Multiple functions of microfluidic platforms: Characterization and applications in tissue engineering and diagnosis of cancer

Microfluidic system, or lab-on-a-chip, has grown explosively. This system has been used in research for the first time and then entered in the clinical section. Due to economic reasons, this technique has been used for screening of laboratory and clinical indices. The microfluidic system solves some difficulties accompanied by clinical and biological applications. In this review, the interpretation and analysis of some recent developments in microfluidic systems in biomedical applications with more emphasis on tissue engineering and cancer will be discussed. Moreover, we try to discuss the features and functions of microfluidic systems. © 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinhei

Effect of inbreeding on intellectual disability revisited by trio sequencing

In outbred Western populations, most individuals with intellectual disability (ID) are sporadic cases, dominant de novo mutations (DNM) are frequent, and autosomal recessive ID (ARID) is very rare. Due to the high rate of parental consanguinity which raises the risk for ARID and other recessive disorders, the prevalence of ID is significantly higher in Near- and Middle-East countries. Indeed, homozygosity mapping and sequencing in consanguineous families have already identified a plethora of ARID genes, but due to the design of these studies, DNMs could not be systematically assessed, and the proportion of cases that are potentially preventable by avoiding consanguineous marriages or through carrier testing is hitherto unknown. This prompted us to perform whole exome sequencing in 100 sporadic ID patients from Iran and their healthy consanguineous parents. In 61 patients, we identified apparently causative changes in known ID genes. Of these, 44 were homozygous recessive and 17 dominant de novo mutations. Assuming that the DNM rate is stable, these results suggest that parental consanguinity raises the ID risk about 3.6-fold, and about 4.1-4.25-fold for children of first-cousin unions. These results do not rhyme with recent opinions that consanguinity-related health risks are generally small and have been 'overstated' in the past. This article is protected by copyright. All rights reserved

Advances in delamination modeling of metal/polymer systems: atomistic aspects

Adhesion and delamination have been pervasive problems hampering the performance and reliability of micro-and nano-electronic devices. In order to understand, predict, and ultimately prevent interface failure in electronic devices, development of accurate, robust, and efficient delamination testing and prediction methods is crucial. Adhesion is essentially a multi-scale phenomenon: at the smallest scale possible, it is defined by the thermodynamic work of adhesion. At larger scales, additional dissipative mechanisms may be active which results in enhanced adhesion at the macroscopic scale and are the main cause for the mode angle dependency of the interface toughness. Undoubtedly, the macroscopic adhesion properties are a complex function of all dissipation mechanisms across the scales. Thorough understanding of the significance of each of these dissipative mechanisms is of utmost importance in order to establish physically correct, unambiguous, values of the adhesion properties, which can only be achieved by proper multi-scale techniques. The topic “Advances in Delamination Modeling” has been split into two separate chapters: this chapter discusses the atomistic aspects of delamination, while the preceding chapter deals with the atomistic aspects of interface separation. The chapter starts with a concise overview of molecular simulation strategies. Next, examples are provided which represent actual materials being developed for electronic packaging: (1) the prediction of thermomechanical properties of an epoxy molding compound (EMC) and the adhesion properties of an EMC/copper interface by means of MD and CG MD approaches; (2) the modeling of wetting, adhesion, and reliability cycling of die attach and via fills; (3) model scaling to discrete element modeling (DEM) for understanding underfill flow; (4) CG modeling of an epoxy molding compound which relates to the first example; (5) molecular modeling of silicate layers used in planarization and encapsulant layers for flat panel displays; (6) mesoscale modeling of diffusion of organic bases which is of concern to photoresist poisoning; and (7) the prediction of thermomechanical properties of a low-k dielectric material, SiOC:H