Applications of Heat Transfer Enhancement Techniques: A State-of-the-Art Review

The fundamentals of heat transfer and its applications, the classification of heat transfer technology and different heat transfer techniques, and the needs for augmentation and its benefits and the different combinations of two or more inserts and integral roughness elements for heat transfer augmentation purpose have been introduced and discussed in this chapter. It is shown that most of the compound techniques performed better than the individual inserts for heat transfer enhancement. This chapter has also been dedicated to understanding the basic concepts of vortex generators for heat transfer enhancement in plate-fin heat exchangers. The performance of transverse, longitudinal, and wing-type vortex generators has been discussed as well

FactoryBricks: a New Learning Platform for Smart Manufacturing Systems

Manufacturing industries are facing radical changes under the technological acceleration of Industry 4.0. The manufacturing workforce is not ready for such disruptions due to the lack of vertical skills on digital technologies. Production planning and control of manufacturing systems is often an experience-based art. Further, the companies need of offering training paths for long-life learning of their employees finds several obstacles in the availability of skilled trainers and the trainee’s low engagement with traditional learning models. This paper presents how the FactoryBricks project aims at overcoming the aforementioned issues. The project delivers effective training courses to enable the uptake of industrial technologies and smart manufacturing systems for professionals, either executives or technicians. Beside digital learning contents, the learners are offered an interaction with lab-scale models of production systems built with modular components such as LEGO®. The courses are designed in a modular way, and aim to teach manufacturing concepts in three main topics: (1) the physical system and its dynamics, (2) the physical-digital data connections for smart online analytics, and (3) the exploitation of digital models for production. The paper also presents the results of the prototypical implementation of the project

Cartoon representation and sequence alignment of <i>Vc</i>Hsp31 with other orthologs showing domain organisation and catalytic residues.

<p><b>(a)</b> Cartoon representation of the overall structure of <i>Vc</i>Hsp31 monomer where ‘A’ domain (green), ‘P’ domain (violet) and the ‘linker’ region (yellow) are indicated. The catalytic triad region comprising Cys188-His189-Asp216 (small red box) is zoomed for clarity; <b>(b)</b> Structure based sequence alignment of the three classes of Hsps taking two representative members from each class. Top of the alignment depicts their secondary structures and every twentieth residue of <i>Vc</i>Hsp31 is marked by a (|). At the bottom of the alignments, P domain segments and ‘linker region’ are indicated by colored bars. Catalytic residues are marked in red dots while residues conserved in all six proteins are in black dots.</p

Access of catalytic triad through two cavity pocket.

<p>(a) Residues involved in forming the two cavity pocket in <i>Ec</i>Hsp31. Cavity 1 and Cavity 2 are indicated by arrow; (b) Two cavity pocket in <i>Vc</i>Hsp31 in the same orientation to that of <i>Ec</i>Hsp31; (c) Superposition of residues forming the two cavity pocket in <i>Ec</i>Hsp31 and <i>Vc</i>Hsp31. Residues of <i>Vc</i>Hsp31 that differ in sequence or having structural alterations with <i>Ec</i>Hsp31 are only labeled; (d) Temperature dependence of amidopeptidase activity of <i>Vc</i>Hsp31 determined using Ala-AMC as substrate.</p

Interactions at the dimeric interface in Type-I and Type-II dimers.

<p>(a) Interactions at the A-B and C-D dimeric interface of <i>Vc</i>Hsp31. Two monomers are shown in yellow and brown and strong electrostatic interactions are shown in dashed line. (b) Electron density contoured at 1σ at the E-F dimeric interface showing that the salt bridge between K105 and E60 is abolished here (red label).</p

Interface area (Ų) and dimer types for different <i>Vc</i>Hsp31 crystals.

<p>Interface area (Ų) and dimer types for different <i>Vc</i>Hsp31 crystals.</p

B-factor plot of different dimers.

<p>(a) Temperature factor plot of Type-I dimers of <i>Vc</i>Hsp31^20C, B averages of chain A (red) and chain E (green) are plotted as representative (b) B averages of Type-II dimers of <i>Vc</i>Hsp31^25C are plotted with chains A (red), C (blue), E (green) as representative. Regions α4/β7/α5 and β4/β5 loop, that loose contact at the dimeric surface upon swinging motion in type-II dimer are shown by asterisk.</p

Type-I and Type-II dimer of <i>Vc</i>Hsp31.

<p>(a) Overall superposition of the dimers (viewing perpendicular to the bowl). Direction of swinging motion required to form Type-II dimer from Type-I dimer is shown by the flat arrow and the position of pivot point is shown in red triangle; (b) Disposition of ‘chain B’ and ‘chain F’ (viewing from top of the canyon) when ‘chain A’ and ‘chain E’ are superposed. Large displacements of helices are evident here; (c) Same superposition scheme as in Fig 5b but chain A is shown as surface (viewing same as Fig 5a) which shows poor packing of α4 for Type-II dimer with chain E (shown in surface) (d) A portion of buried dimeric surface in Type-I dimer which is being exposed (e) in Type-II dimers; (f) Tryptophan quenching of <i>Vc</i>Hsp31at low temperatures (18°-25°C).</p

Interactions at the interface of A-B and E-F dimer.

<p>Interactions at the interface of A-B and E-F dimer.</p