Analysis and design of defected ground structure for EMC improvement in mixed-signal transceiver modules

In this research, the return path discontinuity (RPD), located under the power amplifier (PA) substrate, of X-band transceiver module (Base), mounted on a four-layer printed circuit board (PCB), is investigated to improve the signal integrity by reducing the difference in the reference potential. This study is performed by initially employing the wirebond method, through the assessment of both numbers and sizes of bondwires by advanced design system (ADS). Six bondwires of 25 µm are added, producing an improvement of 6.82 dB for the reflection coefficient and 1.19 dB for the isolation and insertion loss. For further improvement, spiral shape defected ground structure (DGS) is implemented in the inner ground layer (layer 2) without using bond wires. The DGS simulation results illustrate an improvement of 3 dB for S11 and 0.6 dB for S12. To improve the electromagnetic compatibility (EMC), the authors propose combination and integration of both wirebond and DGS methods, called wirebond–DGS method, which results in an improvement of 11.86 dB for S11, 1.34 dB for S12 and S21, and 12.03 dB for S22. Finally, the wirebond–DGS RF module was fabricated and the measurement results exhibit an improvement of 8.07 dB for S11 and 9.39 dB for S22 in comparison with the fabricated Base module. In addition, 0.53 dB improvement for both S12 and S21 is also achieved

Narrow bandpass filters based on the modified DGS

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Coplanar Waveguide Filters Based on Multi-Behavior Etched-Ground Stubs

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Lignes différentielles à ondes lentes intégrées sur silicium

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Improvement of the performance of optically controlled microstrop phase-shifters

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Slow-wave shielded coplaaer striplines for UWB filtering applications

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Slow-wave high-Q coplanar striplines in CMOS technology and their RLCG model

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Shielded Coplanar Striplines for RF Integrated Applications

International audienceIn this article, shielded coplanar striplines (S‐CPS) are studied to achieve slow‐wave transmission lines in a CMOS process. The slow‐wave propagation is achieved by placing floating strips below the CPS transmission line. The propagation parameters of such transmission lines are derived by simulations by means of a “full wave” 3D EM software. Quality factors as high as 35 at 10 GHz together with effective dielectric constants of 78 are reported. If these simulation results are confirmed by measurements, this would open the door to the possible realization of integrated transmission line‐based RF circuits such as power dividers, phase‐shifters, or filters of medium bandwidth below 10 GHz