On SS-nn-absorbing ideals

Let $R$ be a commutative ring with identity, $S$ a multiplicative subset of $R$ and $I$ an ideal of $R$ disjoint from $S$. In this paper, we introduce the notion of an $S$-$n$-absorbing ideal which is a generalization of both the $S$-prime ideals and $n$-absorbing ideals. Moreover, we investigate the basic properties, quotient extension, existence and amalgamation of $S$-$n$-absorbing ideals.Comment: 18page

Characterization of the ATP transporter in the reconstituted rough endoplasmic reticulum proteoliposomes

AbstractAdenosine triphosphate (ATP) transporter from rat liver rough endoplasmic reticulum (RER) was solubilized and reconstituted into phosphatidylcholine liposomes. The RER proteoliposomes, resulting from optimizing some reconstitution parameters, had an apparent Km value of 1.5 μM and a Vmax of 286 pmol min−1 (mg protein)−1 and showed higher affinity for ATP and a lower Vmax value than intact RER (Km of 6.5 μM and Vmax of 1 nmol). ATP transport was time- and temperature-dependent, inhibited by 4,4′-diisothiocyanostilbene-2,2′-disulfonic acid, which is known as an inhibitor of anion transporters including ATP transporter, but was not affected by atractyloside, a specific inhibitor of mitochondrial ADP/ATP carrier. The internal and external effects of various nucleotides on the ATP transport were examined. ATP transport was cis-inhibited strongly by ADP and weakly by AMP. ADP-preloaded RER proteoliposomes showed a specific increase of ATP transport activity while AMP-preloaded RER proteoliposomes did not show the enhanced overshoot peak in the ATP uptake plot. These results demonstrate the ADP/ATP antiport mechanism of ATP transport in rat liver RER

Input of terrestrial organic matter linked to deglaciation increased mercury transport to the Svalbard fjords

Deglaciation has accelerated the transport of minerals as well as modern and ancient organic matter from land to fjord sediments in Spitsbergen, Svalbard, in the European Arctic Ocean. Consequently, such sediments may contain significant levels of total mercury (THg) bound to terrestrial organic matter. The present study compared THg contents in surface sediments from three fjord settings in Spitsbergen: Hornsund in the southern Spitsbergen, which has high annual volume of loss glacier and receives sediment from multiple tidewater glaciers, Dicksonfjorden in the central Spitsbergen, which receives sediment from glacifluvial rivers, and Wijdefjorden in the northern Spitsbergen, which receive sediments from a mixture of tidewater glaciers and glacifluvial rivers. Our results showed that the THg (52 +/- 15 ng g(-1)) bound to organic matter (OM) was the highest in the Hornsund surface sediments, where the glacier loss (0.44 km(3) yr(-1)) and organic carbon accumulation rates (9.3 similar to 49.4 g m(-2) yr(-1)) were elevated compared to other fjords. Furthermore, the delta C-13 (-27 similar to -24 parts per thousand) and delta S-34 values (-10 similar to 15 parts per thousand) of OM indicated that most of OM were originated from terrestrial sources. Thus, the temperature-driven glacial melting could release more OM originating from the meltwater or terrestrial materials, which are available for THg binding in the European Arctic fjord ecosystems.11Ysciescopu

Wafer Level Package for Image Sensor Module

A new ISM (image sensor module) WLP (wafer level package) for reflow process is designed, fabricated and tested. The ISM WLP is composed of polymer bonding layer, glass cap wafer for particle free process and CIS (CMOS Image Sensor) chip wafer which has micro via hole interconnection. During the last decades, WLP is highlighted as the next generation ISM Package method for many advantages like high yield (particle free process), small form factor (3D interconnection), low assembly cost and so on. Nevertheless these benefits, there are some problems like micro via hole fabrication, low temperature insulation process (inside hole), bottom side oxide etching, warpage control according to wafer level bonding using different material, and whole process temperature limitation for micro lens damage. Among various fabrication methods for ISM package, COB (Chip on board), COF (Chip on film), and L, T contact WLP from ShellCase are generally used. In case of COB and COF package, it has difficulty in particle control during assembly process. In case of ShellCase type WLP has very complicated fabrication process. Additionally, most of above package has disadvantage in size point of view. Through suggested ISM WLP using through interconnection via, wafer level fabrication & packaging technology is realized. It can not only solve problems of conventional packaging structures but also tremendously reduce the manufacturing & assembly cost (include time) of ISM package and realize real chip scale package. Based on sensor size, 3.67 X 3.42 X 0.39 (H) mm3 WLP is designed. During the parametric study using commercial 3-D simulation programs, silicon thickness, polymer bonding layer thickness, and glass thickness were chose the effective factor. And considering the optical and electrical analysis, we decide the parameter : silicon thickness is 0.1mm, polymer bonding layer thickness is 0.04mm, and glass thickness is 0.25mm. The fabrication process is composed bonding layer patterning, wafer bonding, thinning, via etching, passivation layer deposition, bottom oxide opening, metal plating, bottom electrode patterning, solder ball formation, and dicing. A new concept of ISM WLP has been founded to be suitable structure for low cost, small form factor application. We took good quality photo image using realized ISM WLP and obtained high electrical characteristics. Resist from GND to GND pad is measured 2.5 ohms. This package is realized with simple wafer level package technology. The proposed wafer level package can find applications, such as a next image sensor module

A Low-cost Through Via Interconnection for ISM WLP

WLP (Wafer level packaging) for image sensor devices has the advantage of small size, high performance and low cost, and becomes more and more important for ISM (image sensor module) products. In the WLP technology, in order to form electrical interconnection from image sensor contact pad to the backside of the wafer, several structures have been developed such as T-contact and TSV (Through Silicon Via). In this paper, a wafer level package of image sensor with new type TSV electrical interconnection for image sensor pad is presented. The target of this development is to reduce process cost and difficulty, and increase yield of image sensor packaging. Basic vertical via shape and low cost interconnection processes are adopted, compared to tapered via interconnection processes. Via etch problem caused by CIS wafer thickness non-uniformity was solved by remaining a fillet structure at the bottom of vias. This structure can prevent via notch and give better result of seed layer deposition and via filling

Recombinant uteroglobin prevents the experimental crescentic glomerulonephritis

Recombinant uteroglobin prevents the experimental crescentic glomerulonephritis.BackgroundAlthough uteroglobin is known to have an immunomodulatory property and prevents the deposition of immune-complexes on the glomeruli of mice, the therapeutic potential of uteroglobin is uncertain in glomerulonephritis. To test the hypothesis that uteroglobin can prevent glomerulonephritis, we have studied the effects of recombinant uteroglobin on the development of experimental crescentic glomerulonephritis that is induced by anti-glomerular basement membrane (anti-GBM) antibodies.Methods and ResultsGlomerulonephritis was induced by the intravenous injection of rabbit anti-GBM globulin antibodies into mice (C57BL/6), and renal injury was evaluated 7, 14, and 21 days afterward. Recombinant uteroglobin or phosphate-buffered saline (PBS) were given intravenously to mice for 3 days after anti-GBM antibody injection. Proteinuria was significantly reduced in mice treated with recombinant uteroglobin compared with disease-control mice at 7 and 14 days after an anti-GBM antibody injection, although the serum creatinine concentration was similar in both groups. The amount of proteinuria was similar in recombinant uteroglobin-treated and normal control mice. By histologic analysis, mesangial matrix expansion, mesangial proliferation, and cellular crescents representing crescentic glomerulonephritis were markedly attenuated by injection of recombinant uteroglobin. The in vitro proliferative responses of mesangial cells to lipopolysaccharide (LPS) were blunted by the addition of recombinant uteroglobin in a dose-dependent manner. The preventive effects exerted by recombinant uteroglobin treatment were based on the inhibition of antibodies and complement-3 deposition on the glomeruli.ConclusionThis study demonstrates the preventive effects of recombinant uteroglobin in an experimental model of crescentic glomerulonephritis, and suggests the therapeutic implications of uteroglobin for human chronic glomerulonephritis

Renal Cell Carcinoma in a Right Malrotated Kidney

The authors report a case of renal cell carcinoma in a right malrotated (horizontal axis) kidney. The patient was treated by hand-assisted laparoscopic radical nephrectomy. This is the first report of a horizontal axis malrotated kidney with renal cell carcinoma