion projection mask-less lithography (IP-ML2) is discussed

Large-Field Ion-Optics for Projection and Proximity Printing and for Mask-Less Lithography (ML2)

Recent studies carried out with Infineon Technologies have shown the utility of Ion Projection Lithography (IPL) for the manufacturing of integrated circuits. In cooperation with IBM Storage Technology Division the patterning of magnetic films by resist-less Ion Projection Direct Structuring (IPDS) has been demonstrated. With masked ion beam proximity techniques unique capabilities for lithography on non-planar (curved) surfaces are outlined. Designs are presented for a masked ion beam proximity lithography (MIBPL) exposure tool with sub - 20 nm resolution capability within 88 mmo exposure fields. The possibility of extremely high reduction ratios (200:1) for high-volume ion projection mask-less lithography (IP-ML2) is discussed