Contaminants on Electrical Contacts Used in Semiconductor Device Testing

Electrical contacts used in semiconductor device testing are often deposited with a small pip of dark colour contaminants after being subjected to repeating cycles of impact loading. Samples of used electrical contacts are checked under SEM and EDX. It is discovered that the contaminants contain high percentage of tin elements. The reason as to why the contamination formed is investigated and it is found to be the result of material transfer from device lead. It is caused by the molten metal bridge formed when the contact begins to move apart

THEORETICAL ANALYSIS OF QUASI-STATIC COMPRESSION OF HEXAGONAL RING

This paper presents a study on the load-compression and energy absorption characteristics of a laterally crushed across faces of hexagonal ring with constraints on expansion perpendicular to the loading axis. The theoretical analysis in compression across faces is developed using Equivalent Structure Technique. Experimental observations are compared with theoretical analyses and good agreements are seen

Dynamic Axial Crushing Of Empty Hexagonal Tube

The experimental result of empty hexagonal tube subjected to dynamic loading is reported and compared with the previous researchers. The type and final mode of deformation is also studied and compared with FEA. Good agreement is obtained between FEA and experiments for both mean loud and plastic fold length. The dynamic mean load is about 1.5 times that of the quasi-static value

A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing

Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconductor device testing. As a result, significant drop of contact performance has been observed. This study intends to find out a theoretical explanation to the problem of tin deposition. As soon as the root cause is identified, studies go into the details of how to solve this problem. One of the economical suggestions is to apply lubricants on the contact. A theoretical calculation is derived to verify if the lubricant would significantly altered the overall resistance

Axial crushing of fiber filled thin tubes

The energy absorption capacity of a series of axially crushed tubes filled with oil palm fiber is compared with empty tube. This is to determine the viability of considering the use of such composites or bimaterials in transportation system especially in automotive application. The cross-sectional of tubes are square and rectangular in shape. The tubes arefilled with Empty Fruit Bunch (EFB)fibers and with Oil Palm Frond (OPF) fibers; and some of them were added with water or urea formaldehyde. The fibers densities are ranging from 150 kgm-3 to 300 kgm-3 . It was also found that the rectangular mild steel tubes filled with 300 kgm-3 Oil Palm Frond fiber was good in absorbing energy compared with others densities

THE FINITE ELEMENT ANALYSIS ON HEXAGONAL RING UNDER SIMPLE LATERAL LOADING

Lateral crushing of hexagonal ring under quasi-static loading were analysed using ABAQUS/Standard Finite Element (FE) Method package. The modes of deformation and loaddisplacement characteristics were predicted and the same were compared with experimental results. The material modelling of elastic-perfectly plastic and nominal stress-plastic strain were compared. The experimental results found that the quarter model using CPE6H with elastic-perfectly plastic material is good enough to obtain a satisfactory result

A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing

Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconductor device testing. As a result, significant drop of contact performance has been observed. This study intends to find out a theoretical explanation to the problem of tin deposition. As soon as the root cause is identified, studies go into the details of how to solve this problem. One of the economical suggestions is to apply lubricants on the contact. A theoretical calculation is derived to verify if the lubricant would significantly altered the overall resistance

Temperature effects on urea granules process to produce paddy fertilizer using top spray fluidized bed granulator

Temperature is often used in the convergence process chamber to control the level of humidity and the mass of granulated urea formation. However, the use of the expression of absolute temperature rarely investigated in urea granulation process but is limited in previous studies are often expressed as general reading. Therefore, this study was undertaken to determine an absolute temperature readings and its impact on urea granule. Features derived of urea granule diameter consist of 2 mm to 6 mm and hardness between 2.0 kg/grains to 4.0 kg/details. Experiments were conducted with the aid of experimental design, the One -Factor -At- A-Time (OFAT) as the initial method to determine the absolute temperature readings associated with the production of urea granule at optimum moisture and hardness. Granulation process was done experimentally using top spray fluidized bed granulator with fluidizing air profile and concentration of appropriate mechanisms commensurate with the size and hardness of the target. The information and data may be useful to study the optimization of the parameters as an inspection process and compare it with other variables to determine the optimal parameter used in the urea granulation process using Top Spray Fluidized Bedgranulator ( TSFBG )

Usage of Magnetorheological Damper in Active Front Bumper System for Frontal Impact Protection

In this paper, the effectiveness of the active bumper system to reduce the jerk of a vehicle during collision is discussed. The mathematical model is done by using MATLAB 7.0 to simulate a collision between a pendulum and a vehicle installed with the active bumper system. In the active bumper system, it consists of three parts which are magnetorheological(MR) model, inner controller and outer loop controller. The validated model is used to develop an inner loop controller by implementing a close-loop PI control to track the desired damping force through simulation. The governing equations of motions of vehicle collision and MR damper model are then integrated with the well known control strategy namely skyhook control. The performance of skyhook control is then compared with the vehicle with passive damper and common vehicle by using computer simulation in order to reduce the acceleration and the jerk of the vehicle during collision

The Finite Element Analysis On Hexagonal Ring Under Simple Lateral Loading

Lateral crushing of hexagonal ring under quasi-static loading were analysed using ABAQUS/Standard Finite Element (FE) Method package. The modes of deformation and load displacement characteristics were predicted and the same were compared with experimental results. The material modelling of elastic-perfectly plastic and nominal stress-plastic strain were compared.The experimental results found that the quarter model using CPE6H with elastic-perfectly plastic material is good enough to obtain a satisfactory result