Constricted high enthalpy arc heater design and performance data, including calculations for a 10 MW design First interim technical report

Performance prediction and design analysis of constricted coaxial-flow arc air heaters for materials testing and atmospheric entry simulatio

Absorption Line Studies in the Halo

Significant progress has been made over the last few years to explore the gaseous halo of the Milky Way by way of absorption spectroscopy. I review recent results on absorption line studies in the halo using various instruments, such as the Far Ultraviolet Spectroscopic Explorer, the Space Telescope Imaging Spectrograph, and others. The new studies imply that the infall of low-metallicity gas, the interaction with the Magellanic Clouds, and the Galactic Fountain are responsible for the phenomenon of the intermediate- and high-velocity clouds in the halo. New measurements of highly-ionized gas in the vicinity of the Milky Way indicate that these clouds are embedded in a corona of hot gas that extends deep into the intergalactic space.Comment: 7 pages, 1 figure; Invited review at the conference "How does the Galaxy work ?", Granada/Spain, June 200

Heavily Irradiated N-in-p Thin Planar Pixel Sensors with and without Active Edges

We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\mathrm{\mu}$m, produced at MPP/HLL, and 100-200 $\mathrm{\mu}$m thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detectors. Results obtained with 150 $\mathrm{\mu}$m thin sensors, assembled with the new ATLAS FE-I4 chip and irradiated up to a fluence of 4$\times$10$^{15}\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$, show that they are excellent candidates for larger radii of the silicon pixel tracker in the upgrade of the ATLAS detector at HL-LHC. In addition, the active edge technology of the VTT devices maximizes the active area of the sensor and reduces the material budget to suit the requirements for the innermost layers. The edge pixel performance of VTT modules has been investigated at beam test experiments and the analysis after irradiation up to a fluence of 5$\times$10$^{15}\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ has been performed using radioactive sources in the laboratory.Comment: Proceedings for iWoRiD 2013 conference, submitted to JINS

Supersolidity, entropy and frustration

We study the properties of t-t'-V model of hard-core bosons on the triangular lattice that can be realized in optical lattices. By mapping to the spin-1/2 XXZ model in a field, we determine the phase diagram of the t-V model where the supersolid characterized by the ordering pattern (x,x,-2x') ("ferrimagnetic" or SS A) is a ground state for chemical potential \mu >3V. By turning on either temperature or t' at half-filling \mu =3V, we find a first order transition from SS A to the elusive supersolid characterized by the (x,-x,0) ordering pattern ("antiferromagnetic" or SS C). In addition, we find a large region where a superfluid phase becomes a solid upon raising temperature at fixed chemical potential. This is an analog of the Pomeranchuk effect driven by the large entropic effects associated with geometric frustration on the triangular lattice.Comment: 4 pages, igures, LaTe

Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of $10^{16}$ $\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons).Comment: 16 pages, 22 figure

Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC

The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses is studied, together with an investigation of a novel interconnection technique offered by the Fraunhofer Institute EMFT in Munich, the Solid-Liquid-InterDiffusion (SLID), which is an alternative to the standard solder bump-bonding. The pixel modules are based on thin n-in-p sensors, with an active thickness of 75 um or 150 um, produced at the MPI Semiconductor Laboratory (MPI HLL) and on 100 um thick sensors with active edges, fabricated at VTT, Finland. Hit efficiencies are derived from beam test data for thin devices irradiated up to a fluence of 4e15 neq/cm^2. For the active edge devices, the charge collection properties of the edge pixels before irradiation is discussed in detail, with respect to the inner ones, using measurements with radioactive sources. Beyond the active edge sensors, an additional ingredient needed to design four side buttable modules is the possibility of moving the wire bonding area from the chip surface facing the sensor to the backside, avoiding the implementation of the cantilever extruding beyond the sensor area. The feasibility of this process is under investigation with the FE-I3 SLID modules, where Inter Chip Vias are etched, employing an EMFT technology, with a cross section of 3 um x 10 um, at the positions of the original wire bonding pads.Comment: Proceedings for Pixel 2012 Conference, submitted to NIM A, 6 page

Background, current status, and prognosis of the ongoing slush hydrogen technology development program for the NASP

Among the Hydrogen Projects at the NASA Lewis Research Center (NASA LeRC), is the task of implementing and managing the Slush Hydrogen (SLH2) Technology Program for the United States' National AeroSpace Plane Joint Program Office (NASP JPO). The objectives of this NASA LeRC program are to provide verified numerical models of fluid production, storage, transfer, and feed systems and to provide verified design criteria for other engineered aspects of SLH2 systems germane to a NASP. The pursuit of these objectives is multidimensional, covers a range of problem areas, works these to different levels of depth, and takes advantage of the resources available in private industry, academia, and the U.S. Government. A summary of the NASA LeRC overall SLH2 program plan, is presented along with its implementation, the present level of effort in each of the program areas, some of the results already in hand, and the prognosis for the effort in the immediate future

Observed crustal uplift near the Southern Patagonian Icefield constrains improved viscoelastic Earth model

Thirty‒one GPS geodetic measurements of crustal uplift in southernmost South America determined extraordinarily high trend rates (> 35 mm/yr) in the north‒central part of the Southern Patagonian Icefield. These trends have a coherent pattern, motivating a refined viscoelastic glacial isostatic adjustment model to explain the observations. Two end‒member models provide good fits: both require a lithospheric thickness of 36.5 ± 5.3 km. However, one end‒member has a mantle viscosity near η =1.6 ×1018 Pa s and an ice collapse rate from the Little Ice Age (LIA) maximum comparable to a lowest recent estimate of 1995–2012 ice loss at about −11 Gt/yr. In contrast, the other end‒member has much larger viscosity: η = 8.0 ×1018 Pa s, half the post–LIA collapse rate, and a steadily rising loss rate in the twentieth century after AD 1943, reaching −25.9 Gt/yr during 1995–2012.Fil: Lange, H.. Technische Universitaet Dresden; AlemaniaFil: Casassa, G.. Centro de Estudios Cientificos; Chile. Universidad de Magallanes; ChileFil: Ivins, E. R.. Institute of Technology. Jet propulsion Laboratory; Estados UnidosFil: Schroeder, L.. Technische Universitaet Dresden; AlemaniaFil: Fritsche, M.. Technische Universitaet Dresden; AlemaniaFil: Richter, Andreas Jorg. Technische Universitaet Dresden; Alemania. Universidad Nacional de la Plata. Facultad de Ciencias Astronómicas y Geofísicas. Departamento de Astrometría; Argentina. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - La Plata; ArgentinaFil: Groh, A.. Technische Universitaet Dresden; AlemaniaFil: Dietrich, R.. Technische Universitaet Dresden; Alemani