Stress-Induced Delamination Of Through Silicon Via Structures

Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Aerospace Engineerin

Linking horizontal and vertical transports of biomass fire emissions to the Tropical Atlantic Ozone Paradox during the Northern Hemisphere winter season: climatology

International audienceDuring the Northern hemisphere winter season, biomass burning is widespread in West Africa, yet the total tropospheric column ozone values (<30 DU) over much of the Tropical Atlantic Ocean (15° N?5° S) are relatively low. At the same time, the tropospheric column ozone values in the Southern Tropical Atlantic are higher than those in the Northern Hemisphere (ozone paradox). We examine the causes for low tropospheric column ozone values by considering the horizontal and vertical transport of biomass fire emissions in West Africa during November through March, using observed data which characterizes fires, aerosols, horizontal winds, precipitation, lightning and outgoing longwave radiation. We have found that easterly winds prevail in the lower troposphere but transition to westerly winds at pressure levels lower than 500 hPa. A persistent anticyclone over West Africa at 700 hPa is responsible for strong easterly winds, which causes a net outflow of ozone/ozone precursors from biomass burning in West Africa across the Atlantic Ocean towards South America. The lowest outgoing longwave radiation (OLR) and highest precipitation rates are generally found over the central Atlantic, some distance downstream of fires in West Africa making the vertical transport of ozone and ozone precursors less likely and ozone destruction more likely. However, lightning over land areas in Central Africa and South America can lead to enhanced ozone levels in the upper troposphere especially over the Southern tropical Atlantic during the Northern Hemisphere winter season

Space-borne observations link the tropical atlantic ozone maximum and paradox to lightning

International audienceThe potential enhancement of tropospheric column ozone values over the Tropical Atlantic Ocean on a seasonal basis by lightning is investigated using satellite derived ozone data, TRMM lightning data, ozonesonde data and NCEP reanalysis during 1998-2001. Our results show that the number of lightning flashes in Africa and South America reach a maximum during September, October and November (SON). The spatial patterns of winds in combination with lightning from West Africa, Central Africa and South America is likely responsible for enriching middle/upper troposphere ozone over the Tropical South Atlantic during SON. Moreover, lightning flashes are high in the hemisphere opposite to biomass burning during December, January, and February (DJF) and June, July and August (JJA). This pattern leads to an enrichment of ozone in the middle/upper troposphere in the Southern Hemisphere Tropics during DJF and the Northern Hemisphere Tropics during JJA. During JJA the largest numbers of lightning flashes are observed in West Africa, enriching tropospheric column ozone to the north of 5S in the absence of biomass burning. During DJF, lightning is concentrated in South America and Central Africa enriching tropospheric column ozone south of the Equator in the absence of biomass burning

Produce handling and processing practices.

In the past decade, outbreaks of human illness associated with the consumption of raw vegetables and fruits (or unpasteurized products produced from them) have increased in the United States. Changes in agronomic, harvesting, distribution, processing, and consumption patterns and practices have undoubtedly contributed to this increase. Pathogens such as Listeria monocytogenes, Clostridium botulinum, and Bacillus cereus are naturally present in some soil, and their presence on fresh produce is not rare. Salmonella, Escherichia coli O157:H7, Campylobacter jejuni, Vibrio cholerae, parasites, and viruses are more likely to contaminate fresh produce through vehicles such as raw or improperly composted manure, irrigation water containing untreated sewage, or contaminated wash water. Contact with mammals, reptiles, fowl, insects, and unpasteurized products of animal origin offers another avenue through which pathogens can access produce. Surfaces, including human hands, which come in contact with whole or cut produce represent potential points of contamination throughout the total system of growing, harvesting, packing, processing, shipping, and preparing produce for consumption. Treatment of produce with chlorinated water reduces populations of pathogenic and other microorganisms on fresh produce but cannot eliminate them. Reduction of risk for human illness associated with raw produce can be better achieved through controlling points of potential contamination in the field; during harvesting; during processing or distribution; or in retail markets, food-service facilities, or the home

Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Continual scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently threedimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effects of thermally induced stresses on interfacial reliability of TSV structures. First, three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results From finite element analysis (FEA). The stress analysis suggests interfacial delamination as a potential failure mechanism for the TSV structure. An analytical solution is then obtained for the steady-state energy release rate as the upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. With these results, the effects of the TSV dimensions (e.g., via diameter and wafer thickness) on the interfacial reliability are elucidated. Furthermore, the effects of via material properties are discussed.Aerospace Engineerin

COMPARISON OF KNEE JOINT MONENTS DURING ANTICIPATED AND UNANTICIPATED RUNNING AND CUTTING MANEUVER - A PILOT STUDY

INTRODUCTION: Knee joint injuries are common in sports activities. Because it is understood that non-contact ACL injuries most often occur during cutting or landing tasks, biomechanical studies have examined in lower extremity kinematics. Cutting maneuvers during sporting are not always anticipated, and usually occur as a sudden reaction to an external stimulus. Therefore, the purpose of this study was to compare the joint moments in the lower extremity of females during anticipated and unanticipated running and cutting manoeuvres

SPEAR Far Ultraviolet Spectral Images of the Cygnus Loop

We present far-ultraviolet (FUV) spectral images, measured at C IV 1550, He II 1640, Si IV+O IV] 1400, and O III] 1664, of the entire Cygnus Loop, observed with the Spectroscopy of Plasma Evolution from Astrophysical Radiation (SPEAR) instrument, also known as FIMS. The spatial distribution of FUV emission generally corresponds with a limb-brightened shell, and is similar to optical, radio and X-ray images. The features found in the present work include a ``carrot'', diffuse interior, and breakout features, which have not been seen in previous FUV studies. Shock velocities of 140-160 km/s is found from a line ratio of O IV] to O III], which is insensitive not only to resonance scattering but also to elemental abundance. The estimated velocity indicates that the fast shocks are widespread across the remnant. By comparing various line ratios with steady-state shock models, it is also shown that the resonance scattering is widespread.Comment: 13 pages, 3 figures, 1 table, accepted for publication in ApJ

Effective mass theory of monolayer \delta-doping in the high-density limit

Monolayer \delta-doped structures in silicon have attracted renewed interest with their recent incorporation into atomic-scale device fabrication strategies as source and drain electrodes and in-plane gates. Modeling the physics of \delta-doping at this scale proves challenging, however, due to the large computational overhead associated with ab initio and atomistic methods. Here, we develop an analytical theory based on an effective mass approximation. We specifically consider the Si:P materials system, and the limit of high donor density, which has been the subject of recent experiments. In this case, metallic behavior including screening tends to smooth out the local disorder potential associated with random dopant placement. While smooth potentials may be difficult to incorporate into microscopic, single-electron analyses, the problem is easily treated in the effective mass theory by means of a jellium approximation for the ionic charge. We then go beyond the analytic model, incorporating exchange and correlation effects within a simple numerical model. We argue that such an approach is appropriate for describing realistic, high-density, highly disordered devices, providing results comparable to density functional theory, but with greater intuitive appeal, and lower computational effort. We investigate valley coupling in these structures, finding that valley splitting in the low-lying \Gamma band grows much more quickly than the \Gamma-\Delta band splitting at high densities. We also find that many-body exchange and correlation corrections affect the valley splitting more strongly than they affect the band splitting