26,166 research outputs found
Effect of external electric field on the charge density waves in one dimensional Hubbard superlattices
We have studied the ground state of the one dimensional Hubbard superlattice
structures with different unit cell sizes in the presence of electric field.
Self consistent Hartree-Fock approximation calculation is done in the weak to
intermediate interaction regime. Studying the charge gap at the Fermi level and
the charge density structure factor, we get an idea how the charge modulation
on the superlattice is governed by the competition between the electronic
correlation and the external electric field.Comment: 6 pages, 8 figures. accepted in Journal of Physics: Condensed Matte
Signature of strong atom-cavity interaction on critical coupling
We study a critically coupled cavity doped with resonant atoms with
metamaterial slabs as mirrors. We show how resonant atom-cavity interaction can
lead to a splitting of the critical coupling dip. The results are explained in
terms of the frequency and lifetime splitting of the coupled system.Comment: 8 pages, 5 figure
Pressureless sintered beta prime-Si3N4 solid solution: Fabrication, microstructure, and strength
Si3N4, AlN, and Al2O3 were used as basic constituents in a study of the pressureless sintering of beta prime-Si3N4 solid solution as a function of temperature. Y2O3-SiO2 additions were used to promote liquid-phase sintering. The sintered specimens were characterized with respect to density, microstructure, strength, oxidation, and thermal shock resistance. Density greater than 98 percent of theoretical was achieved by pressureless sintering at 1750 C. The microstructure consisted essentially of fine-grained beta prime-Si3N4 solid solution as the major phase. Modulus of rupture strengths up to 483 MPa were achieved at moderate temperature (1000 C), but decreased to 228 MPa at 1380 C. This substantial strength loss was attributed to a glassy grain boundary phase formed during cooling from the sintering temperature. The best oxidation resistance was exhibited by a composition containing 3 mol % Y2O3-SiO2 additives. Water quench thermal shock resistance was equivalent to that of reaction sintered silicon nitride but lower than hot-pressed silicon nitride
Ceramics in gas turbine: Powder and process characterization
Some of the intrinsic properties of various forms of Si3N4 and SiC are listed and limitations of such materials' availability are pointed out. The essential features/parameters to characterize a batch of powder are discussed including the standard techniques for such characterization. In process characterization, parameters in sintering, reaction sintering, and hot pressing processes are discussed including the factors responsible for strength limitations in ceramic bodies. Significant improvements in material properties can be achieved by reducing or eliminating the strength limiting factors with consistent powder and process characterization along with process control
State-of-the-art of SiAlON materials
Research presented includes work on phase relations, crystal structure, synthesis, fabrication, and properties of various SiAlONs. The essential features of compositions, fabrication methods, and microstructure are reviewed. High temperature flexure strength, creep, fracture toughness, oxidation, and thermal shock resistance are discussed. These data are compared to those for some currently produced silicon nitride ceramics to assess the potential SiAlON materials for use in advanced gas turbine engines
Laser assisted deposition
Applications of laser-based processing techniques to solar cell metallization are discussed. Laser-assisted thermal or photolytic maskless deposition from organometallic vapors or solutions may provide a viable alternative to photovoltaic metallization systems currently in use. High power, defocused excimer lasers may be used in conjunction with masks as an alternative to direct laser writing to provide higher throughput. Repeated pulsing with excimer lasers may eliminate the need for secondary plating techniques for metal film buildup. A comparison between the thermal and photochemical deposition processes is made
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